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Catalog Datasheet	MFG & Type	PDF	Document Tags
SECS II wafer map format Abstract: C075EE UV-tape Text: SL2 ICS50 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 136530 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-L Label ICs on an NXP C075EE process	Original	PDF	ICS50 C075EE ICS5001EW/V7 SECS II wafer map format UV-tape
Untitled Abstract: No abstract text available Text: SL2ICS5311EW/V7 Wafer addendum Rev. 3.0 — 8 May 2008 Product data sheet 131030 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I-CODE SLI-S Label ICs on an NXP C075EE process	Original	PDF	SL2ICS5311EW/V7 C075EE
uv-tape Abstract: ICODE SLI-S SECS II wafer map format Text: SL2ICS5301EW/V7L Wafer addendum Rev. 3.0 — 19 March 2008 Product data sheet 153430 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I-CODE SLI-S Label ICs on an NXP C075EE process	Original	PDF	SL2ICS5301EW/V7L C075EE uv-tape ICODE SLI-S SECS II wafer map format
SECS II wafer map format Abstract: wafer map format uv-tape ICS53 LCR meter for ICs package Text: SL2 ICS53 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 135830 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-S Label ICs on an NXP C075EE process	Original	PDF	ICS53 C075EE ICS5301EW/V7 SECS II wafer map format wafer map format uv-tape ICS53 LCR meter for ICs package
UV-tape Abstract: wafer map Text: SL2 ICS51 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 136630 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-L HC Label ICs on an NXP C075EE	Original	PDF	ICS51 C075EE ICS5101EW/V7 15Contents UV-tape wafer map
SECS II wafer map format Abstract: C075EE uv-tape ICODE SLI-S ICS5401 SL2ICS54 wafer map format Text: SL2 ICS54 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 135930 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-S HC Label ICs on an NXP C075EE	Original	PDF	ICS54 C075EE ICS5401EW/V7 15Contents SECS II wafer map format C075EE uv-tape ICODE SLI-S ICS5401 SL2ICS54 wafer map format
ICODE Coil design guide Abstract: M92x 156932 Text: SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 Product data sheet addendum 150030 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP	Original	PDF	SL2ICS2001DW/V1D C075EE ICODE Coil design guide M92x 156932
LB-412 Abstract: ICODE SLI ICS20 SL2ICS20 IBIS wafer map format Text: INTEGRATED CIRCUITS ADDENDUM SL2 ICS 20 I?CODE SLI Label IC Bumped Wafer Specification Product Specification Revision 3.0 Public Philips Semiconductors December 2002 Philips Semiconductors Product Specification Rev.3.0 December 2002 Bumped Wafer Specification	Original	PDF	SCA74 LB-412 ICODE SLI ICS20 SL2ICS20 IBIS wafer map format
Z2450 Abstract: sl3ics3001, ucode hsl SL3ICS30 UCODE hsl Z915 C075EE Text: SL3ICS3001 UCODE HSL bumped wafer specification Rev. 3.0 — 6 July 2009 070730 Product data sheet addendum PUBLIC 1. General description The SL3ICS3001FW is a contactless tag IC designed for tags and labels for RFID and AIDC system applications. This specification describes electrical, physical and dimensional properties of Au-bumped,	Original	PDF	SL3ICS3001 SL3ICS3001FW SL3ICS3001 SL3ICS3001FW/V1 Z2450 sl3ics3001, ucode hsl SL3ICS30 UCODE hsl Z915 C075EE