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Rochester Electronics LLC BD82HM70-S-JTNV BD82HM70 - MOBILE INTEL HM70 EXP
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	BD82HM70-S-JTNV	Bulk			15	1 - 10 - 100 $20.57 1000 $20.57 10000 $20.57	Buy Now
Intel Corporation BD82HM55 S LGZS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Bristol Electronics	BD82HM55 S LGZS		366			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Intel Corporation BD82HM55 SLGZS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Bristol Electronics	BD82HM55 SLGZS		171			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Intel Corporation BD82HM555SLGZS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Bristol Electronics	BD82HM555SLGZS		112			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Intel Corporation BD82HM75 SLJ8F
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Bristol Electronics	BD82HM75 SLJ8F		100			1 - 10 - 100 - 1000 - 10000 -	Get Quote

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BD82HM Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
U3405 Abstract: No abstract text available Text: w .c ong COM Express Basic Module ate c.co m conga-BE57 Maximum Computing Performance Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout Processor Intel® Core™ i7-610E, 2.53 GHz (32 nm process, 4MB cache, 1066 MHz, TDP 25 W, BGA package)	Original	conga-BE57 i7-610E, i7-620LE, P4505 U3405	PDF
ASM1442 Abstract: bd82hm55 SMSC mec1308 mec1308 Intel hm55 JLCD500 HM55 CRB smsc mec1308-nu LTST-C193TBKT-AC N11X-GE1 Text: - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization - 8. Block Diagram and Schematic D C B A 4 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL	Original	BREMEN-15C/17C BREMEN-15C/17C BA41-xxxxxA 100nF C1114 ASM1442 bd82hm55 SMSC mec1308 mec1308 Intel hm55 JLCD500 HM55 CRB smsc mec1308-nu LTST-C193TBKT-AC N11X-GE1	PDF
BD82HM76 Abstract: No abstract text available Text: Platform brief Intel Core i7 and Core™ i5 Processors with Mobile Intel® HM76 and QM77 Express Chipsets Intelligent Systems 3rd Generation Intel® Core™ i7 and Intel® Core™ i5 Processor-based Platforms for Intelligent Systems Ideal for Intelligent Systems—context-aware, securely managed embedded devices that connect seamlessly	Original	0512/KSC/OCG/XX/PDF 327130-002US BD82HM76	PDF
Untitled Abstract: No abstract text available Text: w .c ong COM Express Basic Type 6 Module ate c.co m conga-TM67 Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type 6 Connector Layout COM Express Type 6 CPU Intel® Core™ i7-2710QE, (4 x 2.1GHz, 8 Threads, 6 MB cache, 1600 MT/s, TDP 45 W, PGA package)	Original	i7-2710QE, i5-2510E i3-2330E TDP35	PDF
Untitled Abstract: No abstract text available Text: ate c.co m conga-BS67 High Performance COM Express Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-2655LE, 2.20 GHz, (32 nm process, 4MB cache, 1333 MHz, TDP 25 W) Intel® Core™ i7-2610UE, 1.50 GHz, (32 nm process, 4MB cache, TDP 17 W)	Original	conga-BS67 i7-2655LE, i7-2610UE, i3-2340UE,	PDF
Untitled Abstract: No abstract text available Text: w .c ong COM Express Basic Type 6 Module ate c.co m conga-TS67 Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type 6 Connector Layout COM Express Type 6 CPU I I I I I I I Based on 2nd Generation Intel® Core™ lowpower processors Soldered CPUs for higher shock resistance	Original	1600MTs) BD82QM67 BD82HM65 STM32 82579LM	PDF
BD82HM55 Abstract: No abstract text available Text: COM Express Basic Module c.co m conga-BM57 Maximum Computing Performance Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-620M, 2.66 GHz (32 nm process, 4MB cache, 1066 MHz, TDP 35 W, PGA package) Intel® Core™ i5-520M, 2.4 GHz (32 nm process, 3MB cache, 1066 MHz, TDP 35 W, PGA package)	Original	conga-BM57 i7-620M, i5-520M, P4500, TDP35 BD82HM55	PDF
FCBGA989 Abstract: FCBGA1023 BD82HM65 FCPGA988 CPU Intel Core i5-6500TE FCBGA-989 Text: Platform brief Intel Core i7, Core™ i5, and Core™ i3 processors with Intel® QM67 Express and Intel® HM65 Express Chipsets Embedded Computing 2nd Generation Intel® Core™ i7 2710QE, 2715QE, 2655LE, 2610UE , Intel® Core™ i5 (2510E, 2515E), and Intel® Core™ i3 (2310E) Processor-based	Original	2710QE, 2715QE, 2655LE, 2610UE) 2510E, 2515E) 2310E) 0111/KSC/OCG/XX/PDF 324537-003US FCBGA989 FCBGA1023 BD82HM65 FCPGA988 CPU Intel Core i5-6500TE FCBGA-989	PDF
Untitled Abstract: No abstract text available Text: ww w .c ong ate High Performance COM Express c.co m Dramatically Increased Graphics Performance Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-2710QE (SV), 2,1 GHz (32 nm process, 6MB cache, 1333 MHz, TDP 45 W, 989 rPGA package)	Original	i7-2710QE -2510E i3-2330E, STM32 conga-BM67/CSP-HP-B conga-BM67/i3-2330E conga-BM67/B810 conga-BM67/CSP-HP-T 82579LM	PDF
Untitled Abstract: No abstract text available Text: ong COM Express Basic Type 6 Module ate c.co m conga-TS77 Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type 6 Connector Layout CPU Intel® Core™ i7-3615QE (4x 2.3 GHz, 6MB Cache, TDP 45W) Intel® Core™ i7-3612QE (4x 2.1 GHz, 6MB Cache, TDP 35W)	Original	conga-TS77 i7-3615QE i7-3612QE i7-3555LE i7-3517UE i5-3610ME i3-3120ME i3-3217UE 1020E DDR3-SODIMM-1600	PDF