Untitled
Abstract: No abstract text available
Text: Table of Contents Table of Contents BGA Socketing Systems Designed for use with Ball Grid Array BGA , Land Grid Array (LGA), and Chip Scale Package (CSP) devices in development, test and production applications. Over 900 footprints available online in our searchable BGA Socket Finder database at www.bgasockets.com.
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CAT16-PREVIEW06
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SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL
Abstract: "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"
Text: Package Information file:///D|/nec_intranet/package/index.htm Package Information Package Type Package List by NEC Code Explanation of Package and Packing Semiconductor Device Mounting Technology Manual Chip Size Package (CSP) BGA Family Flip Chip BGA (FCBGA)
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12x12 bga thermal resistance
Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE
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SZZA005
thoseI1450
12x12 bga thermal resistance
SZZA005
micro pitch BGA
A113
TMS320VC549
TMS320VC549GGU
BGA Ball Crack
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U37Y
Abstract: No abstract text available
Text: 1 Gigabit Stacked DDR2 SDRAM 128Mb x 8 DD51E Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and • • • • • • • •
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DD51E
128Mb
2D128M82U3BA
DD51E
3887x132
U37Y
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U37Y
Abstract: No abstract text available
Text: 1 Gigabit Stacked DDR2 SDRAM DD50E 256Mb x 4 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and • • • • • • • •
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DD50E
256Mb
2D256M42U3BA
DD50E
3887x132
U37Y
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DD256M
Abstract: T37Z TSOP 66 Package thermal resistance
Text: 1 GigaBit Stacked DDR1 SDRAM DD54E, DD54ER 256M x 4 Features • Low Profile 66 Ball Two-High Stacked Die micropede BGA • 77% Space Savings Over Two 66 Pin TSOP Packages • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and
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DD54E,
DD54ER
DD54ER)
DDR400)
DD256M42U3BA
DD54E
3887x132
DD54E)
DD256M
T37Z
TSOP 66 Package thermal resistance
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T37Z
Abstract: DD128 TSOP 66 pin Package thermal resistance DD128M82U3BB6 267-Mbps
Text: 1 GigaBit Stacked DDR1 SDRAM 128M x 8 DD55E, DD55ER Features • Low Profile 66 Ball Two-High Stacked Die micropede BGA • 77% Space Savings Over Two 66 Pin TSOP Packages • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and
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DD55E,
DD55ER
DD54ER)
DDR400)
DD128M82U3BA
DD55E
3887x132
DD55E)
T37Z
DD128
TSOP 66 pin Package thermal resistance
DD128M82U3BB6
267-Mbps
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IPC-6011
Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications
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1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6011
IPC-D-279
IPC-6013
ipc 7094
IPC-6012
IPC-2223
IPC 6012
IPC-6016
IPC-2221
IPC-2222
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PitchChecker
Abstract: No abstract text available
Text: PitchChecker ANTI-STATIC SEE THROUGH TM MODEL PC815 PITCH COMPARATOR BULLETIN PC815B-R1 CHECK PITCH AND BODY SIZE OF INTEGRATED CIRCUITS FEATURES PITCHES FOR MANY POPULAR TYPES INCLUDING SOIC, SOP, SSOP, TSSOP, BGA, QFP, QFN, DFN, DIP, CSP and MORE FLEXIBLE AND COMPACT
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PC815
PC815B-R1
PitchChecker
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Untitled
Abstract: No abstract text available
Text: PitchChecker ANTI-STATIC SEE THROUGH TM MODEL PC815 PITCH COMPARATOR BULLETIN PC815B-R1 CHECK PITCH AND BODY SIZE OF INTEGRATED CIRCUITS FEATURES PITCHES FOR MANY POPULAR TYPES INCLUDING SOIC, SOP, SSOP, TSSOP, BGA, QFP, QFN, DFN, DIP, CSP and MORE FLEXIBLE AND COMPACT
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PC815
PC815B-R1
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PA-PGA181-02W
Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for
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12X12mm.
