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    BGA 27X27 Search Results

    BGA 27X27 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    BGA 27X27 Price and Stock

    Fischer Elektronik GmbH & Co KG ICK BGA 27X27

    Heat Sink, For Ball Grid Array, Bga, 20 C/W, 6 Mm, 27 Mm, 27 Mm Rohs Compliant: Yes |Fischer Elektronik ICK BGA 27X27
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark ICK BGA 27X27 Bulk 2,333 1
    • 1 $2.2
    • 10 $2.16
    • 100 $1.91
    • 1000 $1.75
    • 10000 $1.75
    		Buy Now

    Fischer Elektronik GmbH & Co KG ICK BGA 27 X 27 X 22

    Heat Sink; Thermal Resistance:13.5°C/W; Packages Cooled:Bga; External Width - Metric:27Mm; External Height - Metric:22Mm; External Length - Metric:27Mm; External Diameter - Metric:-; Heat Sink Material:Aluminum; Product Range:- Rohs Compliant: Yes |Fischer Elektronik ICK BGA 27 X 27 X 22
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark ICK BGA 27 X 27 X 22 Bulk 466 1
    • 1 $6.4
    • 10 $6.21
    • 100 $5.82
    • 1000 $5.64
    • 10000 $5.64
    		Buy Now

    Fischer Elektronik GmbH & Co KG ICK BGA 27 X 27 X 10

    Heat Sink; Thermal Resistance:18.5°C/W; Packages Cooled:Bga; External Width - Metric:27Mm; External Height - Metric:10.01Mm; External Length - Metric:27Mm; External Diameter - Metric:-; Heat Sink Material:Aluminum; Product Range:- Rohs Compliant: Yes |Fischer Elektronik ICK BGA 27 X 27 X 10
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark ICK BGA 27 X 27 X 10 Bulk 2 1
    • 1 $3.57
    • 10 $3.21
    • 100 $2.58
    • 1000 $2.28
    • 10000 $2.28
    		Buy Now
    TME ICK BGA 27 X 27 X 10 390 1
    • 1 $1.52
    • 10 $1.52
    • 100 $1.06
    • 1000 $1.06
    • 10000 $1.06
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    Fischer Connectors ICK BGA 27X27X10

    Heatsink, BGA, 18.5K/W, 27 x 27 x 10mm, Adhesive Foil, Conductive Foil Mount | Fischer ICK BGA 27X27X10
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS ICK BGA 27X27X10 Bulk 1
    • 1 $1.5
    • 10 $1.42
    • 100 $1.2
    • 1000 $1.2
    • 10000 $1.2
    		Get Quote

    Fischer Connectors ICK BGA 27X27X22

    Heatsink, BGA, 13.5K/W, 27 x 27 x 22mm, Adhesive Foil, Conductive Foil Mount | Fischer ICK BGA 27X27X22
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS ICK BGA 27X27X22 Bulk 1
    • 1 $6.84
    • 10 $6.64
    • 100 $6.23
    • 1000 $6.23
    • 10000 $6.23
    		Get Quote
    Find more BGA 27X27 price and stock on Findchips.com

    BGA 27X27 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    QFP Package 128 lead .5mm

    Abstract: QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance A54SX72A-FG484
    Text: 3.16mm [0.124"] 3.54mm [0.139"] 1 39.3mm [1.547"] 41.9mm [1.650"] 32.23mm [1.269"] 41.9mm [1.650"] 27mm 15.67mm [0.617"] DETAIL A Lead coplanarity 0.005" max. Side View 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket 1.00mm centers, 26X26 array, 27X27mm body to 256 QFP, 0.5mm


    Original     		PDF 26X26 27X27mm PC-BGA/QFP-SX72A-Z-01 A54Sx72A-CQ256 A54SX72A-FG484 SI-SX72-ACQ256SFG484 QFP Package 128 lead .5mm QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 BGA 256 PACKAGE thermal resistance

