zener diode c12
Abstract: ZENER SINGLE COLOR CODE c12 zener zener diode code color zener c12 MARKING band color code zener
Text: 1N4728G-1N4758G Pb 1W DO-41 Zener Voltage Regulators RoHS COMPLIANCE DO-41 Features Zener Voltage Range 3.3. to 56Volts. DO-41 Package JEDEC Through-Hole Device Type Mounting Hermetically Sealed Glass Compression Bonded Construction All External Suface Are Corrosion Resistant And
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1N4728G-1N4758G
DO-41
DO-41
56Volts.
MIL-STD-202,
260oC//10
zener diode c12
ZENER SINGLE COLOR CODE
c12 zener
zener diode code color
zener c12
MARKING band color code zener
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161000F00000
Abstract: 4949G heat staking
Text: Home | Contact Us | About Aavid | Sales Rep Log In -Useful Links- Products Search by part # / Interface Materials / Adhesives Thermal Adhesives Ther - O- Bond 1500 Check distributor part inventory Epoxy casting system for potting and encapsulation Ther - O- Bond 1600
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4949G
4950G
4951G
4952G
4953G
161000F00000
4949G
heat staking
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5SMY 12J1721
Abstract: No abstract text available
Text: Data Sheet, Doc. No. 5SYA 1325-01 12 01 5SMY 12J1721 IGBT-Die VCE = 1700 V IC = 75 A Ultra low loss thin IGBT die Highly rugged SPT+ design Large bondable emitter area Passivation: Silicon Nitride plus Polyimide Maximum rated values 1 Parameter Collector-emitter voltage
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12J1721
CH-5600
5SMY 12J1721
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Untitled
Abstract: No abstract text available
Text: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSOP-6 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 1040 520 000 200 C + N2 FAIL PERCENTAGE 0.00 HAST 4045 408 010 130 C, 85 % RH 0.00
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M2003
08-May-12
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Untitled
Abstract: No abstract text available
Text: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR DPAK, TO-252, TO-251 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 40 20 000 200 C + N2 FAIL PERCENTAGE 0.00 HAST 1691 169 100 130 C, 85 % RH
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O-252,
O-251
M2003
08-May-12
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driver photodiode rx
Abstract: driver photodiode tia PHY1095 1.25G ROSA optical pickup unit connections PHY1095-01DS-WR PHY1095-01DS-FR PHY1095-01 pdc1
Text: 19-5689; Rev 1/11 PHY1095-01 A Maxim Integrated Products Brand 1.25Gbps High Sensitivity Transimpedance Amplifier Features Description -32dBm Sensitivity Up to 1.25Gbps NRZ data rates 60nA rms typical input referred noise Automatic gain control Flexible bond pad layout and output signal
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PHY1095-01
25Gbps
-32dBm
25Gbps
PHY1095
PHY1095-01-RD-1
driver photodiode rx
driver photodiode tia
1.25G ROSA
optical pickup unit connections
PHY1095-01DS-WR
PHY1095-01DS-FR
PHY1095-01
pdc1
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Untitled
Abstract: No abstract text available
Text: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SC-89 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 160 80 000 200 C + N2 FAIL PERCENTAGE 0.00 HAST 1705 180 500 130 C, 85 % RH 0.00 0.00
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SC-89
M2003
08-May-12
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connector cross reference
Abstract: UL444 1533* belden 7929A0101000
Text: Detailed Specifications & Technical Data ENGLISH MEASUREMENT VERSION 7929A Multi-Conductor - Category 5e DataTuff Twisted Pair Cable For more Information please call 1-800-Belden1 Description: 24 AWG Bonded-Pairs solid bare copper conductors, polyolefin insulation, overall Beldfoil® shield 100%
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1-800-Belden1
200MHz
100BaseTX,
100BaseVG
155ATM,
622ATM,
AES51,
RS-422,
RJ-45
