AH35
Abstract: AA10 AM11 AN10 AN11 EP20K1000C 817 g24 b34 844 AB30 af31
Text: EP20K1000C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8
|
Original
|
EP20K1000C
652-Pin
672-Pin
020-Pin
AH35
AA10
AM11
AN10
AN11
817 g24
b34 844
AB30
af31
|
PDF
|
AA10
Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
Text: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8
|
Original
|
EP20K600C
652-Pin
672-Pin
020-Pin
AA10
AE10
AF10
AG10
AJ10
AK10
AF31
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Number: 599-10-676-13-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-000 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-000429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929
|
Original
|
C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Number: 587-10-676-13-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-005 26 X 26 # Of Pins Mill-Max Part Number 676 587-10-676-13-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737
|
Original
|
C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Number: 599-10-676-13-001429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-001 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-001429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929
|
Original
|
C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
|
PDF
|
AG10
Abstract: AJ10 AK10 b3640 b1333 B10-301 B9432 b12123 B8528
Text: EPXA4 I/O Pins ver. 1.20 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7
|
Original
|
020-Pin
672-Pin
TRACEPKT10
TRACEPKT11
AG10
AJ10
AK10
b3640
b1333
B10-301
B9432
b12123
B8528
|
PDF
|
B8530
Abstract: OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640 672-pin
Text: EPXA4 I/O Pins ver. 1.21 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7
|
Original
|
020-Pin
672-Pin
TRACEPKT10
TRACEPKT11
B8530
OAH29
B13101
AG10
AJ10
B10-276
B8472
B1370
B3640
|
PDF
|
fg676
Abstract: 676-Pin bga pin 676
Text: R Package Drawings Ball Fine Pitch Packages - FG676 676-PIN FINE PITCH BGA FG676 11-62 August 12, 1999 (Version 1.4)
|
Original
|
FG676
676-PIN
FG676)
fg676
bga pin 676
|
PDF
|
676 BGA package tray
Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)
|
Original
|
BGA27
27ESP
225-pin
256-pin
272-pin
316-pin
320-pin
352-pin
385-pin
400-pin
676 BGA package tray
tray bga
BGA package tray
jedec bga tray
NEC 2415
tray bga 27
|
PDF
|
Untitled
Abstract: No abstract text available
Text: MEMORY MODULE SDRam 32Mx72-BGA 3D SD2G72VB5489 -pjuspj a HEICO company Synchronous Dynamic Ram MODULE 2Gbit SDRam organized as 32Mx72, based on 32Mx16 Pin Assignment Top View BGA 134 - (9x15 - Pitch : 1.27 mm) (TOP VIEW- VIEWED BY TRANSPARENCY) 9 8 7 6 5
|
OCR Scan
|
32Mx72-BGA
SD2G72VB5489
32Mx72,
32Mx16
512Mbit
32Mx72-bit.
3DFP-0489-REV
|
PDF
|
F33 1067
Abstract: 1010 817 f15 AA10 AM11 AN10 EP20K1500C 837 B34 AM3 940
Text: EP20K1500C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 1,020-Pin FineLine BGA 1 1 1 – 1 1 1 – – 1 1 1 1 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 1 2 3 4 5 6
|
Original
|
EP20K1500C
652-Pin
020-Pin
F33 1067
1010 817 f15
AA10
AM11
AN10
837 B34
AM3 940
|
PDF
|
Recommended land pattern smd-0.5
Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout
|
Original
|
TN1074
Recommended land pattern smd-0.5
"x-ray machine"
Lattice Semiconductor Package Diagrams 256-Ball fpBGA
pcb fabrication process
ultra fine pitch BGA
LC4064ZE
package dimension 256-FTBGA
nomenclature pcb hdi
of BGA Staggered Pins package
BN256
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SLC90E42 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E42 NorthBridge Member of High Performance TeXas Chipset FEATURES 324 Pin BGA North Bridge Chip Supports the Pentium C om patible Processor with Host Bus from 60 MHz to 75 MHz at 3.3V and
|
OCR Scan
|
SLC90E42
SLC90E42
|
PDF
|
9042h
Abstract: DRB102
Text: SLC90E42 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E42 NorthBridge Member of High Performance TeXas Chipset FE A TU R E S 324 Pin BGA North Bridge Chip Supports the Pentium Compatible Processor with Host Bus from 60 MHz to 75 MHz at 3.3V and
