BGA THERMAL CYCLING RELIABILITY Search Results

BGA THERMAL CYCLING RELIABILITY Result Highlights (5)

Part	Manufacturer	Description
PQU650M-F-COVER	Murata Manufacturing Co Ltd	PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical
TCTH011AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type
TCTH022AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function
TCTH021AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type
TCTH012BE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function

BGA THERMAL CYCLING RELIABILITY Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
ceramic rework Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability	Original	25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles	PDF
90Pb 10Sn solder paste Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA	Original	25x25x1 90Pb 10Sn solder paste 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola	PDF
PBGA 256 reflow profile Abstract: bt 2328 pbga 144 BGA cte pbga JESD22-A113 OSP FLIPCHIP CRACK 304-pin dimensions bga jedec thermocouple WELD nsmd smd Text: Customer Applications Support and Reliability Test Center Page 1 Motorola General Business Information Customer Applications Support and Reliability Test Center Customer support for new and current packaging technology; Package-to-board Interconnect reliability	Original		PDF
73507 Abstract: IPC-9701 IPC-A-610D ekra e5 SAC387 tamura tlf tamura solder paste Cold solder joint pyramax mosfet so8 smd Text: AN610 Vishay Siliconix PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701 By Kandarp Pandya ABSTRACT PolarPAK, a thermally enhanced package from Vishay Intertechnology, facilitates MOSFET heat removal from an exposed top metal lead-frame connected to a	Original	AN610 IPC-9701 IPC-9701 31-Aug-05 73507 IPC-A-610D ekra e5 SAC387 tamura tlf tamura solder paste Cold solder joint pyramax mosfet so8 smd	PDF
BGA heatsink compressive force Abstract: BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga Text: Development of BGA Solution for the IBM PowerPC 970 Module in Apple's Power Mac G5 Presented at ECTC 2004 David Edwards, Hope Chambers, Mukta Farooq, Lewis Goldmann, Amir Salehi* IBM Microelectronics, 2070 Route 52, Hopewell Jct, NY 12533 Apple Computer, 1 Infinite Loop, Cupertino, CA 95014	Original	64-bit BGA heatsink compressive force BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga	PDF
DBGA Abstract: cte table ic bga DIMPLE BGA FR4 0.8mm thickness 0.65mm pitch BGA BGA cte BGA Solder Ball collapse bga thermal cycling reliability Text: 2ND LEVEL INTERCONNECT RELIABILITY OF CERAMIC AREA ARRAY PACKAGES Shingo Sato, Noriyuki Shimizu*, Shin Matsuda, Shoji Uegaki and Sachio Ninomiya Kyocera Corporation Kyoto, Japan Biography During temperature cycling test TCT , CBGAÕs failure usually occurs in the form of an	Original		PDF
JESD22-A104-A Abstract: JESD22-A110-A JESD22-A-104-A JESD22-A102-B JESD22A104-A JESD22-A101-B J-STD-020A T100 Text: Plastic Package Reliability & Testing June 1999, ver. 1 Introduction Application Note 113 Designers expect Altera® devices to perform in a variety of environments and conditions. Reliable devices decrease design and maintenance costs and increase product life cycles. Altera submits its devices to a series of	Original		PDF
AN2034 Abstract: Infineon power diffusion process AN2036 Infineon diffusion solder an2034 st bga thermal cycling reliability AN-2034 TQFP100 solder joint reliability reflow temperature bga Text: AN2034 APPLICATION NOTE Soldering Compatibility Backward and Forward COMPATIBILITY OF LEAD-FREE COMPONENTS The semiconductor industry is moving towards the elimination of lead from packages, in accordance with new international regulations. This concerns both solder paste, for the board mounting process, as well as semi-conductor packages	Original	AN2034 AN2034 Infineon power diffusion process AN2036 Infineon diffusion solder an2034 st bga thermal cycling reliability AN-2034 TQFP100 solder joint reliability reflow temperature bga	PDF
underfill Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate Text: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 [email protected] Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package	Original	12x10-6 17x10-6 6x10-6 underfill cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate	PDF
7H9739 Abstract: BGA770 7J9810 bga thermal cycling reliability 7-H-97 Text: PAGE 1 OF 6 ATMEL CORPORATION Tel: 408 441-0311 Fax:(408)436-4200 AT-49BV080 FLASH MEMORY RELIABILITY DATA - 125°C OPERATING LIFETEST (PLASTIC) - 15 PSIG PRESSURE POT - EXTENDED THERMAL SHOCK - 150°C RETENTION BAKE (PLASTIC) - EXTENDED TEMPERATURE CYCLING	Original	AT-49BV080 AT-49BV080 7H0752-1 7J2594 7J2595 7J2596-1 8E4337 7H9743 7J9810 7H9739 BGA770 7J9810 bga thermal cycling reliability 7-H-97	PDF
ansys darveaux Abstract: pitarresi ansys optimization BGA Ball Crack 8L-10L Text: Solder Joint Reliability Model with Modified Darveaux’s Equations for the micro SMD Wafer Level-Chip Scale Package Family L. Zhang, R. Sitaraman*, V. Patwardhan, L. Nguyen, and N. Kelkar National Semiconductor Corporation 3707 Tahoe Way, M/S 19-100 Santa Clara, CA 95051	Original		PDF
SAC405 Abstract: IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station Text: Introduction to the Plastic Ball Grid Array PBGA Q1, Burnette 2008 Terry Dec. 15, 2005 TM Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc in the US and other countries. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc. 2008. The information provided is typical to the industry and is not intended to represent	Original	countrieESD51 JESD5112, SAC405 IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station	PDF
pcb warpage in ipc standard Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387 Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.	Original		PDF
106 10k 804 Abstract: 106F 213B Text: CTS ClearONE Terminator Reliability Test Data RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN &	Original		PDF