    BG329

    Abstract: BGA 27X27 pitch
    Text: EIA Standard Layout of Solder Pad for BGA Devices Figure 1: Suggested Board Layout of Soldered pads for BGA Packages Tabel 1 contains the recommended board layout soldered pad dimension for Actel CS and GA BGA packages only. Table 1: Recommended PCB Design Guidelines


    Original     		PDF CS128 CS180 BG272 BG313 BG329 FG144 FG256 FG484 FG676 FG896 BGA 27X27 pitch

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033

    676 BGA package tray

    Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
    Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)


    Original     		PDF BGA27 27ESP 225-pin 256-pin 272-pin 316-pin 320-pin 352-pin 385-pin 400-pin 676 BGA package tray tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27

    bu series

    Abstract: MBA27002 plastic ul94v0 CU1100 27X27MM
    Text: Model : MBA27002 Series For 27x27 Chip set BGA Heat Sink MBA27002 Series Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic UL94-V0 2.Heat sink dimension : Foot print : 27x27mm Part no. Height Fin shape Base MBA27002MBA27002MBA27002MBA27002- 12


    Original     		PDF MBA27002 27x27 CU1100 UL94-V0) 27x27mm MBA27002MBA27002MBA27002MBA27002- MBA27002-12PCU/2 MBA27002-15PCU/2 MBA27002-20PCU/2 bu series plastic ul94v0 CU1100 27X27MM

    CMBA022727

    Abstract: MBH27002 27X27MM
    Text: MBH27002 Series=CMBA022727 MBH27002-H12 MBH27002-H25 = 1373256 = 1373257 Model : CMBA022727 Series For 27x27 Chip set BGA Heat Sink CMBA022727 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 27x27mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm


    Original     		PDF MBH27002 CMBA022727 MBH27002-H12 MBH27002-H25 CMBA022727 27x27 27x27mm UL94-V0) 15x15 27X27MM

    SG-BGA-7088

    Abstract: 7088
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		PDF 475mm. 725mm 125mm. SG-BGA-7088 7088

    NEC VR4300

    Abstract: JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28
    Text: High Performance! Contents 目次 1. BGA とは？ ―――――――――――――― 3 2. NEC の BGA は？ ―――――――――――― 3 3. 特徴 ―――――――――――――――――― 4 4. パッケージ写真 ――――――――――――― 6


    Original     		PDF 208QFP 225BGA 20down 56down 225BGA C13550JJ1V0PF00 NEC VR4300 JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    SG-BGA-6014

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly 40.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm ru/15/09, 863mm 025mm 725mm SG-BGA-6014 125mm.

    BGA 256 PACKAGE power dissipation

    Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
    Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced


    Original     		PDF 00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


    Original     		PDF SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket

    SG-BGA-6069

    Abstract: 6069 A 6069 H
    Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 40.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm SG-BGA-6069 863mm 025mm 725mm 6069 A 6069 H

    NET2272REV1A-LF

    Abstract: pex8311 edge connector 8114BA 8524BB Rapid Development Kit PEX8311-AA66BC PEX8114BA PEX8114-AA13BI 8114s
    Text: Issue No. 29 PEX 8114 Key Features Application: ♦ Transparent and NonTransparent Modes ♦ Forward and Reverse Modes ♦ Low Power Consumption 2W ♦ Small Footprint 17 x 17 mm BGA Package ♦ Lead Free Available ♦ Supports PCI and PCI-X 33MHz thru 133MHz


    Original     		PDF 33MHz 133MHz 9056-BA66BI 9054-AC NET2272REV1A-LF; NET2272REV1A-LF pex8311 edge connector 8114BA 8524BB Rapid Development Kit PEX8311-AA66BC PEX8114BA PEX8114-AA13BI 8114s

