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    BGA SOLDER BALL 1MM Search Results

    BGA SOLDER BALL 1MM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    BGA SOLDER BALL 1MM Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SG-BGA-6118

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless 11.11mm 1mm dia. channel Features Directly mounts to target PCB needs tooling holes with hardware. 6.01mm Top View High speed, reliable Elastomer connection 6.18mm Minimum real estate required 11.11mm Compression plate distributes forces evenly


    Original     		45M-1994. 16x16 SG-BGA-6118 PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    entek Cu-56

    Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
    Text: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


    Original     		20ppm/ 5989-0834EN AV02-0769EN entek Cu-56 bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile PDF

    AN-1126

    Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement
    Text: Table of Contents Introduction . 2 Package Overview . 3


    Original     		AN-1126 AN-1126 AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement PDF

    9928

    Abstract: No abstract text available
    Text: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


    Original     		XXX-XX-054-04-005 XXX-XX-064-04-000 XXX-XX-100-05-000 XXX-XX-165-01-005 XXX-XX-168-07-005 XXX-XX-196-07-000 XXX-XX-208-08-001 XXX-XX-256-08-007 XXX-XX-324-09-000 XXX-XX-324-11-005 9928 PDF

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


    Original     		adap005 XXX-XX-064-04-000 XXX-XX-100-05-000 XXX-XX-165-01-005 XXX-XX-168-07-005 XXX-XX-196-07-000 XXX-XX-208-08-001 XXX-XX-256-08-007 XXX-XX-324-09-000 XXX-XX-324-11-005 PDF

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


    Original     		XXX-XX-054-04-005 XXX-XX-064-04-000 XXX-XX-100-05-000 XXX-XX-165-01-005 XXX-XX-168-07-005 XXX-XX-196-07-000 XXX-XX-208-08-001 XXX-XX-256-08-007 XXX-XX-324-09-000 XXX-XX-324-11-005 PDF

    LPC2468 reflow solder profile

    Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,


    Original     		AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross PDF

    entek Cu-56

    Abstract: Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability
    Text: Surface Laminar Circuit SLC Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array


    Original     		Cu-56 5989-0491EN AV02-0770EN entek Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability PDF

    PCB layout guidelines for NXP MCUs in BGA packages

    Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,


    Original     		AN10778 LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, PCB layout guidelines for NXP MCUs in BGA packages LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern PDF

    BGA PROFILING

    Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile
    Text: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


    Original     		20ppm/ AV02-0768EN BGA PROFILING BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile PDF

    AN5041

    Abstract: AN-5041 MSX532
    Text: Fairchild Semiconductor Application Note July 2002 Revised July 2002 MSX532 Layout Guidelines Introduction The MSX532 is packaged in a 792-ball plastic BGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ data rates of 150Mbps and registered clock frequencies of 75MHz. The 532 I/O buffers


    Original     		MSX532 792-ball 150Mbps 75MHz. AN5041 AN-5041 PDF

    OCX256

    Abstract: BGA Solder Ball 1mm LAYOUT GUIDELINES
    Text: Application Note 5039 OCX256 Layout Guidelines 1.0 Introduction The OCX256 is packaged in a 792-ball plastic TBGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 667Mb/s and registered data modes of 333MHz. The 128 Inputs and 128 Outputs are each configured as dedicated differential ports. The


    Original     		OCX256 792-ball 667Mb/s 333MHz. AN500757 BGA Solder Ball 1mm LAYOUT GUIDELINES PDF

    Untitled

    Abstract: No abstract text available
    Text: Application Note 5041 MSX532 Layout Guidelines 1.0 Introduction The MSX532 is packaged in a 792-ball plastic BGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 300Mbps and registered clock frequencies of 200MHz. The 532


    Original     		MSX532 792-ball 300Mbps 200MHz. AN500759 PDF

    BGA reflow guide

    Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to


    Original     		PDF

    I-CUBE

    Abstract: OCX256
    Text: Technical Note OCX256 Layout Guidelines 1.0 Introduction The OCX256 is packaged in a 792-ball plastic TBGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 667Mb/s and registered data modes of 333MHz. The 128 Inputs and 128 Outputs are each configured as dedicated differential ports. The


    Original     		OCX256 792-ball 667Mb/s 333MHz. I-CUBE PDF

    LAYOUT GUIDELINES

    Abstract: LG jtag MSX532 I-CUBE SDYA011
    Text: Technical Note MSX532 Layout Guidelines 1.0 Introduction The MSX532 is packaged in a 792-ball plastic BGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 300Mbps and registered clock frequencies of 200MHz. The 532


    Original     		MSX532 792-ball 300Mbps 200MHz. inte8800, MKT-MSX532-LG LAYOUT GUIDELINES LG jtag I-CUBE SDYA011 PDF

    sn63pb37 solder wire

    Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
    Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen


    Original     		PDF

    Fujitsu

    Abstract: mb29LV160 fujitsu reflow profile SnAgCu QFP208 QFP208 SnPb 336H QFP lead pitch 0.3mm PBGA 256 reflow profile QFP-208
    Text: 1 Fujitsu Lead-free Package Semiconductor Group LSI Packaging Division Fujitsu LSI PACKAGING DIVISION All Rights Reserved, Copyright Fujitsu Limited 2 History of Fujitsu Lead-free Package Development Activities Lead-free Package Development to Commence


    Original     		PDF

    7929

    Abstract: bga PCB footprint
    Text: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


    Original     		PDF

    7929

    Abstract: No abstract text available
    Text: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


    Original     		PDF

    Turn-Key

    Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
    Text:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25


    Original     		75GHz 50-80grams Turn-Key Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets PDF

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF