Untitled
Abstract: No abstract text available
Text: DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] REVISION R DO NOT SCALE FROM THIS PRINT SCP2-17-XX-X-XX.XX-X-XX POSITIONS -32 PLATING -S: SELECTIVE GOLD USE BWL-01-32-24-X-XX.XX-S -F: FLASH SELECTIVE GOLD (USE BWL-01-32-24-X-XX.XX-F) END 1 OPTION * -S: SOCKET (NOT AVAILABLE
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SCP2-17-XX-X-XX
BWL-01-32-24-X-XX
SCP2-17-32-X-XX
OR-17-01
rprisevault\DWG\MISC\MKTG\SCP2-17-XX-X-XX
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Untitled
Abstract: No abstract text available
Text: SCP2-17-XX-X-XX.XX-X-XX REVISION M POSITIONS -32 PLATING -S: SELECTIVE GOLD USE BWL-01-32-24-X-XX.XX-S -F: FLASH SELECTIVE GOLD (USE BWL-01-32-24-X-XX.XX-F) DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] FIG. 1 END 1 OPTION -T: TERMINAL CABLE LENGTH * -XX.XX:
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SCP2-17-XX-X-XX
BWL-01-32-24-X-XX
SCP2-17-32-X-XX
OR-17-01
\DWG\MISC\MKTG\SCP2-17-XX-X-XX
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Untitled
Abstract: No abstract text available
Text: SCP2-17-XX-X-XX.XX-X-XX REVISION L POSITIONS -32 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] PLATING -S: SELECTIVE GOLD USE BWL-01-32-24-X-XX.XX-S -F: FLASH SELECTIVE GOLD (USE BWL-01-32-24-X-XX.XX-F) L FIG. 1 L ASSEMBLED LENGTH: XX.XX + "B" (SEE TABLE 1)
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SCP2-17-XX-X-XX
BWL-01-32-24-X-XX
SCP2-17-32-X-XX
OR-17-01
\DWG\MISC\MKTG\SCP2-17-XX-X-XX
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Untitled
Abstract: No abstract text available
Text: SCPU-17-X-XX.XX-XXX-XXX REVISION N N PRODUCT MANUFACTURED Pb THIS WITH LEAD-FREE PROCESSING PLATING -G: .000030" GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTIONS -AMS: SEALED USB A USB A END SEALED ONLY (SEE SHEETS 1-3 & 11) -BMS: SEALED USB B (USB B END SEALED ONLY)
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SCPU-17-X-XX
SCRUS-10-X-XXX-XXX-XX
\DWG\MISC\MKTG\SCPU-17-X-XX
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Untitled
Abstract: No abstract text available
Text: SCPU-17-X-XX.XX-XXX-XXX REVISION V PLATING -G: .000030" GOLD ON CONTACT AREAS, NICKEL ON SHELLS DO NOT SCALE FROM THIS PRINT END 1 END 2 OPTIONS -AMS: SEALED USB A USB A END SEALED ONLY (SEE SHEETS 1-3 & 11) -BMS: SEALED USB B DESIGNED & DIMENSIONED (USB B END SEALED ONLY)
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SCPU-17-X-XX
SCPU-17-G-XX
MUSBS-05-B-N-01)
MUSBS-05-B-N-01
\dwg\misc\mktg\SCPU-17-X-XX
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Untitled
Abstract: No abstract text available
Text: SCPU-17-X-XX.XX-XXX-XXX REVISION R PRODUCT MANUFACTURED Pb THIS WITH LEAD-FREE PROCESSING END 1 DO NOT SCALE FROM THIS PRINT PLATING -G: .000030" GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTIONS -AMS: SEALED USB A USB A END SEALED ONLY (SEE SHEETS 1-3 & 11)
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SCPU-17-X-XX
SCPU-17-G-XX
MUSBS-05-B-N-01)
MUSBS-05-B-N-01
\DWG\MISC\MKTG\SCPU-17-X-XX
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Untitled
Abstract: No abstract text available
Text: SCPU-17-X-XX.XX-XXX-XXX REVISION Y PLATING -G: .000030" GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 1 DO NOT SCALE FROM THIS PRINT END 2 OPTIONS -AMS: SEALED USB A USB A END SEALED ONLY (SEE SHEETS 1-3 & 11) -BMS: SEALED USB B DESIGNED & DIMENSIONED (USB B END SEALED ONLY)
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SCPU-17-X-XX
SCPU-17-G-XX
MUSBS-05-B-N-01)
MUSBS-05-B-N-01
SUB-MUSBP-05-B-G-C)
MUSBS-05-B-N-02)
\DWG\MISC\MKTG\SCPU-17-X-XX
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Untitled
Abstract: No abstract text available
Text: REVISION K RPCU-X-XX.XX-XXX-XX DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] PLATING SPECIFICATION END 2 OPTION -AM: USB A NOT SEALED USB A END NOT SEALED ONLY (SEE SHEET 1, FIG 1) -BC: BLUNT CUT (SEE SHEET 3, FIG 2) -BM: USB B NOT SEALED (USB B END NOT SEALED ONLY &