    27X27

    Abstract: 40MM DT-BGA641A-Z-P-01
    Text: 73.66mm [2.900"] 19.83mm [0.781"] A1 20.98mm [0.826"] PLASTRONICS A1 40MM X 40MM 73.66mm [2.900"] PAT. PEND. - no connect see map document for details 2.54mm typ. [0.100"] Top View Bottom View 3 24.21mm [0.953"] 1 4 641 BGA - 17 NC = 624 balls routed 2 3.19mm


    Original     		PDF FR4/G10 27X27 25X25 DT-BGA641A-Z-P-01 40MM

    AC-27621

    Abstract: 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842
    Text: NP276 Series Open Top Ball Grid Array (BGA, 1.27mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C


    Original     		PDF NP276 10mA/20mV NP276 45x45 NP276-110522 AC-15751 AC-17393 AC-27621 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842

    bga676

    Abstract: 1mm pitch BGA socket BGA-676 BGA 27X27 pitch 27X27MM 7075-T6 aluminum 180C 7075-T6 SBT-BGA-6002 1mm pitch BGA
    Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 6 7 • 12 14 13 • Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable


    Original     		PDF 27x27mm, 26x26 SBT-BGA-6002 bga676 1mm pitch BGA socket BGA-676 BGA 27X27 pitch 27X27MM 7075-T6 aluminum 180C 7075-T6 1mm pitch BGA

    676 BGA package tray

    Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
    Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)


    Original     		PDF BGA27 27ESP 225-pin 256-pin 272-pin 316-pin 320-pin 352-pin 676 BGA package tray BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray

    EA-190-H125-T710

    Abstract: EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710
    Text: Aavid Clip Attach E for Series Aavid Clip Attach E-Series BGAs AAVID CLIP ATTACH E-SERIES Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to mount plastic frame along with flexible wire springs. The wire springs are resistant to breakage and allow


    Original     		PDF UL94V-0 EA-190-H125-T710 EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710

    27B1

    Abstract: BGA27 BGA package tray 625-Pin
    Text: TRAY CONTAINER UNIT : mm 4 x 10=40 87.6 135° C MAX. 27.25 24.15 NEC BGA27 × 27B-1 29.20 135.9 PPE A' A 27.25 29.20 26.10 262.8 315.0 322.6 SECTION A-A' 4.17 (6.35) 7.62 27.25 Applied Package Quantity (pcs) Tray BGA27×27B-1 624-pin Plastic BGA (27×27)


    Original     		PDF BGA27 27B-1 BGA27 624-pin 625-pin 720-pin 960-pin SSD-A-H7549-2 27B1 BGA package tray

    UBGA49

    Abstract: EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE
    Text: CPLD Package & I/O Matrix December 15, 2002. This document is revised quarterly. Visit the Altera web site at www.altera.com for the latest version. 36 68 100-Pin TQFP 36 84 84 100 120 120 36 84 100 120 68 68 84 100 212 256-Pin BGA 68 100-Pin FBGA 1.0 mm


    Original     		PDF 100-Pin EPM3512A 160-Pin EPM3256A EPM3128A EPM7256S EPM7192S EPM7160S EPM7064S EPM7128S UBGA49 EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE

    27X27

    Abstract: BGA 27X27
    Text: 225-PIN PLASTIC BGA 27x27 A S B C Index mark 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D R P NM L K J HG F E D C B A P J I R H K L φM S F S E G M NOTE Each lead centerline is located within φ 0.3 mm of its true position (T.P.) at maximum material condition.


    Original     		PDF 225-PIN 27x27) P225S1-150-B1-2 27X27 BGA 27X27

    Untitled

    Abstract: No abstract text available
    Text: BGA 119 Pin NP276 Series CHARACTERISTICS Insulation Resistance 100MQ or more at 100VDC Withstanding Voltage Contact Resistance 100VAC for one minute 30mQ or less at 10mA, 20m V (initial) 40°C ~ +I50CC Operating Temperature ORDERING PROCEDURE NP276-119 04-*


    OCR Scan     		PDF NP276 100MQ 100VDC 100VAC NP276-119 NP276- NP276-1 190BGA^ 27x27