BGA AND EQFP PACKAGE Search Results

BGA AND EQFP PACKAGE Result Highlights (5)

Part	Manufacturer	Description
DE6B3KJ151KA4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ471KB4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6E3KJ152MN4A	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ101KA4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ331KB4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive

BGA AND EQFP PACKAGE Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
EQFP 144 PACKAGE Abstract: BGA and eQFP Package TQFP 144 PACKAGE altera micro fineline BGA eQFP EPC16 Text: Package dimensions selector guide FineLine BGA FBGA ; Hybrid FineLine BGA (HFBGA) as noted 1,932 1,760 45.00 x 45.00 1.00 1,517 43.00 x 43.00 1.00 1,020 40.00 x 40.00 1.00 896 33.00 x 33.00 1.00 1,508 780 31.00 x 31.00 1.00 40.00 x 40.00 1.00 35.00 x 35.00	Original		PDF
PCN0904 Abstract: EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0904 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Change Description This is an update to PCN0904, please see revision history table for information specific to this	Original	PCN0904 65-nm 60-nm PCN0904, EU-REP3C16U484I7N EP3C10E144C7 EP3C10E144C7N EP3C10E144C8 PCN0904 EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N	PDF
Memory Interfaces Abstract: EQFP 144 PACKAGE EP3CLS70 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 EP3CLS100 Text: 8. External Memory Interfaces in the Cyclone III Device Family CIII51009-2.3 In addition to an abundant supply of on-chip memory, Cyclone III device family Cyclone III and Cyclone III LS devices can easily interface to a broad range of external memory, including DDR2 SDRAM, DDR SDRAM, and QDRII SRAM.	Original	CIII51009-2 Memory Interfaces EQFP 144 PACKAGE EP3CLS70 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 EP3CLS100	PDF
DDR2 sdram pcb layout guidelines Abstract: Memory Interfaces BGA and eQFP Package EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 SSTL-18 Text: 9. External Memory Interfaces in Cyclone III Devices CIII51009-1.1 Introduction In addition to an abundant supply of on-chip memory, Cyclone III devices can easily interface to a broad range of external memory including DDR2 SDRAM, DDR SDRAM, and QDRII SRAM.	Original	CIII51009-1 DDR2 sdram pcb layout guidelines Memory Interfaces BGA and eQFP Package EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 SSTL-18	PDF
BGA and eQFP Package Abstract: BGA 256 PACKAGE thermal resistance fbga 12 x 12 thermal resistance Text: PRELIMINARY Delta39K Power Estimation and Thermal Management Summary This application note covers a brief explanation of the Delta39K™ Power Estimator spreadsheet, suggestions on reducing the overall power consumption of Delta39K designs, and use of forced airflow and heat-sinks to manage heat dissipation.	Original	Delta39KTM Delta39K BGA and eQFP Package BGA 256 PACKAGE thermal resistance fbga 12 x 12 thermal resistance	PDF
CYCLONE 3 ep3c25f324* FPGA Abstract: FBGA-484 datasheet EP3C16F484I7N EPM570T144I5 EP3C10E144I7N EP3C25F324I7N EPM1270F256I5 EPM1270T144I5 EP2C5Q208I8N EP3C120F780I7N Text: Technical Brief Extended Temperature Support for Cyclone II, Cyclone III, and MAX II Devices Introduction Semiconductor devices undergo at least two types of testing: device characterization and production testing. Device characterization is used to verify the performance of a semiconductor design and its physical implementation.	Original		PDF
74 series family Abstract: EP3C10 EP3CLS200 mini-lvds driver AN-447 BGA and eQFP Package EP3CLS70 EQFP-144 mini-lvds source driver receiver altLVDS Text: Section 2. I/O Interfaces This section provides information about Cyclone III device family I/O features and high-speed differential and external memory interfaces. This section includes the following chapters: • Chapter 6, I/O Features in the Cyclone III Device Family	Original		PDF
EP4CE6 package Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80 Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead	Original	DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80	PDF
EQFP-144 Abstract: ttl to mini-lvds SSTL-18 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 mini-lvds source driver Text: Section 2. I/O and External Memory Interfaces This section provides information about Cyclone III device I/O features and high-speed differential and external memory interfaces. This section includes the following chapters: Revision History Altera Corporation	Original		PDF
TSMC embedded Flash Abstract: EQFP 144 PACKAGE pin information ep3c10 cyclone III 484-pin BGA FPGA package point-to-point mini-lvds EP3C25 pin guideline EP3C120 EP3C16 EP3C25 EP3C40 Text: Cyclone III 65-nm low-cost FPGAs Cyclone III product specs Cyclone III floorplan Phase-locked loops Altera Cyclone® III FPGAs, the newest offering in the Cyclone series of low-cost devices, feature low power and high functionality to deliver more, sooner, and for less—especially for your most cost-sensitive high-volume	Original	65-nm SG-01003-2 TSMC embedded Flash EQFP 144 PACKAGE pin information ep3c10 cyclone III 484-pin BGA FPGA package point-to-point mini-lvds EP3C25 pin guideline EP3C120 EP3C16 EP3C25 EP3C40	PDF
EP4CE15 Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22 Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead	Original	DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22	PDF
5M80ZT100 Abstract: 5M570ZM100 5M2210ZF256 5M160ZE64 5m240Zt100 5M1270ZF324 5m570ZT144 EP4CE15F17 5M40ZE64A5 5M1270ZT Text: The Automotive-Grade Device Handbook The Automotive-Grade Device Handbook 101 Innovation Drive San Jose, CA 95134 www.altera.com AUT5V1-2.0 Document last updated for Altera Complete Design Suite version: Document publication date: 11.0 May 2011 Subscribe 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat.	Original		PDF
PQFP 176 Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760 Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●	Original	144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760	PDF
pin information ep3c10 Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55 Text: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.	Original	EP3C25 EP3C10 pin information ep3c10 EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55	PDF

