dc filter
Abstract: IEC61071
Text: ASC TGC Tangential Case DC filtering capacitors are packaged in a unique mounting case with mounting tabs rotated away from the terminations. The case is a one piece molded construction with urethane/epoxy fill from the bottom of the case. The low profile design of the case is conducive for lower
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-40/85C
-40/85C
200uF
dc filter
IEC61071
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ECS hc-49us
Abstract: 6.000 mhz SMD CRYSTAL smd transistor 3l 20.000 Mhz crystal CSM-7X smd 3l smd diode 3l transistor smd 3l z HC-49US
Text: CSM-7X-3L Case Ground Industry Std. HC-49US Package Extended Temp Range Option RoHS Compliant SMD CRYSTAL The CSM-7X-3L is a low profile SMD Crystal with case ground is ideal for applications that require a case ground. OPERATING CONDITIONS / ELECTRICAL CHARACTERISTICS
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HC-49US
ECS-200-20-5G3XDS-TR
ECS hc-49us
6.000 mhz
SMD CRYSTAL
smd transistor 3l
20.000 Mhz crystal
CSM-7X
smd 3l
smd diode 3l
transistor smd 3l z
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NAR141
Abstract: NKR141 NKA141 NAA141 NAA143 NAG141P NAG143P NAR143 NKA143 NKG141P
Text: 141/143 Series Numeric Display/Case Size 12.5 x 19.0 mm Features Case Size Product features 12.5 x 19.0 mm W x H ・Each color has anode common and cathode common respectively. ・A black case and a gray case are available. ・No lead package ・Lead–free soldering compatible
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565nm
605nm
660nm
NAR141
NKR141
NKA141
NAA141
NAA143
NAG141P
NAG143P
NAR143
NKA143
NKG141P
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NAR105
Abstract: NAA105 NAA107 NAG105P NAG107P NAR107 NKA105 NKA107 NKG105P NKG107P
Text: 105/107 Series Numeric Display/Case Size 22.8 x 33.0 mm Features Case Size Product features 22.8 x 33.0 mm W x H ・Each color has anode common and cathode common respectively. ・A black case and a gray case are available. ・No lead package ・Lead–free soldering compatible
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565nm
605nm
660nm
NAR105
NAA105
NAA107
NAG105P
NAG107P
NAR107
NKA105
NKA107
NKG105P
NKG107P
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823B
Abstract: DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook
Text: MOTOROLA SEMICONDUCTOR GENERAL INFORMATION Packaging & Case Information 84-Pin PLCC CASE 780A-01 ISSUE A FN SUFFIX 181-Pin PGA CASE 795A–02 ISSUE A HI SUFFIX 128-Pin QFP CASE 862A-02 ISSUE B DD SUFFIX 208-Pin QFP CASE 872A-01 ISSUE TBD DK SUFFIX 160-Pin QFP
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84-Pin
80A-01
181-Pin
128-Pin
62A-02
208-Pin
72A-01
160-Pin
64A-03
224-Pin
823B
DL201
motorola handbook
84 pin plcc ic base
Reliability and quality handbook
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NAR105
Abstract: NAG105P NAA105 NAA107 NAG107P NAR107 NKA105 NKA107 NKG105P NKG107P
Text: 105/107 Series Numeric Display/Case Size 22.8 x 33.0 mm Features Case Size Product features 22.8 x 33.0 mm W x H ・Each color has anode common and cathode common respectively. ・A black case and a gray case are available. ・No lead package ・Lead–free soldering compatible
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565nm
605nm
660nm
NAR105
NAG105P
NAA105
NAA107
NAG107P
NAR107
NKA105
NKA107
NKG105P
NKG107P
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Untitled
Abstract: No abstract text available
Text: Case Outlines http://onsemi.com 1099 Case Outlines TO–226AA, TO–92 CASE 29–11 ISSUE AL SCALE 1:1 A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
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226AA,
226AE,
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Untitled
Abstract: No abstract text available
Text: CHAPTER 3 Case Outlines and Package Dimensions http://onsemi.com 3356 CASE OUTLINES AND PACKAGE DIMENSIONS TO–92 TO–226 CASE 29–11 ISSUE AL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R
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JEDEC SOD123FL outline
Abstract: MARKING DIAGRAM SOD-123
Text: CHAPTER 3 Case Outlines and Package Dimensions http://onsemi.com 280 CASE OUTLINES AND PACKAGE DIMENSIONS SOD−523 CASE 502−01 ISSUE A 2 1 DATE 07 JUL 2004 SCALE 4:1 −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER.