66-7929A-1000
connector cross reference
UL444
1533* belden
7929A0101000
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thermoelectric generator
Abstract: Generator Seebeck Seebeck generator eTEG thermoelectric THERMOELECTRIC POWER GENERATOR Nextreme Thermal Solutions NGA-1004850-0304A-W
Text: eTEG HV56 Power Generator TM Data Sheet Description Part Number Description NGA-1004850-0304A-W With Soldered Wires NGA-1004850-0304A-A Au Wire Bondable Pads Thermoelectric Po ower Generator Part Number Options Features • High power output • Small 3.1mm X 3.3mm footprint
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NGA-1004850-0304A-W
NGA-1004850-0304A-A
APS0017
thermoelectric generator
Generator Seebeck
Seebeck generator
eTEG
thermoelectric
THERMOELECTRIC POWER GENERATOR
Nextreme Thermal Solutions
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Untitled
Abstract: No abstract text available
Text: Silicon Switching Diodes 1N4150, 1N4150-1 & 1N3600 Features • Available in JAN, JANTX, and JANTXV per MIL-PRF-19500/231 • Metallurgically Bonded • Hermetically Sealed • Double Plug Construction Maximum Ratings Operating & Storage Temperature: -65°C to +175°C
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1N4150,
1N4150-1
1N3600
MIL-PRF-19500/231
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RJ45 5e connector
Abstract: No abstract text available
Text: Detailed Specifications & Technical Data ENGLISH MEASUREMENT VERSION E500003 Cord Sets - DataTuff Cat 5e IP67 RJ45 Cord Set For more Information please call 1-800-Belden1 Description: 3 meter 9.8 ft. , unshielded with solid conductors (ref: Belden Bonded-Pair Cable 7923A). Cable Rating
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E500003
1-800-Belden1
566-E500003010B32
010B32
RJ45 5e connector
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E500002
Abstract: belden rj45 connector
Text: Detailed Specifications & Technical Data ENGLISH MEASUREMENT VERSION E500002 Cord Sets - DataTuff Cat 5e IP67 RJ45 Cord Set For more Information please call 1-800-Belden1 Description: 2 meters 6.6 ft. , unshielded with solid conductors (ref: Belden Bonded-Pair Cable 7923A). Cable Rating
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E500002
1-800-Belden1
566-E500002010B40
010B40
belden rj45 connector
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E85381
Abstract: No abstract text available
Text: RAYCHEM Tubing Products 1 CGAT Heat-shrinkable Tubing Adhesive-Lined, Flexible, Polyolefin Heat-Shrinkable Tubing Product Facts 3:1 Shrink ratio High-strength bonding • Moisture-proof ■ Environmental sealing ■ RoHS compliant ■ ■ Specifications/Approvals
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1n5551
Abstract: 1n5552
Text: 1N5550 to 1N5552 VISHAY Vishay Semiconductors Standard Sinterglass Diode Features • Cavity-free glass passivated junction • High temperature metallurgically bonded construction • Hermetically sealed package • Medium switching for improved efficiency
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1N5550
1N5552
MIL-STD-750,
1N5551
1N5552
18-Jul-08
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IEC, cyclic moisture resistance test
Abstract: IEC60286-1
Text: LCA. Vishay Draloric Carbon Film Resistors, Standard FEATURES • Securely bonded carbon film • Good moisture resistance ΔRmax ≤ ± 1.5 % R • Good long term stability (ΔRmax ≤ ± 1.5 % R, for 1000 h) • Lead (Pb)-free solder contacts • Pure tin plating provides compatibility with lead (Pb)-free
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2002/95/EC
18-Jul-08
IEC, cyclic moisture resistance test
IEC60286-1
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APD0810-203
Abstract: APD1510 APD0510-210
Text: DATA SHEET APD Series: Silicon PIN Diodes, Packaged and Bondable Chips Applications • Switches • Attenuators Features • Established Skyworks PIN diode process • Low capacitance designs to 0.05 pF • Voltage ratings to 200 V • Chip size < 15 mils square
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APD0505-000