CBGA 255 motorola Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in	Original	AN1850/D CBGA 255 motorola 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin	PDF
62Sn36Pb2Ag Abstract: 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302 Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Freescale Semiconductor Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in	Original	AN1850/D 62Sn36Pb2Ag 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302	PDF
SnPb36Ag2 Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100 Text: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation	Original	2002/95/E SnPb36Ag2 Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100	PDF
JEDEC JESD22-B117 Abstract: JESD22-B117 Solder Paste, Indium 5.8 N41 250 y 803 IPC-9504 10k resistor 1/8 watt datasheet hot air bga Solder Paste, Indium 5.1, Type 3 10k resistor 1/4 watt datasheet Text: RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN & REPORT .4	Original		PDF
General Micro-electronics Abstract: SMT pitch roadmap ansys darveaux ansys CP-01019-1 Electronic Arrays FR4 thermal expansion constant vs temperature neural network BGA cte amkor flip Text: Building Reliability Into Full-Array BGAs Yuan Li, Ph.D., Anil Pannikkat, Ph.D., Larry Anderson, Tarun Verma, Bruce Euzent Altera Corporation 101 Innovation Drive, San Jose, CA 95134 Electronic Arrays, NEC, IMP and Altera Corp. He joined Altera in 1992 and is currently Director	Original		PDF
BGA and QFP Altera Package mounting profile Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine	Original		PDF
J-STD-004 Abstract: BERG strip connector J-STD-004 solder wire BERG STRIP J-STD-005 74390 EL-2003-10-09 ANSI-J-STD-002 GS 069 bga dye pry Text: TYPE NUMBER PRODUCT SPECIFICATION GS-12-100 TITLE PAGE MEG-Array 81, 100, 200, 240, 300, 400 & 528 Positions REVISION 1 of 15 AUTHORIZED BY J DATE D. Harper 28 Aug 06 CLASSIFICATION UNRESTRICTED 1.0 OBJECTIVE This specification defines the performance, test, quality, and reliability requirements of the MEG-Array™	Original	GS-12-100 2002/95/EC) V90413 GS-01-001, V01949 V10218 V21506 V03-1179 V03-1244 V04-0883 J-STD-004 BERG strip connector J-STD-004 solder wire BERG STRIP J-STD-005 74390 EL-2003-10-09 ANSI-J-STD-002 GS 069 bga dye pry	PDF
35 x 35 PBGA, 580 100 balls Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8	Original	C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP	PDF
transistor smd G46 Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm Text: FBGA User’s Guide Version 4.2 -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG	Original	N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm	PDF
4701 RESISTOR Abstract: No abstract text available Text: BR02M560.0A - Rev A - Page 1 of 2 Product Family: Thin Film SMT Resistor Networks Part Number Series: Miniature BGA Series Construction: Features: •         High Purity Alumina Oxide Substrate Ni alloy thin-film resistive element	Original	BR02M560 ON/30 4701 RESISTOR	PDF

BGA THERMAL CYCLING RELIABILITY Search Results

BGA THERMAL CYCLING RELIABILITY Result Highlights (5)

BGA THERMAL CYCLING RELIABILITY Datasheets Context Search

ceramic rework

90Pb 10Sn solder paste

PBGA 256 reflow profile

73507

BGA heatsink compressive force

DBGA

JESD22-A104-A

AN2034

underfill

7H9739

ansys darveaux

SAC405

pcb warpage in ipc standard

106 10k 804

CBGA 255 motorola

62Sn36Pb2Ag

SnPb36Ag2

JEDEC JESD22-B117

General Micro-electronics

BGA and QFP Altera Package mounting profile

J-STD-004

35 x 35 PBGA, 580 100 balls

transistor smd G46

4701 RESISTOR