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    BGA L Search Results

    BGA L Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    BGA L Price and Stock

    Texas Instruments AWR2943ABGALTQ1

    SENSOR RADAR CAN/GPIO/I2C OUT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey AWR2943ABGALTQ1 Tray 168 1
    • 1 $40.54
    • 10 $33.298
    • 100 $40.54
    • 1000 $40.54
    • 10000 $40.54
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    Mouser Electronics AWR2943ABGALTQ1 671
    • 1 $40.54
    • 10 $33.3
    • 100 $32.44
    • 1000 $32.43
    • 10000 $32.43
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    Ameya Holding Limited AWR2943ABGALTQ1 575
    • 1 -
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    KEMET Corporation C1206C103KBGAL

    .010UF 630V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey C1206C103KBGAL Bulk 1,059
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    • 10000 $0.1699
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    Newark C1206C103KBGAL Bulk 1,059
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    • 1000 $0.153
    • 10000 $0.137
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    Texas Instruments IWR2944ABGALTR

    Industrial, 76-GHz to 81-GHz hig
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    DigiKey IWR2944ABGALTR Reel 1,000
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    • 1000 $29.1158
    • 10000 $29.1158
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    Mouser Electronics IWR2944ABGALTR 1,000
    • 1 $41.55
    • 10 $38.77
    • 100 $33.66
    • 1000 $29.71
    • 10000 $29.71
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    KEMET Corporation C0805H471JBGAL

    470.PF 630V
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    DigiKey C0805H471JBGAL Bulk 19
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    • 100 $9.34632
    • 1000 $9.34632
    • 10000 $9.34632
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    Texas Instruments AWR2944ABGALTQ1

    SENSOR RADAR CAN/GPIO/I2C OUT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey AWR2944ABGALTQ1 Tray 168
    • 1 -
    • 10 -
    • 100 -
    • 1000 $38.44381
    • 10000 $38.44381
    		Buy Now
    Mouser Electronics AWR2944ABGALTQ1 485
    • 1 $53.01
    • 10 $44.64
    • 100 $40.06
    • 1000 $38.67
    • 10000 $38.67
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    Ameya Holding Limited AWR2944ABGALTQ1 544
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    Find more BGA L price and stock on Findchips.com

    BGA L Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    led matrix circuits

    Abstract: 256-pin Plastic BGA BGA-256P-M02
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)


    Original     		PDF BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 led matrix circuits 256-pin Plastic BGA BGA-256P-M02

    led matrix circuits

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M01 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M01 480-pin plastic BGA (BGA-480P-M01)


    Original     		PDF BGA-480P-M01 480-pin BGA-480P-M01) BGA480001SC-2-1 led matrix circuits

    led matrix circuits

    Abstract: fujitsu FUJITSU SEMICONDUCTOR
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M02 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M02 480-pin plastic BGA (BGA-480P-M02)


    Original     		PDF BGA-480P-M02 480-pin BGA-480P-M02) BGA480002SC-2-1 led matrix circuits fujitsu FUJITSU SEMICONDUCTOR

    led matrix circuits

    Abstract: BGA-420P
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M01 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01)


    Original     		PDF BGA-420P-M01 420-pin BGA-420P-M01) BGA420001SC-2-1 led matrix circuits BGA-420P

    led matrix circuits

    Abstract: BGA-420P
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02)


    Original     		PDF BGA-420P-M02 420-pin BGA-420P-M02) BGA420002SC-2-1 led matrix circuits BGA-420P

    256-pin BGA

    Abstract: 24 pin MATRIX led matrix circuits 256-pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)


    Original     		PDF BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 wi256-pin 256-pin BGA 24 pin MATRIX led matrix circuits

    256-pin BGA

    Abstract: led matrix circuits 256-pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)


    Original     		PDF BGA-256P-M04 256-pin BGA-256P-M04) B256009SC-1-3 256-pin BGA led matrix circuits

    led matrix circuits

    Abstract: BGA-272P-M01
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC To Top / Package Lineup / Package Index BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50 mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01)


    Original     		PDF BGA-272P-M01 272-pin BGA-272P-M01) B272001SC-1-3 led matrix circuits BGA-272P-M01

    S 576 B

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC To Top / Package Lineup / Package Index BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ


    Original     		PDF BGA-576P-M01 576-pin BGA-576P-M01) BGA576001SC-2-1 S 576 B

    416-PIN

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 416 PIN PLASTIC To Top / Package Lineup / Package Index BGA-416P-M02 416-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-416P-M02 416-pin plastic BGA (BGA-416P-M02) 40.00±0.10(1.575±.004)SQ


    Original     		PDF BGA-416P-M02 416-pin BGA-416P-M02) BGA416002SC-2-2

    led matrix circuits

    Abstract: 352-PIN matrix led
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M02 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M02 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ


    Original     		PDF BGA-352P-M02 352-pin BGA-352P-M02) BGA352003SC-1-1 led matrix circuits matrix led

    352-pin

    Abstract: led matrix circuits
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M04 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M04 352-pin plastic BGA (BGA-352P-M04) 35.00±0.10(1.378±.004)SQ


    Original     		PDF BGA-352P-M04 352-pin BGA-352P-M04) BGA352005SC-3-1 led matrix circuits

    led matrix circuits

    Abstract: BGA-352P-M03
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M03 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M03 352-pin plastic BGA (BGA-352P-M03) 35.00±0.20(1.380±.008)SQ


    Original     		PDF BGA-352P-M03 352-pin BGA-352P-M03) BGA352004SC-1-1 led matrix circuits BGA-352P-M03

    BGA-35

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M01 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.10(1.378±.004)SQ


    Original     		PDF BGA-352P-M01 352-pin BGA-352P-M01) BGA352002SC-2-2 BGA-35

    BGA-672P-M01

    Abstract: 672pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 672 PIN PLASTIC To Top / Package Lineup / Package Index BGA-672P-M01 672-pin plastic BGA Lead pitch 50 mil Pin matrix 34 Sealing method Resin seal BGA-672P-M01 672-pin plastic BGA (BGA-672P-M01) 45.00±0.10(1.772±.004)SQ


    Original     		PDF BGA-672P-M01 672-pin BGA-672P-M01) BGA672001SC-3-1 BGA-672P-M01 672pin

    BGA-420P

    Abstract: No abstract text available
    Text: PBALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M03 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-420P-M03 420-pin plastic BGA (BGA-420P-M03) 35.00±0.10(1.378±.004)SQ


    Original     		PDF BGA-420P-M03 420-pin BGA-420P-M03) BGA420003SC-2-1 BGA-420P

    led matrix circuits

    Abstract: bga48 48-pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.


    Original     		PDF BGA-48P-M06 48-pin BGA-48P-M06) BGA48006SC-1-2 ar8P-M06) led matrix circuits bga48

    reflow soldering profile BGA

    Abstract: reflow temperature bga BGA PROFILING bga rework
    Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already


    Original     		PDF

    PCN0214

    Abstract: Altera bga BGA PACKAGE OUTLINE 672-BALL EP1M120 EP20K1000E EPXA10 amkor flip alsic
    Text: PROCESS CHANGE NOTICE PCN0214 Copper Lid for Selected Altera BGA and FineLine BGA® Packages Change Description: Altera will be transitioning to an industry-standard copper lid, for its flip-chip BGA and flip-chip FineLine BGA package offerings. Reason for Change:


    Original     		PDF PCN0214 packagesK1500E 1020-Ball EP20K600E 672-Ball EP20K400 EP20K400E PCN0214 Altera bga BGA PACKAGE OUTLINE EP1M120 EP20K1000E EPXA10 amkor flip alsic

    SY68730ZC

    Abstract: MIC29302BT SY68730 sy10s897 0343a KS8721BL Unisem tsmc cmos tsmc cmos 0.35 KSZ8695PX
    Text: Autoclave Pressure Pot Test + 121C / 15 PSIG (With Pre-con 3X Reflow ) MSL Pkg Lds Device D/C Process Qty Hours Rej Assembler L3 L3 L3 L3 BGA BGA BGA BGA 289 289 289 289 KS8695PX KS8695PX KS8695PX KSZ8695PX 0407 0421A 0417A 0452A TSMC .18 TSMC .18 TSMC .18


    Original     		PDF KS8695PX KSZ8695PX KS8721BL KS8995M KS8995X KS8995E SY68730ZC MIC29302BT SY68730 sy10s897 0343a KS8721BL Unisem tsmc cmos tsmc cmos 0.35 KSZ8695PX

    MACH4A

    Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
    Text: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size


    Original     		PDF 208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin MACH4A JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384

    reflow soldering profile BGA

    Abstract: BGA PROFILING solder joint bga warpage bga rework
    Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: • Use caution when profiling to insure minimal temperature difference <15°C and preferably <10°C between components Removal and replacement of BGA packages on printed


    Original     		PDF

    W2639A

    Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
    Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.


    Original     		PDF W2637A, W2638A W2639A an120 5990-3892EN W2639A lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer

    Untitled

    Abstract: No abstract text available
    Text: FDZ5047N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ5047N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging


    Original     		PDF FDZ5047N FDZ5047N