b1225 Abstract: application PAL 16v8 Neuron Chip 3150 7c63000a 16V8 BGA and eQFP Package 62256L EEPROM 25xxx 25xxx 48-pin TSOP Text: Ordering Information PHYSICAL LAYER DEVICES PREFIX CY CY CY CY SUFFIX DEVICE P 15G P 15G P 25G S 25G 04 04 01 01 01 DX 02 DX 01 DX K100 – BG – BG – AT – MG C T C T C T C FAMILY QUAD HOTLINK II TRANSCEIVER QUAD HOTLINK II SERDES OC-48 SERDES PROCESSING	Original	OC-48 7C53120E4 8C25122 b1225 application PAL 16v8 Neuron Chip 3150 7c63000a 16V8 BGA and eQFP Package 62256L EEPROM 25xxx 25xxx 48-pin TSOP	PDF
application PAL 16v8 Abstract: 7c63000a CERAMIC LEADLESS CHIP CARRIER LCC 24 62256L K100 BGA and eQFP Package Neuron Chip 3150 CYPRESS B1225 PLD 22V10 Text: Ordering Information PHYSICAL LAYER DEVICES PREFIX CY CY CY CY SUFFIX DEVICE P 15G P 15G P 25G S 25G 04 04 01 01 01 DX 02 DX 01 DX K100 - BG - BG - AT - MG C T C T C T C FAMILY QUAD HOTLINK II TRANSCEIVER QUAD HOTLINK II SERDES OC-48 SERDES PROCESSING T = SURFACE-MOUNTED DEVICES TO BE TAPE AND REELED	Original	OC-48 7C53120E4 8C25122A application PAL 16v8 7c63000a CERAMIC LEADLESS CHIP CARRIER LCC 24 62256L K100 BGA and eQFP Package Neuron Chip 3150 CYPRESS B1225 PLD 22V10	PDF
pin information ep3c10 Abstract: u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164 Text: Cyclone Series Device Thermal Resistance May 2008, version 3.0 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made May 2008 3.0 Updated Tables 2, 4, and 5. July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.	Original	EP3C25 EP3C10 pin information ep3c10 u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164	PDF
EP4CE40 Abstract: ep4cgx110 EP4C EP4CE55 EP4CE22 EP4CE15 EP4CE10 ep4cgx30f484 EP4CGX150 N148 Text: 1. Cyclone IV FPGA Device Family Overview November 2011 CYIV-51001-1.5 CYIV-51001-1.5 Altera’s new Cyclone IV FPGA device family extends the Cyclone FPGA series leadership in providing the market’s lowest-cost, lowest-power FPGAs, now with a transceiver variant. Cyclone IV devices are targeted to high-volume, cost-sensitive	Original	CYIV-51001-1 EP4CE40 ep4cgx110 EP4C EP4CE55 EP4CE22 EP4CE15 EP4CE10 ep4cgx30f484 EP4CGX150 N148	PDF
HSTL-12 Abstract: mini-lvds EQFP-144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 SSTL-18 Text: 7. Cyclone III Device I/O Features CIII51007-1.1 Introduction Two key factors affecting board design today drove the design of Cyclone III devices I/O capabilities. The first is the diversification of I/O standards in many low-cost applications. The second is a significant increase in the required I/O performance. Our objective was to create a device	Original	CIII51007-1 HSTL-12 mini-lvds EQFP-144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 SSTL-18	PDF
