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    BGA AND QFP PACKAGE Search Results

    BGA AND QFP PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH8R316MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -90 A, 0.0064 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH3R10AQM Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 120 A, 0.0031 Ω@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    BGA AND QFP PACKAGE Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    BGA and QFP Package Altera CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Original PDF

    BGA AND QFP PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		PDF ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7

    335314b

    Abstract: 371924B00032 335724B00032 T410 364424B00032 371824B00032 371824B00034 AAVID 364424B00000 embedded microprocessors 335714B00032
    Text: OPTIPIN HEAT SINKS FOR BALL GRID ARRAY BGA APPLICATIONS Aavid’s heat sinks cool BGA, Super BGA, QFP, PLCC, and PBGA packaged devices.Typical applications include set-top boxes, cable modems, sound and video cards, automotive global positioning systems(GPS), high resolution printers,


    Original     		PDF

    FBGA-484

    Abstract: BGA313 reflow soldering profile BGA
    Text: Actel provides simple step-by-step assembly flow instructions for attaching QFP and BGA sockets to a PCB. Also included is solder reflow information along with a sample standard reflow temperature profile. Recommended method of attaching QFP prototype sockets to a PCB.


    Original     		PDF

    IPC-SM-780

    Abstract: IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life
    Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		PDF oC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life

    IPC-SM-780

    Abstract: IPC-SM-780 solder paste OVEN RQFP IPC-SM-786
    Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		PDF varyinI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-780 solder paste OVEN RQFP IPC-SM-786

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


    Original     		PDF SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket

    PA-PGA181-02W

    Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
    Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for


    Original     		PDF 12X12mm. FR4/G10 PA-PGA181-02W PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		PDF SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432

    BGA and QFP Altera Package mounting profile

    Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
    Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine


    Original     		PDF

    am29ma16

    Abstract: AM29M16 AM29M16 PLD atmel 404 93c46 29f512 gal18v8 ATMEL 24C32A COP8622C atmel 93C46 AT27040
    Text: Ironwood Electronics Programming Adapters PR.1 Programming Adapters allow the programming of PROM, PLD, EPROM, EEPROM or PAL devices on programmers or ATE equipment with DIP sockets. We support PLCC, LCC, PGA, SOIC including TSOP , FP, BGA and QFP packages.


    Original     		PDF

    430413

    Abstract: 300K-600K CMOS-9 equivalent L302 sh micron aerospace
    Text: CMOS-9 3.3-VOLT, 0.35-MICRON CMOS GATE ARRAYS NEC Electronics Inc. July 1997 Description Figure 1. CMOS-9 Package Examples; BGA and QFP NEC's CMOS-9 gate array family provides designers with the performance capabilities and features required to develop devices for high-speed computer and


    Original     		PDF 35-MICRON 35-micron A12634EU1V0DS00 430413 300K-600K CMOS-9 equivalent L302 sh micron aerospace

    F611

    Abstract: No abstract text available
    Text: NEC Electronics Inc. CMOS-8LHD 3.3-Volt, 0.5-Micron CMOS Gate Arrays Preliminary Description April 1996 Figure 1. CMOS-8LHD Package Options: BGA & QFP NEC's CMOS-8LHD gate-array family combines cellbased-level densities with the fast time-to-market and low


    Original     		PDF 35-micron) A10616EU1V0DS00 F611

    PitchChecker

    Abstract: No abstract text available
    Text: PitchChecker ANTI-STATIC SEE THROUGH TM MODEL PC815 PITCH COMPARATOR BULLETIN PC815B-R1 CHECK PITCH AND BODY SIZE OF INTEGRATED CIRCUITS FEATURES PITCHES FOR MANY POPULAR TYPES INCLUDING SOIC, SOP, SSOP, TSSOP, BGA, QFP, QFN, DFN, DIP, CSP and MORE FLEXIBLE AND COMPACT


    Original     		PDF PC815 PC815B-R1 PitchChecker

    PCN0113

    Abstract: BGA and QFP Package EP20K1500E EP20K400E EPC16
    Text: PROCESS CHANGE NOTICE PCN0113 ADDITIONAL ASSEMBLY LOCATION Change Description: Altera is adding FineLine BGAä and QFP package capability at ASE’s assembly location in Kaohsiung, Taiwan. Reason For Change: ASE Malaysia is already a strategic manufacturing partner for Altera’s existing products.