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transistor BC 945
Abstract: M17/194-00001 M17/113-RG316 M17/133-00001 M17/94-RG179 M17/127 RG393 rg79 M17/75-RG214 67-RG177 MIL-C-17 rg214
Text: M17/MIL-C-17 Coaxial Cable Database M17 M17 RG M17 TMS Conductor Dielectric Shields Jacket Armor Weight Impedance Velocity of Capacitance Max Oper. Temperature Operating Attenuation Notes and Part Spec Type QPL P/N inches inches inches inches inches lbs/foot
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M17/MIL-C-17
M17/2-RG6
AA-3810
M17/6-RG11
AA-3812
AA-3395
AA-8072
M17/220-00001
M17/219-00001
M17/218-00002
transistor BC 945
M17/194-00001
M17/113-RG316
M17/133-00001
M17/94-RG179
M17/127 RG393
rg79
M17/75-RG214
67-RG177
MIL-C-17 rg214
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Untitled
Abstract: No abstract text available
Text: COVER DATA SHEET 2GB Unbuffered DDR3L SDRAM DIMM EBJ20EF8EDWA 256M words 72 bits, 1 Rank Specifications Features • Density: 2GB • Organization — 256M words 72 bits, 1 rank • Mounting 9 pieces of 2G bits DDR3L SDRAM sealed in FBGA • Package: 240-pin socket type dual in-line memory
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EBJ20EF8EDWA
240-pin
1600Mbps/1333Mbps
M01E1007
E1862E20
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Untitled
Abstract: No abstract text available
Text: COVER PRELIMINARY DATA SHEET 4GB DDR3L SDRAM SO-DIMM EBJ40EG8EFUA 512M words 72 bits, 1 Rank Specifications Features • Density: 4GB • Organization — 512M words 72 bits, 1 rank • Mounting 9 pieces of 4G bits DDR3L SDRAM sealed in FBGA • Package: 204-pin socket type small outline dual in-line
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EBJ40EG8EFUA
204-pin
1600Mbps
1333Mbps/1066Mbps
/800Mbps/667Mbps
M01E1007
E1979E10
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Untitled
Abstract: No abstract text available
Text: COVER PRELIMINARY DATA SHEET 4GB Unbuffered DDR3L SDRAM DIMM EBJ40EG8EFWA 512M words 72 bits, 1 Rank Specifications Features • Density: 4GB • Organization — 512M words 72 bits, 1 rank • Mounting 9 pieces of 4G bits DDR3L SDRAM sealed in FBGA
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EBJ40EG8EFWA
240-pin
1600Mbps/1333Mbps
M01E1007
E1952E10
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Untitled
Abstract: No abstract text available
Text: COVER DATA SHEET 4GB Unbuffered DDR3 SDRAM DIMM EBJ40EG8BFWB 512M words x 72 bits, 1 Rank Specifications Features • Density: 4GB • Organization — 512M words × 72 bits, 1 rank • Mounting 9 pieces of 4G bits DDR3 SDRAM sealed in FBGA • Package: 240-pin socket type dual in-line memory
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EBJ40EG8BFWB
240-pin
1866Mbps/1600Mbps/1333Mbps
M01E1007
E1977E30
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Untitled
Abstract: No abstract text available
Text: COVER PRELIMINARY DATA SHEET 4GB Unbuffered DDR3 SDRAM DIMM EBJ40EG8BFWA 512M words 72 bits, 1 Rank Specifications Features • Density: 4GB • Organization — 512M words 72 bits, 1 rank • Mounting 9 pieces of 4G bits DDR3 SDRAM sealed in FBGA
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EBJ40EG8BFWA
240-pin
1866Mbps/1600Mbps/1333Mbps
M01E1007
E1951E10
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LM 3919
Abstract: No abstract text available
Text: LED HIGH POWER CoB Product Series LED HIGH POWER CoB Product Series Data Sheet Created Date: 02 / 06 / 2013 Revision: 2.0, 05 / 21/ 2013 1 BNC-OD-C131/A4 Created Date : 05/26/2007 Revison : 1.01, 05/26/2008 LED HIGH POWER CoB Product Series 1. Description
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BNC-OD-C131/A4
LM 3919
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Untitled
Abstract: No abstract text available
Text: REVISION M SCPU-17-X-XX.XX-XXX-XXX PLATING -G: .000030" GOLD ON CONTACT AREAS, NICKEL ON SHELLS DO NOT SCALE FROM THIS PRINT PRODUCT MANUFACTURED Pb THIS WITH LEAD-FREE PROCESSING DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] LENGTH -XX.XX "A", SEE TABLE 1
