daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
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strapack s-669
Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,
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Yamaichi IC51-0444-1568
Abstract: IC51-0444-1568 LCS-68 PQFP ALTERA 160 LCS-68-12 IC51-1444-1354-7 IC51-2084-1052-11 IC51-1004-809 Framatome Connectors IC51
Text: Selecting Sockets for Altera Devices January 1999, ver. 3 Introduction Application Note 80 Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board PCB layout, different soldering processes for production
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EPM7128STC100-15
Abstract: EPF10K50RI240-4 ALTERA MAX EPM7128SQC100-15 EPF10K10LC84-3 qpsk modulation VHDL CODE 304 QFP amkor ALTERA EPF10K50RI240-4 MAX7000S EPF10K10LC84-4 EPF10K20A
Text: Newsletter for Altera Customers ◆ First Quarter ◆ February 1997 FLEX Devices: The Gate Array Alternative Altera’s FLEX 10K and FLEX 8000 devices combine the flexibility of programmable logic devices PLDs with the density and efficiency of gate arrays. As PLD unit
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IPC-SM-786A
Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
Text: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid
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Yamaichi IC51-0804-808
Abstract: BGA and QFP Altera Package mounting QILE84P-410T IC51-2084-1052-11 Enplas fpq LCS-68 force fit standoffs BGA and QFP Package mounting IC51-0804-808 AUGAT SOCKET
Text: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board
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LCS-68
Abstract: IC51-2084-1052-11 FPQ-240-0 821575-1 IC51-1004-809 44 pin TQFP Test Clip plcc socket 84 PLCC 3m bga169
Text: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board
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BGA and QFP Altera Package mounting profile
Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine
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LCS-68
Abstract: 821575-1 LCS-84 1-382320-7 821574-1
Text: Selecting Sockets for Altera Devices January 1998, ver. 2 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board
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EPF10K50E
Abstract: No abstract text available
Text: Designing with FineLine BGA Packages November 1999, ver. 1.03 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the
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micro fineline BGA
Abstract: Epoxy, glass laminate EPC16U88
Text: Designing With Fineline BGA Packages for APEX, FLEX, ACEX, MAX 7000 & MAX 3000 Devices Application Note 114 October 2005, ver. 3.0 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues
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ic51-1604-845-4
Abstract: socket Yamaichi ic51 IC51 - 1052 - 13 LCS-68 fpq-240
Text: Selecting Sockets for Altera Devices A pplication Note 80 June 1996, ver. 1 Introduction Altera offers a number of surface-mount packages. Surface-mount assem bly places unique dem ands on the developm ent and manufacturing process by requiring different CA D sym bols for printed circuit board
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EPF10K50E
Abstract: BGA and QFP Package mounting
Text: Designing with FineLine BGA Packages August 2001, ver. 1.1 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the
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EPC16U88
Abstract: No abstract text available
Text: Designing With High-Density BGA Packages for Altera Devices Application Note 114 December 2007, ver. 5.1 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues
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PLCC 84 PINS
Abstract: camtex trays MIL-I-8835A
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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camtex trays
Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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IPC-SM-780
Abstract: No abstract text available
Text: Reflow Soldering Guidelines January 1998, ver. 2 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid
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ANSI/IPC-SM-786)
IPC-TM-650)
JESD22-A112)
IPC-SM-780
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IPC-SM-780
Abstract: IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life
Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.
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oC-SM-786)
IPC-TM-650)
JESD22-A112)
IPC-SM-780
IPC-SM-786
IPC-SM-786A
GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
moisture sensitive handling and packaging
BGA and QFP Altera Package mounting
Solder paste floor life
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IPC-SM-780
Abstract: IPC-SM-780 solder paste OVEN RQFP IPC-SM-786
Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.
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varyinI/IPC-SM-786)
IPC-TM-650)
JESD22-A112)
IPC-SM-780
IPC-SM-780 solder paste
OVEN
RQFP
IPC-SM-786
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ADV9801
Abstract: MP-8000 MP8000 IPC-SM-786A pdf epf8282
Text: CUSTOMER ADVISORY FLEX 10K ADDITIONAL SOURCE OF SUPPLY Altera has improved the thermally enhanced QFP package used for the FLEX 10K products to meet a Level 3 moisture rating as specified in JEDEC STD-020 and IPC-SM-786A. This upgrade will take effect in Q2 1998 for all FLEX 10K devices. The dry-pack label for these
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STD-020
IPC-SM-786A.
MP-8000,
EPF8282/A
J-STD-020.
ADV9801
ADV9801
MP-8000
MP8000
IPC-SM-786A
pdf epf8282
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TD 265 N 600 KOC
Abstract: core i5 520 Scans-049 camtex trays sii Product Catalog EPM9560 film hot BT 342 project TIL Display 7160S
Text: 1996 Data Book Data Book June 1996 A-DB-0696-01 Altera, MAX, M A X+PLUS, FLEX, FLEX 10K, FLEX 8000, FLEX 8000A, MAX 9000, MAX 7000, MAX 7000E, MAX 7000S, FLASHlogic, MAX 5000, Classic, M AX+PLUS II, PL-ASAP2, PLDshell Plus, FastTrack, AHDL, MPLD, Turbo Bit, BitBlaster, PENGN, RIPP 10, PLS-ES, ClockLock, ClockBoost,
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-DB-0696-01
7000E,
7000S,
EPF10K100,
EPF10K70,
EPF10K50,
EPF10K40,
EPF10K30,
EPF10K20,
EPF10K10,
TD 265 N 600 KOC
core i5 520
Scans-049
camtex trays
sii Product Catalog
EPM9560
film hot
BT 342 project
TIL Display
7160S
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BGA and QFP Altera Package mounting
Abstract: diode zener ph c5v1 527 MOSFET TRANSISTOR motorola PH C5V1 lt1085 linear SOIC Package 8-Pin Surface Mount 601 "Fast Cycle RAM" mounting pad dimentions PQFP motorola smd transistor code 621 BGA OUTLINE DRAWING
Text: Cyclone Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com C5V1-1.0 Copyright 2003 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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00-mm
BGA and QFP Altera Package mounting
diode zener ph c5v1
527 MOSFET TRANSISTOR motorola
PH C5V1
lt1085 linear
SOIC Package 8-Pin Surface Mount 601
"Fast Cycle RAM"
mounting pad dimentions PQFP
motorola smd transistor code 621
BGA OUTLINE DRAWING
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Date Code Formats Altera EPF10K
Abstract: ep22v10 5962-9061102XA 5962-8854901xa 8686401LA 5962-8686401LA lift controller in vhdl ALTERA PART MARKING EPM7160 EPX780 transistor b2020
Text: Introduction Contents March 1995 Introduction The PLD Advantages of Altera
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EP2C5Q208C8
Abstract: EP2C5T144 EP2C35F672
Text: Cyclone II Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com CII5V1-1.1 Copyright 2004 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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EP2C50F484C6
EP2C50
EP2C50F484C7
EP2C50F484C8
EP2C50F672C6
EP2C50F672C7
EP2C50F672C8
EP2C5Q208C8
EP2C5T144
EP2C35F672
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