200075M
APD0810-203
APD1510
APD0510-210
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LR38595
Abstract: RS-433
Text: GNR 45MM Series • Current ratings 35 and 45 amps • Output voltage 48-600 VAC • Direct Bond Copper DBC Substrate • LED input status indicator • 100K cycle UL508 Endurance Rating • UL / CSA / TUV Approved, CE Compliant • EMC Compliant Level 3
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UL508
GNR35DHZ
GNR35BHZ
GNR35AHZ
GNR45DHZ
GNR45BHZ
GNR45AHZ
47-63Hz)
GNR35
GNR45
LR38595
RS-433
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AWM 2651 VW-1 300V
Abstract: 2651 300V 14 pin AWM 2651
Text: 3M Round Conductor Flat Cable .050" 28 AWG Stranded, PVC 3667 Series • Combines the routing ease of discrete wire round cable with the mass termination capabilities of a ribbon cable • Split conductor sections allow for easy routing • One inch bonded cable sections of 28 AWG wire on
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TS-0247-B
RIA-2217B-E
AWM 2651 VW-1 300V
2651 300V 14 pin
AWM 2651
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w13002
Abstract: 03352 W1-300
Text: NM1-3216TWC4-01 Feature ◆ ◆ ◆ ◆ Viewing angle:140 deg The materials of the LED dice is InGaN/GaN 3.20mmx1.60mm×0.70mm SMT-LED RoHS compliant lead-free soldering compatible Package Outline RESIN: EPOXY BONDING WIRE:Φ25um Au LED DICE 1 2 PRINTED CIRCUIT BOARD: BT
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NM1-3216TWC4-01
004inch)
W13002
Width10msec.
w13002
03352
W1-300
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Untitled
Abstract: No abstract text available
Text: NM1-AYL1-01 Package outlines 2 RECOMMEND PAD LAYOUT 1 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES ITEM MATERIALS Resin Epoxy Bonding Wire Ø 25 µm Au Lens color Water transparent Dice AlGalnP Emitted color Yellow NOTES: 1. All dimensions are in millimeters inches ;
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NM1-AYL1-01
008inch)
Width10msec.
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NTE621
Abstract: No abstract text available
Text: NTE621 Silicon Rectifier, General Purpose, High Voltage, Standard Recovery Surface Mount Features: D High Temperature Metallurgically Bonded D Glass Passivated Junction D High Temperature Soldering Guaranteed: +450°C/5 Seconds at Terminals. Complete Device Submersible Temperature of
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NTE621
NTE621
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microwave short protector
Abstract: UM9989SM diode mri power UM9989B UM9989
Text: UM9989 FAST MRI PROTECTION DIODES TM KEY FEATURES DESCRIPTION • Metallurgical bond • Planar passivated chip Ultra Low magnetic construction Non cavity design Thermally matched configuration Low capacitance at 0 V bias IMPORTANT: For the most current data, visit our website: www.MICROSEMI.com
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UM9989
Compatibl07
UM9989B
UM9989SM
microwave short protector
UM9989SM
diode mri power
UM9989B
UM9989
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1N649-1
Abstract: 1N649 JANTX
Text: FEATURES 1N649-1 • • • • • 1N649-1 AVAILABLE IN JAN, JANTX, AND JANTXV PER MIL-PRF-19500/240 SILICON RECTIFIER METALLURGICALLY BONDED HERMETICALLY SEALED DOUBLE PLUG CONSTRUCTION MAXIMUM RATINGS AT 25 °C Operating Temperature: Storage Temperature:
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1N649-1
1N649-1
MIL-PRF-19500/240
500mW
400mA,
150mA,
MILPRF-19500/240
DO-35
1N649 JANTX
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ms8351
Abstract: No abstract text available
Text: GaAs Schottky Diodes TM Low CT Series Pair MS8351 – P2819 Flip Chip GaAs Schottky: Series Pair – Low Capacitance Design Dimensions Size: 28 x 19 mils Thickness: 5 mils Bond Pad Size: 5 x 5 mils Features ● Capacitance 45 fF Typ. ● Low Series Resistance (7 Typ.)
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MS8351
P2819
MS8351
p0105
x10-13
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