|
OCR Scan
|
SLC90E42
SLC90E42
64Mbit
9042h
DRB102
|
PDF
|
|
|
OT239
Abstract: AF2310 EPXA10F1020 AA10 AC10 AD10
Text: EPXA10F1020 I/O Pins ver. 1.4 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 1,020-Pin FineLine BGA 1 VCCINT VCCINT 2 GNDINT GND 3 VCCINT VCCINT 4 GNDINT GND 5 VCCINT VCCINT 6 GNDINT GND 7 VCCINT VCCINT 8 GNDINT GND 13 9 I/O E6 13 10 I/O A8 11 VCCINT
|
Original
|
EPXA10F1020
020-Pin
VCCIO13
OT239
AF2310
AA10
AC10
AD10
|
PDF
|
676 BGA package tray
Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)
|
Original
|
BGA27
27ESP
225-pin
256-pin
272-pin
316-pin
320-pin
352-pin
676 BGA package tray
BGA package tray
NEC 2415
tray bga
676-Pin
596-PIN
27ES
jedec tray BGA
tray datasheet bga
BGA JEDEC tray
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO: VL53B5263A-K9S-F8S-E7S REV: 1.0 General Information 4GB 512MX72 DDR3 SDRAM ECC 244 PIN Mini-RDIMM Description: The VL53B5263A is a 512Mx72 DDR3 SDRAM high density Mini-RDIMM. This memory module consists of eighteen CMOS 256Mx8 bit with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered
|
Original
|
VL53B5263A-K9S-F8S-E7S
512MX72
VL53B5263A
256Mx8
28-bit
244-pin
244-pin,
|
PDF
|
DDR3-1066
Abstract: DDR3-1333 PC3-10600 A0222 VL53B5263A-K9S-F8S-E7S A6211
Text: Product Specifications PART NO: VL53B5263A-K9S-F8S-E7S REV: 1.0 General Information 4GB 512MX72 DDR3 SDRAM ECC 244 PIN Mini-RDIMM Description: The VL53B5263A is a 512Mx72 DDR3 SDRAM high density Mini-RDIMM. This memory module consists of eighteen CMOS 256Mx8 bit with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered
|
Original
|
VL53B5263A-K9S-F8S-E7S
512MX72
VL53B5263A
256Mx8
28-bit
244-pin
A10/AP
A12/BC#
DDR3-1066
DDR3-1333
PC3-10600
A0222
VL53B5263A-K9S-F8S-E7S
A6211
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL33B2K66F-K9S REV: 1.0 General Information 16GB 2Gx72 DDR3 SDRAM ULP ECC REGISTERED DIMM 240-PIN Description The VL33B2K66F is a 2Gx72 DDR3 SDRAM high density RDIMM. This four rank memory module consists of eighteen DDP CMOS 1Gx8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages, a 28-bit registered
|
Original
|
VL33B2K66F-K9S
2Gx72
240-PIN
VL33B2K66F
28-bit
240-pin
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered
|
Original
|
VL43B1G63A-K0/K9/F8/E7M
1Gx72
204-PIN
VL43B1G63A
512Mx8
28-bit
204-pin
|
PDF
|
rda 1846
Abstract: PC3-10600
Text: Product Specifications PART NO: REV: 1.0 VL33B1K60A-K9S/F8S/E7S General Information 8GB 1GX72 DDR3 SDRAM ECC 240 PIN RDIMM Description: The VL33B1K60A is a 1Gx72 DDR3 SDRAM high density RDIMM. This memory module consists of thirty-six CMOS 512Mx4 bit with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered buffer/PLL
|
Original
|
VL33B1K60A-K9S/F8S/E7S
1GX72
VL33B1K60A
512Mx4
28-bit
240-pin
DQS17
DQS17
rda 1846
PC3-10600
|
PDF
|
E1 3005-2
Abstract: rda 1846
Text: Product Specifications REV: 1.0 VL33B1K60A-K9S/F8S/E7S PART NO: General Information 8GB 1GX72 DDR3 SDRAM ECC 240 PIN RDIMM Description: The VL33B1K60A is a 1Gx72 DDR3 SDRAM high density RDIMM. This memory module consists of thirty-six CMOS 512Mx4 bit with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered buffer/PLL
|
Original
|
VL33B1K60A-K9S/F8S/E7S
1GX72
VL33B1K60A
512Mx4
28-bit
240-pin
E1 3005-2
rda 1846
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered
|
Original
|
VL43B1G63A-K0/K9/F8/E7M
1Gx72
204-PIN
VL43B1G63A
512Mx8
28-bit
204-pin
|
PDF
|
DDR3-1066
Abstract: DDR3-1333 PC3-10600 A6211
Text: Product Specifications PART NO.: VL53B5269E-K9S/F8S/E7S REV: 1.0 General Information 4GB 512M x 72 DDR3 SDRAM VLP ECC Mini-RDIMM 244-PIN Description The VL53B5269E is a 512M x 72 DDR3 SDRAM high density Mini-RDIMM. This memory module consists of nine stacked CMOS 512M x 8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered
|
Original
|
VL53B5269E-K9S/F8S/E7S
244-PIN
VL53B5269E
28-bit
244-pin
VN-240909
DDR3-1066
DDR3-1333
PC3-10600
A6211
|
PDF
|