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OD-523
06Date
JEDEC SOD123FL outline
MARKING DIAGRAM SOD-123
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5962-8780201RA
Abstract: MX7226 5962-87802012C CQCC1-N20
Text: SCOPE: QUAD, CMOS, 8-BIT D/A CONVERTER Device Type 01 Generic Number MX7226T x /883B Circuit Function DAC with 2 LSB Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Case Outline Package Code Outline Letter Mil-Std-1835
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MX7226T
/883B
Mil-Std-1835
Mil-Std-1835
GDIP1-T20
CDIP2-T20
CQCC1-N20
Mil-Std-883
MX7226T/883B
5962-8780201RA
MX7226
5962-87802012C
CQCC1-N20
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470RJ
Abstract: MIL-R-39009 5R00J 100rj MCTR50T2-33R0JB
Text: SPC TECHNOLOGY 3.18±0.26 Features : -Molded case for environmental protection -Electrically isolated case -Non-inductive package 10.41 ± 0.26 SPC Technology 16.26 ± 0.26 3.30 ± 0.76 12.7 ± 1.27 1.27 ± 0.13 Mounting Note : When mounting ensure entire ceramic portion of case is mounted on a
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300lbs
1330N)
MIL-STD-202,
1800VAC
MCTR50T3-1R00JB
MCTR50T1-10R0JB
MCTR50T1-5R00JB
MCTR50T2-100RJB
470RJ
MIL-R-39009
5R00J
100rj
MCTR50T2-33R0JB
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Untitled
Abstract: No abstract text available
Text: SCOPE: CMOS 12-BIT MULTIPLYING D/A CONVERTER Device Type 01 02 03 Generic Number MX7521S x /883B MX7521T(x)/883B MX7521U(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Case Outline Package Code Outline Letter
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12-BIT
MX7521S
/883B
MX7521T
MX7521U
Mil-Std-1835
Mil-Std-1835
GDIP1-T18
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Untitled
Abstract: No abstract text available
Text: SCOPE: CMOS 10-BIT MULTIPLYING D/A CONVERTER Device Type 01 02 03 Generic Number MX7520S x /883B MX7520T(x)/883B MX7520U(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Case Outline Package Code Outline Letter
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10-BIT
MX7520S
/883B
MX7520T
MX7520U
Mil-Std-1835
Mil-Std-1835
GDIP1-T16
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4.7ohm 3w
Abstract: MIL-R-39009 470ohm 25w
Text: SPC TECHNOLOGY 3.18±0.26 Features : -Molded case for environmental protection -Electrically isolated case -Non-inductive package 10.41 ± 0.26 SPC Technology 16.26 ± 0.26 3.30 ± 0.76 12.7 ± 1.27 1.27 ± 0.13 Mounting Note : When mounting ensure entire ceramic portion of case is mounted on a
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300lbs
1330N)
MIL-STD-202,
1800VAC
MCTR20T3-1R00JB
MCTR20T1-10R0JB
MCTR20T1-5R00JB
MCTR20T2-100RJB
4.7ohm 3w
MIL-R-39009
470ohm 25w
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VTB5051JH
Abstract: VTB5051
Text: VTB Process Photodiodes VTB5051JH PACKAGE DIMENSIONS inch mm CASE 14A TO-5 HERMETIC CHIP ACTIVE AREA: .023 in2 (14.8 mm2) PRODUCT DESCRIPTION Planar silicon photodiode in a “flat” window, three lead TO-5 package. Chip is isolated from the case. The third lead allows the case to be
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VTB5051JH
VTB5051JH
VTB5051
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5R00J
Abstract: MIL-R-39009 MCTR35T2-220RJB
Text: SPC TECHNOLOGY 4.44±0.38 Features : -Molded case for environmental protection -Electrically isolated case -Non-inductive package 10.16 ± 0.25 1.30 ± 0.10 2.95±0.10 Mounting Note : When mounting ensure entire ceramic portion of case is mounted on a clean, flat heat sink with an appropriate thermal interface, such as
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300lbs
1330N)
MIL-STD-202,
1800VAC
MCTR35T3-1R00JB
MCTR35T1-10R0JB
MCTR35T1-5R00JB
MCTR35T2-100RJB
5R00J
MIL-R-39009
MCTR35T2-220RJB
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VTB6061JH
Abstract: D92-02
