256-pin Plastic BGA
Abstract: BGA-256P-M21
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M21 256-pin plastic BGA Ball pitch 1.27 mm Package width x package length 27.00 × 27.00 mm Sealing method Plastic mold Mounting height 2.53 mm MAX Weight Approx. 2.7 g BGA-256P-M21
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BGA-256P-M21
256-pin
BGA-256P-M21)
BGA256021Sc-3-3
256-pin Plastic BGA
BGA-256P-M21
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PCN0214
Abstract: Altera bga BGA PACKAGE OUTLINE 672-BALL EP1M120 EP20K1000E EPXA10 amkor flip alsic
Text: PROCESS CHANGE NOTICE PCN0214 Copper Lid for Selected Altera BGA and FineLine BGA® Packages Change Description: Altera will be transitioning to an industry-standard copper lid, for its flip-chip BGA and flip-chip FineLine BGA package offerings. Reason for Change:
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PCN0214
packagesK1500E
1020-Ball
EP20K600E
672-Ball
EP20K400
EP20K400E
PCN0214
Altera bga
BGA PACKAGE OUTLINE
EP1M120
EP20K1000E
EPXA10
amkor flip
alsic
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SN74V293
Abstract: No abstract text available
Text: Application Report SDMA002A - April 2002 Design Considerations of SN74V293 FIFO in a MicroSTAR BGA Package Gary Khazan and Andy Pauley Standard Linear & Logic ABSTRACT Texas Instruments’ near-chip-scale MicroSTAR BGA package is gaining in popularity for
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SDMA002A
SN74V293
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IPC-D-317A
Abstract: SN74V293 capacitance in BGA package SDMA002 IPC-D-317
Text: Application Report SDMA002 - June 2001 Design Considerations of SN74V293 FIFO in a MicroSTAR BGA Package Gary Khazan and Andy Pauley Standard Linear & Logic ABSTRACT Texas Instruments’ near-chip-scale MicroSTAR BGA package is gaining in popularity for
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SDMA002
SN74V293
IPC-D-317A
capacitance in BGA package
IPC-D-317
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"0.4mm" bga "ball collapse" height
Abstract: BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 TMS320
Text: TMS320 DSP Number 89 DESIGNER’S NOTEBOOK TMS320C6x Manufacturing with the BGA Package Contributed by David Bell April 14, 1998 Design Problem How do I solder the TMS320C6x to a board? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller
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TMS320
TMS320C6x
TMS320C6201
AN1231.
"0.4mm" bga "ball collapse" height
BGA Solder Ball 0.35mm collapse
BGA Package 0.35mm pitch
BGA Solder Ball collapse
BGA Solder Ball 0.35mm
0.4mm pitch BGA routing
tms320 solder reflow
TMS320 bga
AN1231
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12x12 bga thermal resistance
Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE
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SZZA005
thoseI1450
12x12 bga thermal resistance
SZZA005
micro pitch BGA
A113
TMS320VC549
TMS320VC549GGU
BGA Ball Crack
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GE863-GPS
Abstract: No abstract text available
Text: wireless solutions wireless solutions GE 863-GPS Embedded SiRF Powered The new GE863-GPS is the smallest combined GPRS/GPS module on the market! BGA Package The unique Ball-Grid-Array BGA package enables a very low profile and small product size to design extremely compact applications using location technology.
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863-GPS
GE863-GPS
20-channel
I-34010
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69-pin
Abstract: BGA-69P-M02 019G
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 69 PIN PLASTIC BGA-69P-M02 69-pin plastic FBGA Ball pitch 0.80 mm Pin pitch Package width x package length 8.0 × 11.0 mm Sealing method Plastic mold Mounting height 1.40 mm MAX Weight
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BGA-69P-M02
69-pin
BGA-69P-M02)
B69002S-1C-1
BGA-69P-M02
019G
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BGA-77P-M01
Abstract: No abstract text available
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 77 PIN PLASTIC BGA-77P-M01 77-pin plastic FBGA Ball pitch 0.80 mm Pin pitch Package width x package length 9.0 × 14.0 mm Sealing method Plastic mold Mounting height 1.40 mm MAX Weight
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BGA-77P-M01
77-pin
BGA-77P-M01)
B77001S-1C-1
BGA-77P-M01
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Untitled
Abstract: No abstract text available
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 61 PIN PLASTIC BGA-61P-M02 61-pin plastic FBGA Ball pitch 0.80 mm Pin pitch Package width x package length 9.0 × 9.0 mm Sealing method Plastic mold Mounting height 1.40 mm MAX Weight About 0.16 g
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BGA-61P-M02
61-pin
BGA-61P-M02)
B61002S-1C-1
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BGA-120P-M01
Abstract: 120-PIN BGA120
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC BGA-120P-M01 120-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 13 Package width x package length 12.00 × 12.00 mm Sealing method Plastic mold Mounting height 1.45 mm MAX
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BGA-120P-M01
120-pin
BGA-120P-M01)
B120001S-1C-1
BGA-120P-M01
BGA120
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BGA-484P-M09
Abstract: No abstract text available
Text: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 484 PIN PLASTIC BGA-484P-M09 484-pin plastic TEBGA Ball pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm Max
