Untitled
Abstract: No abstract text available
Text: BALL GRID ARRAYS For 1mm Grid Male Pin Adapters & Female Socket Series 5X9 • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929
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XXX-XX-054-04-005
XXX-XX-064-04-000
XXX-XX-100-05-000
XXX-XX-165-01-005
XXX-XX-168-07-005
XXX-XX-196-07-000
XXX-XX-208-08-001
XXX-XX-256-08-007
XXX-XX-324-09-000
XXX-XX-324-11-005
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LPC2468 reflow solder profile
Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,
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AN10778
LPC2220,
LPC2292,
LPC2364,
LPC2368,
LPC2458,
LPC2468,
LPC2470,
LPC2478,
LPC2880,
LPC2468 reflow solder profile
0.65mm pitch BGA
1mm pitch BGA
AN10778
MO-275
TFBGA208
LFBGA32
LPC2468 pcb
SOT1018-1
nxp cross
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AN5041
Abstract: AN-5041 MSX532
Text: Fairchild Semiconductor Application Note July 2002 Revised July 2002 MSX532 Layout Guidelines Introduction The MSX532 is packaged in a 792-ball plastic BGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ data rates of 150Mbps and registered clock frequencies of 75MHz. The 532 I/O buffers
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MSX532
792-ball
150Mbps
75MHz.
AN5041
AN-5041
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Untitled
Abstract: No abstract text available
Text: Application Note 5041 MSX532 Layout Guidelines 1.0 Introduction The MSX532 is packaged in a 792-ball plastic BGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 300Mbps and registered clock frequencies of 200MHz. The 532
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MSX532
792-ball
300Mbps
200MHz.
AN500759
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I-CUBE
Abstract: OCX256
Text: Technical Note OCX256 Layout Guidelines 1.0 Introduction The OCX256 is packaged in a 792-ball plastic TBGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 667Mb/s and registered data modes of 333MHz. The 128 Inputs and 128 Outputs are each configured as dedicated differential ports. The
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OCX256
792-ball
667Mb/s
333MHz.
I-CUBE
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Turn-Key
Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
Text: RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25
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75GHz
50-80grams
Turn-Key
Adapters
Sockets
Product Presentations
Giga-snaP™ BGA SMT Adapters
Receptacles
Prototyping Adapters
Surface Mount Package Emulation
Probing and Analysis Adapters
BGA Sockets
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Lead Free reflow soldering profile BGA
Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
Text: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109
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8833he
485mm)
241mm)
Lead Free reflow soldering profile BGA
BGA-3591
Metcal BGA-3591
Metcal CSP 3502
CSP-3500
BGA-3590
BGA-3592
CSP-085-102
ceramic rework
bga rework
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HXC125
Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The
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1654563-CC
CE-PDF-07-08
HXC125
mm1764
1-1640294-0
1mm pitch BGA socket
1024 ball bga
1640302-3
MM1089
441 ball bga
bga 1296
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transistor CS4
Abstract: BGA Solder Ball 1mm D4047
Text: Issue 1.0 Sept 2001 Description The MSM64V256CB is a 16MBit Fast 3.3V SRAM available in a multichip 192 ball BGA Ball Grid Array package. The device can be organised as 256Kx64, 512Kx32 and 1Mx16. Access times of 15 and 20ns are available at Commercial or Industrial
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MSM64V256CB
16MBit
256Kx64,
512Kx32
1Mx16.
64V256
transistor CS4
BGA Solder Ball 1mm
D4047
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Untitled
Abstract: No abstract text available
Text: 1M x 8 Static RAM MSM81000B - 020 Issue 5.0 December 1999 Description The MSM81000B is a 1M x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature
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MSM81000B
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nsmd smd
Abstract: AN-289 PBGA256
Text: BGA 256-pin Routing 1RWHV Application Note AN-289 By Paul Snell and John Afonasiev ,QWU ,QWURGXFWLRQ IDT uses the 256 PBGA package for several of its products. Although creating an optimal layout with a PBGA package is more challenging than with peripherally leaded packages such as the PQFP, this extra
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256-pin
AN-289
nsmd smd
AN-289
PBGA256
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IPC-9702
Abstract: ipc 9702 Strain gage report bga dye pry black pad strain gage strain gage test IPC9702 4 MUD FR4 1.6mm substrate
Text: FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon, and Vadali Mahadev Altera Corporation, San Jose, CA, USA [email protected] ABSTRACT PCB assembly and handling operations involving excessive
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BGA reflow guide
Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
Text: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using
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N163MZ163
