12x12 bga thermal resistance
Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE
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SZZA005
thoseI1450
12x12 bga thermal resistance
SZZA005
micro pitch BGA
A113
TMS320VC549
TMS320VC549GGU
BGA Ball Crack
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Untitled
Abstract: No abstract text available
Text: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been
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DS3802
380mAh
DS3802EXT
DS3802
DS3816
DS3832
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reflow temperature rohs bga
Abstract: No abstract text available
Text: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been
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DS3802
380mAh
DS3802EXT
DS3802
DS3816
DS3832
reflow temperature rohs bga
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micron BGA SDRAM
Abstract: 64MX4 MT48LC64M4A2FB-75 BGA OUTLINE DRAWING
Text: ISSD64M8PBB 512Mb 64Mbits x 8 SDRAM BGA Memory Stack GENERAL DESCRIPTION Irvine Sensors Corporation has developed the next generation of stacked memory that fits within the identical JEDEC monolithic outline as a single BGA chip. The 512Mbit Stacked-SDRAM is a high-speed
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ISSD64M8PBB
512Mb
64Mbits
512Mbit
512Mbit
256Mbit
32Mbit
MT48LC64M
025mm.
micron BGA SDRAM
64MX4
MT48LC64M4A2FB-75
BGA OUTLINE DRAWING
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torque of screw for pcb
Abstract: torque of 4-40 screw for pcb SG-BGA-6180 BGA OUTLINE DRAWING
Text: tapped for 4-40 machine screw x4 55.225mm BGA pad outline A A 5mm typ. 20mm typ. 55.225mm Bottom View Top View 7 Tighten lid screws and socket base screws gradually in an "X" pattern until they are torqued to 1 in-lb each. User's BGA IC 1 Socket Compression Lid: Black anodized Aluminum.
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225mm
525mm
torque of screw for pcb
torque of 4-40 screw for pcb
SG-BGA-6180
BGA OUTLINE DRAWING
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63348-002
Abstract: Framatome Connectors 63348-002 Framatome Connectors Mount Framatome Connectors International so-DIMM connector SO-DIMM 200 dual
Text: Small Outline DIMM With BGA Attachment Small Outline DIMM, Dual 120-Position Features • Dual 120-position connector with a total of 240 positions • Ball Grid Array attachment on 1.30 mm 0.050" pads for surface mount applications • Low profile housing height of
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120-Position
120-position
63348-002
Framatome Connectors 63348-002
Framatome Connectors
Mount Framatome Connectors International
so-DIMM connector
SO-DIMM 200 dual
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ceramic rework
Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability
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25x25x1
ceramic rework
CCGA
BGA Solder Ball collapse
90Pb 10Sn solder paste
304-pin ltcc
MPC105
MPC106
MPC107
BGA PROFILING
spray nozzles
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BGA PACKAGE OUTLINE
Abstract: 14X14 1537M
Text: connected to H2 15.37mm [0.605"] 1.18mm [0.047"] BGA package outline 3.48mm [0.137"] A1 16.48mm [0.649"] Top View 1 1.00mm 1.59mm [0.063"] Bottom View 2.09mm [0.082"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2
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FR4/G10
14X14
FX-BGA160C/BGA160C-01
FX-BGA160C/160C-01
BGA PACKAGE OUTLINE
1537M
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torque of screw for pcb
Abstract: torque of 4-40 screw for pcb BGA OUTLINE DRAWING SG-BGA-6081 35x35 bga
Text: Top View Bottom View tapped for 4-40 machine screw x4 55.225mm BGA pad outline A A 5mm typ. 20mm typ. 55.225mm Side View (Section AA) Tighten lid screws and socket base screws gradually in an "X" pattern until they are torqued to 3.5 to 4 in-lbs each. 1
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225mm
torque of screw for pcb
torque of 4-40 screw for pcb
BGA OUTLINE DRAWING
SG-BGA-6081
35x35 bga
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BGA OUTLINE DRAWING
Abstract: SG-BGA-6078
Text: Top View Bottom View tapped for 4-40 machine screw x4 55.225mm BGA pad outline A A 5mm typ. 15mm typ. 55.225mm Side View (Section AA) Tighten lid screws and socket base screws gradually in an "X" pattern until they are torqued to 3.5 to 4 in-lbs each. 1
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225mm
44x44
SG-BGA-6078
BGA OUTLINE DRAWING
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MS-034-AAn-1
Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
BF957
BG225
BG256
BG352
BG432
BG492
BG560
BG575
BG728
MS-034-AAn-1
ak 957
MS-034 1152 BGA
BGA 31 x 31 mm
MO-047
MS026-ACD
MO-113-AA-AD
MS-034-AAU-1
MO-151 AAL-1
OPD0002
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oki naming format
Abstract: DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj
Text: 1. PACKAGE CLASSIFICATIONS 1-5. 1 1 Package Symbols and Codes Package code The package codes given on the outline view are those specified in ED-7401-2 General Rules for Preparation of Outline Drawings if Integrated Circuits Package Name and Code) established by
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ED-7401-2
oki naming format
DIP42-P-600-2
HQFP208-P-4040-0
R400
S115
0.65mm pitch BGA
PLCC DIMENTIONS
oki marking 20 soj
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240 pin rqfp drawing
Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)
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7000B,
7000AE,
240 pin rqfp drawing
BGA sumitomo
724p
EP1C12
Altera pdip top mark
epm7032 plcc
FBGA672
192 BGA PACKAGE thermal resistance
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PQFP 176
Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●
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144-Pin
100-Pin
256-Pin
780-Pin
256-Pin
68-Pin
PQFP 176
240 pin rqfp drawing
EP3C5E144
EP1K50-208
processor cross reference
EP3C16F484
MS-034 1152 BGA
84 FBGA thermal
TQFP 144 PACKAGE DIMENSION
FBGA 1760
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2032VE
Abstract: 2128VE BGA OUTLINE DRAWING PB1107 Lattice Package Dia
Text: Product Bulletin December 1998 #PB1107 Lattice Introduces Advanced Chip Array and Fine Pitch BGA Packages Introduction Lattice Semiconductor has announced the availability of advanced Chip Array and Fine Pitch BGA ball grid array packages for its ISP logic devices. The first
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PB1107
2000VE
2032VE
2128VE
208-Ball
1-888-ISP-PLDS
BGA OUTLINE DRAWING
PB1107
Lattice Package Dia
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90Pb 10Sn solder paste
Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA
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25x25x1
90Pb 10Sn solder paste
97Pb
BGA OUTLINE DRAWING
ceramic rework
BGA PROFILING
BGA Solder Ball collapse
fine BGA thermal profile
pcb warpage in ipc standard
bga rework
CBGA motorola
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639X
Abstract: LGA 1150
Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter 150mm for SBGA and contain between 250 and 2500 devices.
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330mm
150mm
639X
LGA 1150
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Intel reflow soldering profile BGA
Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems
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EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
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EP4CE6 package
Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
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LGA 1150
Abstract: No abstract text available
Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch
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330mm
LGA 1150
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transistors BC 458
Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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Untitled
Abstract: No abstract text available
Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch
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330mm
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EP20K100E
Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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49-pin
169-pin
EP20K100E
EP20K160E
EP20K200
EP20K200E
EP20K300E
EP20K60E
EP20K100
0245 TQFP-208
208RQFP
280-PGA
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