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    BGA 176 BALL PACKAGE Search Results

    BGA 176 BALL PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions

    BGA 176 BALL PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    BGA 176 ball package datasheet

    Abstract: BGA 176 ball package BGA 176 datasheet BGA176
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC To Top / Package Lineup / Package Index BGA-176P-M01 176-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 14 Sealing method Plastic mold BGA-176P-M01 176-pin plastic FBGA (BGA-176P-M01)


    Original     		BGA-176P-M01 176-pin BGA-176P-M01) B176001S-1C-1 BGA 176 ball package datasheet BGA 176 ball package BGA 176 datasheet BGA176 PDF

    BGA-176P-M02

    Abstract: 176-PIN BGA 176 ball package datasheet BGA 176 ball package 176pin
    Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC BGA-176P-M02 176-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 14 Sealing method Plastic mold BGA-176P-M02 176-pin plastic FBGA (BGA-176P-M02) 12.00±0.10(.472±.004)SQ


    Original     		BGA-176P-M02 176-pin BGA-176P-M02) B176002S-1C-1 BGA-176P-M02 BGA 176 ball package datasheet BGA 176 ball package 176pin PDF

    BGA 256 PACKAGE power dissipation

    Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
    Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced


    Original     		00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432 PDF

    bga 1296

    Abstract: XC2V80 LVDSEXT25 BLVDS-25 LVDSEXT-25
    Text: XILINX FPGA PACKAGE OPTIONS AND USER I/O Pins Body Size I/O’s 88 120 200 264 432 528 624 720 912 1104 1296 176 176 284 316 404 512 660 724 804 804 804 404 556 XC2S200 XC2S150 XC2S100 XC2S50 XC2S30 Spartan-II 2.5V XC2S15 XC2S300E XC2S200E XC2S150E XC2S100E


    Original     		XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 XC2V250 XC2V500 XCV100E bga 1296 XC2V80 LVDSEXT25 BLVDS-25 LVDSEXT-25 PDF

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13 PDF

    fcBGA PACKAGE thermal resistance

    Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
    Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America


    Original     		PDF

    nec 44 pin LQFP

    Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
    Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)


    Original     		S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages PDF

    35 x 35 PBGA, 580 100 balls

    Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
    Text: NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and record-breaking size reduction each time a new product is released. To kindle consumers’ interest,


    Original     		PDF

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog" PDF

    BGA-56 DATASHEET

    Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
    Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3


    Original     		PDF

    CCGA

    Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
    Text: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:


    Original     		PDF

    SF-BGA176A-B-11

    Abstract: BGA176
    Text: D Package Code: BGA176A C 21.59mm [0.850"] See BGA pattern code to the right for actual pattern layout Y 15.24mm [0.600"] X Top View reference only 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"] B 1


    Original     		BGA176A 18X13 SF-BGA176A-B-11 BGA176 PDF

    BGA 328

    Abstract: No abstract text available
    Text: u Chapter 8 Tape and Reel CHAPTER 8 TAPE AND REEL Introduction Design and Materials Device Count per Reel Reel Dimensions and Labels Tape Dimensions Packages and Packing Publication Revision A 3/1/03 8-1 u Chapter 8 Tape and Reel INTRODUCTION AMD offers a tape-and-reel packing container for PLCC, SOIC,


    Original     		44-Lead 48-Lead 80-Lead BGA 328 PDF

    CE51484

    Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
    Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.


    Original     		CG/CE46 CG/CE51 S-19176 ASIC-TB-20033-9/95 CE51484 micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576 PDF

    f6 diode

    Abstract: P352 transistor 6c transistor h9 BGA 176 ball package 256-pin BGA BGA 176 ball package datasheet bga 208 PACKAGE
    Text: : Available, : Under development Ceramic PGA I-Lead Type Classification Lead Pitch (mm) Pin Counts 288 528 Cavity Up 1.27 Cavity Down Plastic BGA Classification Ball Pitch (mm) Pin Counts 119 153 225 256 272 313 352 420 1.27 Cavity Up 1.5 Cavity Down 1.27


    Original     		X288R-50A-1 S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 f6 diode P352 transistor 6c transistor h9 BGA 176 ball package 256-pin BGA BGA 176 ball package datasheet bga 208 PACKAGE PDF

    Untitled

    Abstract: No abstract text available
    Text: TM Flip-Top BGA Sockets Features: • Designed to save space on new and existing PC boards in test, development, programming and production applications. • No external hold-downs or soldering of BGA device required. • AIC exclusive solder ball terminals


    Original     		CAT16-PREVIEW06 PDF

    frg 200

    Abstract: No abstract text available
    Text: TM Flip-Top BGA Sockets Features: • Designed to save space on new and existing PC boards in test, development, programming and production applications. • No external hold-downs or soldering of BGA device required. • AIC exclusive solder ball terminals


    Original     		PDF

    crystal 447

    Abstract: No abstract text available
    Text: TM Flip-Top BGA Sockets Features: • Designed to save space on new and existing PC boards in test, development, programming and production applications. • No external hold-downs or soldering of BGA device required. • AIC exclusive solder ball terminals


    Original     		PDF

    12x12 bga thermal resistance

    Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
    Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE


    Original     		SZZA005 thoseI1450 12x12 bga thermal resistance SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack PDF

    im4a3-64

    Abstract: lattice im4a3 im4a3 im4a3-128 im4a3-192 lfe3-35ea IM4A3-256 iM4A3-384 LFXP2-8E lfe3-70ea
    Text: Lattice Socket Adapter Listing Rev 4.30 Socket Adapters are the interface between programming hardware such as the Lattice Model 300 desktop programmer , and Lattice programmable devices. This document shows which Lattice Socket Adapters support which Lattice programmable products. Lattice Socket Adapters are


    Original     		28-pin im4a3-64 lattice im4a3 im4a3 im4a3-128 im4a3-192 lfe3-35ea IM4A3-256 iM4A3-384 LFXP2-8E lfe3-70ea PDF

    BGA reflow guide

    Abstract: No abstract text available
    Text: TM Flip-Top BGA Sockets TM Flip-Top BGA Sockets 1.27mm and 1.00mm Pitch Table of Models Description: Socket FRG, 1.27mm pitch Guide Box and Base Mat’l: High Temp. Liquid Crystal Polymer (LCP) Index: -40°C to 260°C (-40°F to 500°F) Description: Socket (FRH, 1.00mm pitch)


    Original     		PDF

    BGA reflow guide

    Abstract: C17200
    Text: TM Flip-Top BGA Sockets TM Flip-Top BGA Sockets 1.27mm and 1.00mm Pitch Table of Models Description: Socket FRG, 1.27mm pitch Guide Box and Base Mat’l: High Temp. Liquid Crystal Polymer (LCP) Index: -40°C to 260°C (-40°F to 500°F) Description: Socket (FRH, 1.00mm pitch)


    Original     		PDF

    BGA and QFP Package mounting

    Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
    Text: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,


    Original     		PDF

    diagrams hitachi ecu

    Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog" PDF