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    BGA 196 LAND PATTERN Search Results

    BGA 196 LAND PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions

    BGA 196 LAND PATTERN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    14X14

    Abstract: SF-BGA196D-B-11 pitch 0.4mm BGA
    Text: C Package Code: BGA196D D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 13.50mm [0.531"] 0.50mm [0.020"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"]


    Original     		BGA196D FR4/G10 14X14 SF-BGA196D-B-11 14X14 pitch 0.4mm BGA PDF

    bga 196 land pattern

    Abstract: 0.4mm pitch BGA BGA Package 14x14 1mm pitch BGA 14X14 1mm pitch BGA SF-BGA196C-B-11 14X14 pitch 0.4mm BGA BGA Solder Ball 1mm
    Text: C Package Code: BGA196C D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 13.00mm [0.512"] X Top View (reference only) 1.00mm pitch typ. 0.53mm [0.021"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]


    Original     		BGA196C FR4/G10 14X14 SF-BGA196C-B-11 bga 196 land pattern 0.4mm pitch BGA BGA Package 14x14 1mm pitch BGA 14X14 1mm pitch BGA 14X14 pitch 0.4mm BGA BGA Solder Ball 1mm PDF

    SF-BGA196A-B-11

    Abstract: BGA196A
    Text: D Package Code: BGA196A C 16.51mm [0.650"] See BGA pattern code to the right for actual pattern layout Y 1.91mm [0.075"] 0.76mm [0.030"] 16.51mm [0.650"] X Top View reference only 1.91mm [0.075"] 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		BGA196A SF-BGA196A-B-11 BGA196A PDF

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432 PDF

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001 PDF

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


    Original     		SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket PDF

    LS-BGA196E-61

    Abstract: No abstract text available
    Text: Top View 0.8mm [0.031"] 12mm [0.472"] 0.8mm [0.031"] 0.8mm typ. 12mm [0.472"] 10.4mm square 1 3.52mm [0.139"] 1.68mm [0.066"] 2 0.2mm dia. [0.008"] Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non clad


    Original     		FR4/G10 14x14 LS-BGA196E-61 PDF

    LS-BGA196G-41

    Abstract: No abstract text available
    Text: 17.00mm [0.669"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 17.00mm [0.669"] Top View 1 3.76mm [0.148"] 1.68mm [0.066"] Side View Ø 0.20mm [0.008"] ±0.0005" 2 15.00mm [0.591"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		FR4/G10 16x16 LS-BGA196G-41 PDF

    LS-BGA196D-41

    Abstract: No abstract text available
    Text: 17.00mm [0.669"] 2.00mm [0.079"] 2.00mm [0.079"] 1.00mm typ. 17.00mm [0.669"] Top View 1 Side View 3.76mm [0.148"] 1.68mm [0.066"] 2 Ø 0.20mm [0.008"] ±0.0005" 13.00mm [0.512"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		FR4/G10 14x14 LS-BGA196D-41 PDF

    LS-BGA196F-41

    Abstract: No abstract text available
    Text: 23.00mm [0.906"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 23.00mm [0.906"] Top View 1 Side View 3.76mm [0.148"] 1.68mm [0.066"] Ø 0.20mm [0.008"] ±0.0005" 2 21.00mm [0.827"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		FR4/G10 20x20 LS-BGA196F-41 PDF

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


    Original     		XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01 PDF

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    PCB design for very fine pitch csp package

    Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A PDF

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 PDF

    PA-PGA181-02W

    Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
    Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for


    Original     		12X12mm. FR4/G10 PA-PGA181-02W PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01 PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    SF-BGA196J-B-05F

    Abstract: bga 196 land pattern
    Text: RoHS COMPLIANT 20.725mm [0.816"] 2.50mm [0.098"] 3.04mm [0.120"] 10.40mm [0.409"] 2.50mm [0.098"] 2.54mm [0.100"] 2.66mm [0.105"] Top View 10.40mm [0.409"] 20.725mm [0.816"] 15.725mm [0.619"] 5.08mm [0.200"] 0.80mm typ. Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		725mm FR4/G10 SF-BGA196J-B-05F bga 196 land pattern PDF

    SF-BGA196E-B-05

    Abstract: bga 196 land pattern
    Text: 19.725mm [0.777"] 2.50mm [0.098"] 2.54mm [0.100"] 10.40mm [0.409"] 2.50mm [0.098"] 2.16mm [0.085"] Top View 2.54mm [0.100"] A1 10.40mm [0.409"] 19.725mm [0.777"] 14.725mm [0.580"] 0.80mm typ. [0.031"] 5.08mm [0.200"] Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		725mm 025mm FR4/G10 Sn63Pb37 SF-BGA196E-B-05 bga 196 land pattern PDF

    land pattern BGA 196

    Abstract: SF-BGA196E-B-05F bga 196 land pattern
    Text: RoHS COMPLIANT 19.725mm [0.777"] 2.50mm [0.098"] 2.54mm [0.100"] 10.40mm [0.409"] 2.50mm [0.098"] 2.16mm [0.085"] 2.54mm [0.100"] A1 Top View 10.40mm [0.409"] 19.725mm [0.777"] 14.725mm [0.580"] 5.08mm [0.200"] 0.80mm typ. Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		725mm FR4/G10 SF-BGA196E-B-05F land pattern BGA 196 bga 196 land pattern PDF

    SF-BGA196C-B-05F

    Abstract: No abstract text available
    Text: RoHS COMPLIANT 22.725mm [0.895"] 2.50mm [0.098"] 13.00mm [0.512"] 2.50mm [0.098"] 2.54mm [0.100"] 2.74mm [0.108"] 2.36mm [0.093"] 22.725mm [0.895"] 13.00mm [0.512"] 17.725mm [0.698"] 1.00mm typ. [0.039"] 5.08mm [0.200"] Top View 0-80 Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		725mm FR4/G10 SF-BGA196C-B-05F PDF

    SF-BGA196C-B-05

    Abstract: bga 196 land pattern
    Text: 22.725mm [0.895"] 2.50mm [0.098"] 13.00mm [0.512"] 2.50mm [0.098"] 2.54mm [0.100"] 2.74mm [0.108"] 2.36mm [0.093"] 22.725mm [0.895"] 13.00mm [0.512"] 17.725mm [0.698"] 1.00mm typ. [0.039"] 5.08mm [0.200"] Top View 0-80 Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		725mm FR4/G10 Sn63Pb37 SF-BGA196C-B-05 bga 196 land pattern PDF

    SF-BGA196J-B-05

    Abstract: 0619
    Text: 20.725mm [0.816"] 2.50mm [0.098"] 3.04mm [0.120"] 10.40mm [0.409"] 2.50mm [0.098"] 2.54mm [0.100"] 2.66mm [0.105"] Top View 10.40mm [0.409"] 20.725mm [0.816"] 15.725mm [0.619"] 0.80mm typ. [0.031"] 5.08mm [0.200"] Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		725mm FR4/G10 Sn63Pb37 SF-BGA196J-B-05 0619 PDF

    12x12 bga thermal resistance

    Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
    Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE


    Original     		SZZA005 thoseI1450 12x12 bga thermal resistance SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack PDF

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256 PDF