Untitled Abstract: No abstract text available Text: 1. Cyclone IV FPGA Device Family Overview May 2013 CYIV-51001-1.8 CYIV-51001-1.8 Altera’s new Cyclone IV FPGA device family extends the Cyclone FPGA series leadership in providing the market’s lowest-cost, lowest-power FPGAs, now with a transceiver variant. Cyclone IV devices are targeted to high-volume, cost-sensitive	Original	CYIV-51001-1	PDF
EP4CE22 Abstract: EP4CE15 ep4cgx30f484 EP4CE40 EP4CE10 EP4CE6 EP4CGX150 EP4CGX50 EP4C EP4CE55 Text: 1. Cyclone IV FPGA Device Family Overview October 2012 CYIV-51001-1.6 CYIV-51001-1.6 Altera’s new Cyclone IV FPGA device family extends the Cyclone FPGA series leadership in providing the market’s lowest-cost, lowest-power FPGAs, now with a transceiver variant. Cyclone IV devices are targeted to high-volume, cost-sensitive	Original	CYIV-51001-1 EP4CE22 EP4CE15 ep4cgx30f484 EP4CE40 EP4CE10 EP4CE6 EP4CGX150 EP4CGX50 EP4C EP4CE55	PDF
bga 484 0.8mm pitch Abstract: 20532 tqfp 39K100 39K200 39K30 39K50 484FBGA CY39200V208-181NTXC CY39100V208B-125NTxC cy39030v208-125ntxc Text: Delta39K ISR™ CPLD Family CPLDs at FPGA Densities™ Features • Multiple I/O standards supported — LVCMOS 3.3/3.0/2.5/1.8V , LVTTL, 3.3V PCI, SSTL2 (I-II), SSTL3 (I-II), HSTL (I-IV), and GTL+ • Compatible with NOBL™, ZBT™, and QDR™ SRAMs	Original	Delta39KTM 66-MHz 64-bit 39K165 208-EQFP, 484-FBGA, 388-BGA, 676-FBGA bga 484 0.8mm pitch 20532 tqfp 39K100 39K200 39K30 39K50 484FBGA CY39200V208-181NTXC CY39100V208B-125NTxC cy39030v208-125ntxc	PDF
84 FBGA Abstract: 39K100 39K200 39K30 39K50 388-BGA Text: Delta39K ISR™ CPLD Family CPLDs at FPGA Densities™ Features • Multiple I/O standards supported — LVCMOS 3.3/3.0/2.5/1.8V , LVTTL, 3.3V PCI, SSTL2 (I-II), SSTL3 (I-II), HSTL (I-IV), and GTL+ • Compatible with NOBL™, ZBT™, and QDR™ SRAMs	Original	Delta39KTM 66-MHz 64-bit 39K165 208-EQFP, 484-FBGA, 388-BGA, 676-FBGA 84 FBGA 39K100 39K200 39K30 39K50 388-BGA	PDF
EP4CE30F Abstract: EP4CE40F23A7N EPM1270F256A5N EP4CE10E22 EP4CE15f17 EP4CE10E22A7N EP4CE22F17A7N EP4CE10F17 EPM570T100A5N EP4CE6 Text: The Automotive-Grade Device Handbook 101 Innovation Drive San Jose, CA 95134 www.altera.com AUT5V1-1.2 Copyright 2010 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other	Original	AN114: EP4CE30F EP4CE40F23A7N EPM1270F256A5N EP4CE10E22 EP4CE15f17 EP4CE10E22A7N EP4CE22F17A7N EP4CE10F17 EPM570T100A5N EP4CE6	PDF

BGA AND EQFP PACKAGE Search Results

BGA AND EQFP PACKAGE Result Highlights (5)

BGA AND EQFP PACKAGE Datasheets Context Search

EQFP 144 PACKAGE

PCN0904

Memory Interfaces

DDR2 sdram pcb layout guidelines

BGA and eQFP Package

CYCLONE 3 ep3c25f324* FPGA

74 series family

EP4CE6 package

EQFP-144

TSMC embedded Flash

EP4CE15

5M80ZT100

PQFP 176

pin information ep3c10

b1225

application PAL 16v8

pin information ep3c10

EP4CE40

HSTL-12

Untitled

EP4CE22

bga 484 0.8mm pitch

84 FBGA

EP4CE30F