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SCPU-17-X-XX
SCPU-17-G-XX
SCN-17-01
\dwg\misc\mktg\SCPU-17-X-XX
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MT9JSF25672AZ
Abstract: No abstract text available
Text: 1GB, 2GB x72, ECC, SR 240-Pin DDR3 UDIMM Features DDR3 SDRAM UDIMM MT9JSF12872AZ – 1GB MT9JSF25672AZ – 2GB Features Figure 1: 240-Pin UDIMM (MO-269 R/C D1) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, unbuffered dual in-line memory module
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240-Pin
MT9JSF12872AZ
MT9JSF25672AZ
240-pin,
PC3-12800,
PC3-10600,
PC3-8500,
PC3-6400
09005aef8360c8e6
jsf9c128
MT9JSF25672AZ
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DDR4
Abstract: DDR4 DIMM SPD JEDEC MTA9ASF51272AZ-2G1A1 DDR4 jedec micron ddr4 MO-309 DDR4-2133 MTA9ASF51272AZ MTA9ASF51272AZ-2G4 MT40A512M8
Text: 4GB x72, ECC, SR 284-Pin DDR4 UDIMM Features DDR4 SDRAM UDIMM MTA9ASF51272AZ – 4GB Features Figure 1: 284-Pin UDIMM (MO-309. R/C D) Module height: 31.25mm (1.23in) • DDR4 functionality and operations supported as defined in the component data sheet • 284-pin, unbuffered dual in-line memory module
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284-Pin
MTA9ASF51272AZ
284-pin,
PC4-2400,
PC4-2133,
PC4-1866
512Meg
125mV
09005aef8519d7ca
asf9c512x72az
DDR4
DDR4 DIMM SPD JEDEC
MTA9ASF51272AZ-2G1A1
DDR4 jedec
micron ddr4
MO-309
DDR4-2133
MTA9ASF51272AZ
MTA9ASF51272AZ-2G4
MT40A512M8
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"dj ac"
Abstract: EBJ51ED8BAFA-8A-E EDJ5308BASE transistor BC 945
Text: PRELIMINARY DATA SHEET 512MB Unbuffered DDR3 SDRAM DIMM EBJ51ED8CAFA, EBJ51ED8BAFA 64M words x 72 bits, 1 Rank Specifications Features • Density: 512MB • Organization 64M words × 72 bits, 1 rank • Mounting 9 pieces of 512M bits DDR3 SDRAM sealed in FBGA
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512MB
EBJ51ED8CAFA,
EBJ51ED8BAFA
512MB
240-pin
1333Mbps/1066Mbps/800Mbps
M01E0706
E1006E20
"dj ac"
EBJ51ED8BAFA-8A-E
EDJ5308BASE
transistor BC 945
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Untitled
Abstract: No abstract text available
Text: REVISION G DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] RPCU-X-XX.XX-XXX-XX PLATING SPECIFICATION -G: .000030 GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTION -AM: USB A NOT SEALED USB A END NOT SEALED ONLY (SEE SHEET 1, FIG 1) -BC: BLUNT CUT (SEE SHEET 3, FIG 2)
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Untitled
Abstract: No abstract text available
Text: REVISION F DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] RPCU-X-XX.XX-XXX-XX PLATING SPECIFICATION -G: .000030 GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTION -AM: USB A NOT SEALED USB A END NOT SEALED ONLY (SEE SHEET 1, FIG 1) -BC: BLUNT CUT (SEE SHEET 3, FIG 2)
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td2002c
Abstract: No abstract text available
Text: bq2002C NiCd/NiMH Fast-Charge Management IC Features General Description ➤ The bq2002C Fast-Charge IC is a lowcost CMOS battery-charge controller providing reliable charge termination for both NiCd and NiMH battery applications. Controlling a current-limited
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bq2002C
td2002c
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Untitled
Abstract: No abstract text available
Text: REVISION C DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] RPCU-X-XX.XX-XXX-XX PLATING SPECIFICATION -G: .000030 GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTION -AM: USB A NOT SEALED USB A END NOT SEALED ONLY (SEE SHEET 1, FIG 1) -BC: BLUNT CUT (SEE SHEET 3, FIG 2)
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Untitled
Abstract: No abstract text available
Text: REVISION E DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] DO NOT SCALE FROM THIS PRINT RPCU-X-XX.XX-XXX-XX PLATING SPECIFICATION -G: .000030 GOLD ON CONTACT AREAS, NICKEL ON SHELLS END 2 OPTION -AM: USB A NOT SEALED USB A END NOT SEALED ONLY (SEE SHEET 1, FIG 1)
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