Text: VTB Process Photodiodes VTB6061JH PACKAGE DIMENSIONS inch mm CASE 15 TO-8 HERMETIC CHIP ACTIVE AREA: .058 in2 (37.7 mm2) PRODUCT DESCRIPTION Large area planar silicon photodiode in a “flat” window, three lead TO-8 package. Chip is isolated from case. The third lead allows case to
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VTB6061JH
VTB6061JH
D92-02
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Untitled
Abstract: No abstract text available
Text: CHAPTER 3 Case Outlines and Package Dimensions http://onsemi.com 350 CASE OUTLINES AND PACKAGE DIMENSIONS TO−220 CASE 221A−09 ISSUE AA −T− B F T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL
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O-220
21A-09
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NKR141-B
Abstract: NKR141 NAA141-B NAG141-PB NKR143-B NAG141PB
Text: 141/143 Series Numeric Display/Case Size 12.5 x 19.0 mm Features Case Size Product features 12.5 x 19.0 mm W x H ・Each color has anode common and cathode common respectively. ・A black case and a gray case are available. ・Lead–free soldering compatible
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565nm
605nm
660nm
NKR141-B
NKR141
NAA141-B
NAG141-PB
NKR143-B
NAG141PB
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2n6151
Abstract: 2N6347A 2N6347 2N6070 MAC220-7 2N6071 2N6073 ab MAC10-6 MAC10-2 TO 220-AB STYLE 4
Text: TRIACs in Plastic Packages ON-STATE RMS C U R R E N T 25 30 0.45 A m p 4 .0 A m p 8.0 A m p 10 A m p Case 29-02 TO-92 Style 12 Case 77-03 Style 5 Case 221-02 TO -220 AB S tyle 2 Case 90-05 S tyle 4 Case 221-02 T 0 -2 2 0 AB Style 2 M AC 10-1 2N6068 MAC92-1I
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O-220
2N6068
MAC92-1I
MAC92A-1
2N6069
MAC220-2
MAC221-2
MAC10-2
MAC220A-2
2n6151
2N6347A
2N6347
2N6070
MAC220-7
2N6071
2N6073 ab
MAC10-6
TO 220-AB STYLE 4
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MRF245
Abstract: MRF237 MRF221 MRF238 MRF243 MRF244 2n5591 2N6151 2N6153 MRF212
Text: TRIACs in Plastic Packages O N -ST A T E R M S C U R R E N T 25 30 0.45 Am p 4.0 Am p 8.0 Am p 10 Am p Case 29-02 TO-92 Style 12 Case 77-03 Style 5 Case 221-02 TO-220 A B Style 2 Case 90-05 Style 4 Case 221-02 T 0 -22 0 A B Style 2 M A C 10-1 2N6068 MAC92-1I
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O-220
2N6068
MAC92-1I
MAC92A-1
2N6069
MAC220-2
MAC221-2
MAC10-2
MAC220A-2
MRF245
MRF237
MRF221
MRF238
MRF243
MRF244
2n5591
2N6151
2N6153
MRF212
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Untitled
Abstract: No abstract text available
Text: REVISIONS LTR D I 1 DATE YR-MO-OA D ESCR IPTIO N APPRO VED 88 APR 18 Convert to military drawing format. Add case outline 2 (square chip carrier package) for vendor CASE 27014. Remove vendor from case A and add to case D. Device 01 case outline 2 inactive for new design. Editorial changes throughout.
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M38510/65002BCX.
M38510/65002B2X.
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01CX
Abstract: 54HC02 MM54HC02E M38510
Text: REVISIONS LTR DATE YB-MO-DA DESCRIPTION APPROVED 8 8 JUNE 06 Convert to m ilit a r y drawing fo rm a t. Add case o u tlin e 2 (square chip c a r r ie r package) f o r vendor CAGE 27014. Remove vendor from case A and add to case D. Device 01CX and 012X in a c tiv e fo r new
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M38510/65101BCX
M38510/65101B2X.
M38510/66101B--
O14778
01CX
54HC02
MM54HC02E
M38510
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M38510
Abstract: No abstract text available
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-OA Convert to military drawing format. Add case outline 2 (square chip carrier package) for vendor CAGE (27014). Remove vendor from case A and add to case D. Devices 01CX and 012X inactive for new design use M38510/65204BCX and M38510/65204B2X.
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M38510/65204BCX
M38510/65204B2X.
M38510/65204BCX.
H38510/65204B2X.
M38510
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