    Original     		PDF PCN0113 EP20K1500E EP20K400E EPC16, EP20K400E, PCN0113 BGA and QFP Package EPC16

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    F611

    Abstract: L302 L611
    Text: NEC Electronics Inc. CMOS-8LH 3.3-Volt, 0.5-Micron CMOS Gate Arrays Preliminary April 1996 Description Figure 1. CMOS-8LH Package Options: BGA & QFP NEC's CMOS-8LH gate-array family consists of ultra-high performance, sub-micron gate arrays, targeted for applications requiring extensive integration and high


    Original     		PDF 35-micron) A11169EU1V0DS00 F611 L302 L611

    interposer

    Abstract: No abstract text available
    Text: HIGH FREQUENCY INTERPOSER SOCKET FEATURES: • Pressure mount plunge to board interposer. • Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP and more. • Very low inductance per contact site. • High cycle life with easy maintenance. • Manual or Automated Handler applications.


    Original     		PDF 10GHz. 20millohm. interposer

    ghk diode

    Abstract: 82365SL PCI1520 PCI1520GHK PCI1520I PCI1520IGHK PCI1520IPDV PCI1520IZHK INTEL PB-FREE
    Text: PCI1520 PCI1520I GHK/ZHK/PDV www.ti.com SLLA233 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • • A 208-terminal low-profile QFP PDV or 209-terminal MicroStar BGA ball-grid array (GHK/ZHK) package 2.5-V core logic and 3.3-V I/O with universal


    Original     		PDF PCI1520 PCI1520I SLLA233 208-terminal 209-terminal 16-bit TPS222X ghk diode 82365SL PCI1520 PCI1520GHK PCI1520IGHK PCI1520IPDV PCI1520IZHK INTEL PB-FREE

    PCI1520GHK

    Abstract: PCI1520I PCI1520IGHK PCI1520IPDV PCI1520IZHK 82365SL PCI1520
    Text: PCI1520 PCI1520I GHK/ZHK/PDV www.ti.com SLLA233 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • • A 208-terminal low-profile QFP PDV or 209-terminal MicroStar BGA ball-grid array (GHK/ZHK) package 2.5-V core logic and 3.3-V I/O with universal


    Original     		PDF PCI1520 PCI1520I SLLA233 208-terminal 209-terminal 16-bit TPS222X PCI1520GHK PCI1520IGHK PCI1520IPDV PCI1520IZHK 82365SL PCI1520

    PCI1520GHK

    Abstract: 82365SL PCI1520 PCI1520I PCI1520IPDV PCI1520IZHK PCI1520PDV
    Text: PCI1520 PCI1520I GHK/ZHK/PDV www.ti.com SLLA233 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • • A 208-terminal low-profile QFP PDV or 209-terminal MicroStar BGA ball-grid array (GHK/ZHK) package 2.5-V core logic and 3.3-V I/O with universal


    Original     		PDF PCI1520 PCI1520I SLLA233 208-terminal 209-terminal 16-bit TPS222X PCI1520GHK 82365SL PCI1520 PCI1520IPDV PCI1520IZHK PCI1520PDV

    On ghk diode

    Abstract: ghk diode 82365SL PCI1520 PCI1520GHK PCI1520I PCI1520IGHK PCI1520IPDV PCI1520IZHK
    Text: PCI1520 PCI1520I GHK/ZHK/PDV www.ti.com SLLA233 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • • A 208-terminal low-profile QFP PDV or 209-terminal MicroStar BGA ball-grid array (GHK/ZHK) package 2.5-V core logic and 3.3-V I/O with universal


    Original     		PDF PCI1520 PCI1520I SLLA233 208-terminal 209-terminal 16-bit TPS222X On ghk diode ghk diode 82365SL PCI1520 PCI1520GHK PCI1520IGHK PCI1520IPDV PCI1520IZHK

    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required.


    Original     		PDF 27mm2. UL94V-0

    nec d 588

    Abstract: nec naming rule nec product naming rule NEC CMOS-4
    Text: CMOS-9 3.3-VO LT, 0 .35-MICRON CMOS GATE ARRAYS NEC NEC Electronics Inc. Preliminary March 1995 Description Figure 1. CMOS-9 Package Examples; BGA and QFP NEC's CMOS-9 gate array family provides designers with the performance capabilities and features required


    OCR Scan     		PDF 35-MICRON 66MHz nec d 588 nec naming rule nec product naming rule NEC CMOS-4