FR4/G10
PA-PGA181-02W
PA-SO42-S-01
actel 14100
BGA169C
PA-PGA68-01
ax 6001 mp3
PA-QIP90-01
PA-PLCC84-02
intel 82310
PA-PGA301-01
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Untitled
Abstract: No abstract text available
Text: MACHINED HIGH FREQUENCY CENTER PROBE TEST SOCKET FOR BGA, CSP, & MLF PACKAGES FEATURES: • Solderless spring probes pressure mount to the test board and device solderball or pad. • Only .077” 1.95mm signal path. • Very low inductance and capacitance.
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BGA 256 PACKAGE power dissipation
Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced
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00-mm
27-mm
XC9500
BGA 256 PACKAGE power dissipation
BGA 64 PACKAGE thermal resistance
xilinx CS144 thermal resistance
FG676
BG560
BGA and CSP
BGA-1156
fine BGA thermal profile
cte table flip chip substrate
BG432
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SPARTAN XC2S50
Abstract: XCS10 vq100 FG456 XC2S50 xilinx CS144 CSP144 CS144 xc2s30 pq208 XCS30 PQ208 XC2S15
Text: High volume package solutions guide partanTM families provide the low-cost, high-volume ASIC packages for applications that need low power, small form factors and high reliability. The Chip Scale Package CSP and the Fine Pitch BGA package (FG) provide higher
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K6F1016U4A
Abstract: No abstract text available
Text: K6F1016U4A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998
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K6F1016U4A
85/Typ.
25/Typ.
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Untitled
Abstract: No abstract text available
Text: K6F1016S4A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998
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K6F1016S4A
85/Typ.
25/Typ.
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KM616FU1010
Abstract: KM616FU1010A
Text: KM616FU1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998
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KM616FU1010A
80/Typ.
25/Typ.
KM616FU1010
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Untitled
Abstract: No abstract text available
Text: Preliminary KM616FS1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA Draft Date Remark November 4, 1998
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KM616FS1010A
80/Typ.
25/Typ.
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Untitled
Abstract: No abstract text available
Text: Preliminary KM616FR1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA Draft Date Remark October 29, 1998
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KM616FR1010A
25/Typ.
80/Typ.
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SF-PLCC84-J-01
Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.
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SK-UGA12/48A-01
SK-MGA12/48A-01
SK-MGA10/48A-01
SK-MGA13/50B-01
SK-MGA12/56A-01
SK-MGA14/56A-01
SK-MGA12/56B-01
SF-PLCC84-J-01
PL-PLCC68-S-01
SO8A
SF-PLCC44-J-01
SF-PLCC28-J-01
SF-QFE128SD-K-01
PL-PLCC68-T-01
sf 128 transistor
SF 127
PLCC32 through hole socket
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2450FB15M0001
Abstract: bc03
Text: "High Frequency Ceramic Solutions" 2.45 GHz Filter Balun, conjugate match to BC03 & BC04 BGA/CSP and MTK 6611/6612 chipsets P/N 2450FB15M0001 Page 1 of 3 Detail Specification: 05/05/2012 General Specifications Part Number 2450FB15M0001 40 min.@ 880~960MHz
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2450FB15M0001
2450FB15M0001
960MHz
1990MHz
5000MHz
7500MHz
bc03
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xc9536tm
Abstract: FG456 CS144 CS280 CS48 FG256 FG676 XC9500 XC9536 XCV100
Text: ADVANCED Chip Scale & BGA Packaging New packaging technology for FPGAs and CPLDs reduces board space and increases I/Os. by Jay Aggarwal, Spartan Product Marketing Manager, Xilinx, [email protected] X ilinx recently announced new 144-ball and 280-ball, 0.8-millimeter pitch chip
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144-ball
280-ball,
XC9500
144ball
FG256,
FG456,
FG676,
FG680.
FG456
FG676
xc9536tm
CS144
CS280
CS48
FG256
XC9536
XCV100
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IPC-6012
Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel
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1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6012
IPC-D-279
IPC-6013
IPC-6016
IPC-2223
ipc 7094
IPC-7094
IPC-2226
IPC-6011
IPC-7525
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PDF
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Untitled
Abstract: No abstract text available
Text: Preliminary KM616FU1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision H istory R evisio n No. H isto ry 0.0 D raft D ate Initial Draft - Specify CSP type to distinguish between uBG A and FP BGA November 4, 1998
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KM616FU1010A
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PDF
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