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BGA-484P-M09
484-pin
BGA-484P-M09)
BGA484009Sc-1-1
BGA-484P-M09
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BGA-320P-M06
Abstract: No abstract text available
Text: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN PLASTIC BGA-320P-M06 320-pin plastic PBGA Lead pitch 1.27 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.46 mm Max
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BGA-320P-M06
320-pin
BGA-320P-M06)
BGA320006S-c-2-1
BGA-320P-M06
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544-PIN
Abstract: BGA-544P-M04 544P KF1027A-2.54-4P
Text: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU MICROELECTRONICS DATA SHEET 544 PIN PLASTIC BGA-544P-M04 544-pin plastic PBGA Lead pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm MAX
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BGA-544P-M04
544-pin
BGA-544P-M04)
BGA544004Sc-3-1
BGA-544P-M04
544P
KF1027A-2.54-4P
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Untitled
Abstract: No abstract text available
Text: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C
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TXB0104
15-kV
SCES650C
500-V
A114-B)
A115-A)
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Untitled
Abstract: No abstract text available
Text: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C
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TXB0104
15-kV
SCES650C
500-V
A114-B)
A115-A)
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Untitled
Abstract: No abstract text available
Text: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C
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TXB0104
15-kV
SCES650C
500-V
A114-B)
A115-A)
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jesd 51-7
Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Text: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs
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SZZA040
54BGA
54-ball
MO-205,
16-bit
jesd 51-7
63 ball Vfbga thermal resistance
56DL
metcal apr 5000
MO-205
56ZQL
BGA Ball Crack
054UG08C127
APR-5000
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Untitled
Abstract: No abstract text available
Text: TMS320C6472 SPRS612G – JUNE 2009 – REVISED JULY 2011 1.1 www.ti.com CTZ/ZTZ BGA Package Bottom View The TMS320C6472 devices are designed for a package temperature range of 0°C to 85°C (commercial temperature range) or -40°C to 100°C (extended temperature range).
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TMS320C6472
SPRS612G
TMS320C6472
500-MHz
625-MHz
737-Pin
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BGA-3000
Abstract: Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3
Text: CSP-UG Chip-Scale Upgrade Kit for BGA-3000 Series Rework System 1 The rapidly emerging Chip-Scale Package has been associated with many challenges in both the rework and prototyping environment. This particular package demands a specifically tailored rework solution while maintaining user-friendliness.
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BGA-3000
241mm)
Intel reflow soldering profile BGA
BGA-3102
BGA-3101
convection oven temperature sensor
intel 3102
DIAPHRAGM PUMP
rtd 2025
vacuum pump
28F008B3
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AceXtreme C SDK Software Reference Manual
Abstract: No abstract text available
Text: Total-AceXtreme Ultra-Small, Ultra-Low Power MIL-STD-1553 Single Package Solution Model: BU-67301B Data Sheet World's smallest, ultra low power, fully integrated MIL-STD-1553 BGA package, complete with 1553 protocol, 2 Mb 64K x 36 RAM, transceivers, and isolation transformers inside a single package — saves board space and
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MIL-STD-1553
BU-67301B
D-80993
Blk-327
AceXtreme C SDK Software Reference Manual
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MCP 256M nand toshiba
Abstract: TY80009000AMGF toshiba mcp FBGA149 toshiba mcp nand 512M nand mcp nand sdram mcp TOSHIBA M9
Text: TY80009000AMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY80009000AMGF is a mixed multi-chip package containing a 268,435,456-bit Low Power Synchronous DRAM and a 553,648,128-bit Nand E2PROM. The TY80009000AMGF is available in a 149-pin BGA package
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TY80009000AMGF
TY80009000AMGF
456-bit
128-bit
149-pin
P-FBGA149-1013-0
N-39/39
MCP 256M nand toshiba
toshiba mcp
FBGA149
toshiba mcp nand
512M nand mcp
nand sdram mcp
TOSHIBA M9
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TXS0104EZXUR
Abstract: TXS01xx
Text: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3
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TXS0104E
SCES651C
000-V
A114-B)
A115-A)
15-kV
TXS0104EZXUR
TXS01xx
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TPA2000D1PW
Abstract: TPA2000D1PWR 2512067007Y3 GRM235-Y5V106Z16 SCD0703T TPA2000D1 TPA2000D1GQCR
Text: TPA2000D1 2-W FILTERLESS MONO CLASS-D AUDIO POWER AMPLIFIER SLOS328E – JUNE 2000 – REVISED MAY 2003 D Modulation Scheme Optimized to Operate PW PACKAGE TOP VIEW Without a Filter D 4 mm x 4 mm MicroStar Junior BGA and D D D D D TSSOP Package Options
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TPA2000D1
SLOS328E
TPA2000D1PW
TPA2000D1PWR
2512067007Y3
GRM235-Y5V106Z16
SCD0703T
TPA2000D1
TPA2000D1GQCR
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