N130MZ327
N161MZ612
N169MZ365
N169MZ641
N158MZ395
BGA reflow guide
"IR Sensor"
ir heat sensor
pcb thermal Design guide trace theta layout
BGA PROFILING
Soldering and desoldering
1mm pitch BGA
BE 4X12
hot air bga
paste profile
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ipc 9704
Abstract: IPC-9702 strain gage test ipc 9702 FR4 1.6mm substrate ansys darveaux CP-01011-1 solder joint IPC9702 strain rosette
Text: MODELING AND EXPERIMENTAL CORRELATION OF BGA SOLDER JOINTS UNDER PCB BENDING Anurag Bansal, Yuan Li, and Vadali Mahadev Altera Corporation 101 Innovation Drive M/S 4101, San Jose, CA 95134, USA [email protected] ABSTRACT This study addresses the effects of varying configurations in
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IPC-9702
ipc 9704
strain gage test
ipc 9702
FR4 1.6mm substrate
ansys darveaux
CP-01011-1
solder joint
IPC9702
strain rosette
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MARKING EU
Abstract: br27
Text: NETWORKS Thick Film R-Network STRUCTURE BGA Resistor Package BR 1 2 3 4 5 6 7 8 Ceramic substrate Thick film inner electrode RuO2 resistive film 1st protective coating amorphous glass 2nd protective coating (epoxy resin) Marking Pb-free solder (SnAgCu: 96.5;3;0.5)
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D-25578
MARKING EU
br27
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1mm pitch BGA
Abstract: No abstract text available
Text: 512K x 8 Static RAM MSM8512B - 020 Issue 5.0 September 1999 Description The MSM8512B is a 512K x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature
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MSM8512B
020/48D
1mm pitch BGA
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Untitled
Abstract: No abstract text available
Text: Description The MSM8512B is a 512K x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature grades. The Chip Size BGA provides an ultra high density
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MSM8512B
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120C
Abstract: 140C 210C
Text: Note Number AN-C1-RW-A Development Tools And Methods APPLICATION NOTE CLEARONE REWORK PROCEDURE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using
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N130MZ327
N163MZ163
N169MZ365
N161MZ612
N169MZ641
120C
140C
210C
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GLS85LS10
Abstract: GLS85LS1032
Text: GLS85LS1002A/1004A/1008B/1016B/1032B/1064B Industrial / Commercial Temp SATA NANDrive Fact Sheet 03.001 May 2014 Features • Industry Standard Serial ATA SATA Host Interface 1) - SATA 1.5 Gb/s or SATA 3.0 Gb/s - ATA/ATAPI-8 compliant - Supports 48-bit address feature set
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S85LS1002A/1004A/1008B/1016B/1032B/1064B
48-bit
20-Byte
10-Byte
S71430-F
GLS85LS10
GLS85LS1032
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thick bga die size
Abstract: fbga Substrate design guidelines
Text: The SuperCSPTM: A Novel Molding Process Technique to Achieve Wafer Scale Packaging Michelle M. Hou Product Marketing Manager Advanced Packaging Technology Package Subcontractng Services Fujitsu; San Jose, CA I. Introduction The mobile cellular phone manufacturers
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30ppm/deg
120ps
160cm
10MPa
150sec
thick bga die size
fbga Substrate design guidelines
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Untitled
Abstract: No abstract text available
Text: CHIP NETWORKS BR EU RoHS BGA抵抗ネットワーク BGA Resistor Networks •構造図 Construction ② ① ③ ④ ⑦ ⑤ ⑥ ネットワーク抵抗器 Network Resistors 外装色：黒 表示色：白抜き文字 Body Color : Black Marking Color : White cutout
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95320w6
Abstract: 95320w pcie Design guide ANSI X3.263-1995 standard intel 82571 82571 95080w QUARTZ XTAL SMD 25MHZ FIXED intel AP-498 82571EB
Text: 82571EB/82572EI Gigabit Ethernet Controller Design Guide Application Note February 2008 Order Number: 315337-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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82571EB/82572EI
Guide--82571-82572
95320w6
95320w
pcie Design guide
ANSI X3.263-1995 standard
intel 82571
82571
95080w
QUARTZ XTAL SMD 25MHZ FIXED
intel AP-498
82571EB
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Untitled
Abstract: No abstract text available
Text: Sample & Buy Product Folder Support & Community Tools & Software Technical Documents TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8B – MARCH 2013 – REVISED MARCH 2014 TPS8269x High-Efficiency MicroSIP Step-Down Converter Profile <1mm 1 Features
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TPS82692,
TPS82693,
TPS826951
TPS82697,
TPS82698
TPS8269x
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Untitled
Abstract: No abstract text available
Text: TPS82692 , TPS82693, TPS82694, TPS826951 TPS82697, TPS82698, TPS82699 www.ti.com SLVSBF8A – MARCH 2013 – REVISED JULY 2013 High-Efficiency MicroSiP TM STEP-DOWN CONVERTER (PROFILE <1mm) Check for Samples: TPS82692 , TPS82693, TPS82694, TPS826951, TPS82697, TPS82698, TPS82699
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TPS82692
TPS82693,
TPS82694,
TPS826951
TPS82697,
TPS82698,
TPS82699
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