CERAMIC FLATPACK
Abstract: F14C F10B F16B FA32A FA36A
Text: Ceramic Flatpack 10 Lead Ceramic Flatpack NS Package Number F10B 2000 National Semiconductor Corporation MS101108 www.national.com Ceramic Flatpack August 1999 Ceramic Flatpack 14 Lead Ceramic Flatpack NS Package Number F14C 16 Lead Ceramic Flatpack NS Package Number F16B
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MS101108
FA32A
FA36A
CERAMIC FLATPACK
F14C
F10B
F16B
FA32A
FA36A
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PDF
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CERAMIC QUAD FLATPACK CQFP
Abstract: CQFP64 Cqfp128 CQFP CQFP256 CQFP-128 EL28B 64 ceramic quad flatpack EL116A EL132B
Text: Ceramic Quad Flatpack CQFP 28 Lead Ceramic Quad Flatpack NS Package Number EL28B 2000 National Semiconductor Corporation MS101107 www.national.com Ceramic Quad Flatpack (CQFP) August 1999 Ceramic Quad Flatpack (CQFP) 64 Lead Ceramic Quad Flatpack NS Package Number EL64A
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Original
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EL28B
MS101107
EL64A
EL100A
EL116A
EL116B
EL128A
CERAMIC QUAD FLATPACK CQFP
CQFP64
Cqfp128
CQFP
CQFP256
CQFP-128
EL28B
64 ceramic quad flatpack
EL116A
EL132B
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PDF
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U208
Abstract: U209 208-LEAD U160 U162 U208L
Text: Package Diagrams Ceramic Quad Flatpacks 64-Lead Ceramic Quad Flatpack Cavity Up U65 1 Package Diagrams 160-Lead Ceramic Quad Flatpack In Ring U160 2 Package Diagrams 160-Lead Ceramic Quad Flatpack (Cavity Up) U162 51-80106 3 Package Diagrams 208-Lead Ceramic Quad Flatpack (Cavity Up) U208
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Original
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64-Lead
160-Lead
208-Lead
U208L
U208
U209
U160
U162
U208L
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PDF
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U208
Abstract: u1602 U160 U162 208lead 208-Lead
Text: Package Diagrams Ceramic Quad Flatpacks 64-Lead Ceramic Quad Flatpack Cavity Up U65 1 Package Diagrams 160-Lead Ceramic Quad Flatpack In Ring U160 2 Package Diagrams 160-Lead Ceramic Quad Flatpack (Cavity Up) U162 51-80106 3 Package Diagrams 208-Lead Ceramic Quad Flatpack (Cavity Up) U208
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Original
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64-Lead
160-Lead
208-Lead
U208L
U208RL
U208
u1602
U160
U162
208lead
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PDF
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U160
Abstract: U162
Text: Package Diagram Ceramic Quad Flatpacks 64-Lead Ceramic Quad Flatpack Cavity Up U65 1 Package Diagram 160-Lead Ceramic Quad Flatpack In Ring U160 2 Package Diagram 160-Lead Ceramic Quad Flatpack (Cavity Up) U162 3
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Original
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64-Lead
160-Lead
U160
U162
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PDF
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ordering information
Abstract: No abstract text available
Text: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack
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Original
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24-pin,
MS-027-AC
28-pin,
MS-027-AA
32-pin,
ordering information
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PDF
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K18C
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Ceramic Lid Flatpack Packages Flatpack K18.C A e 18 LEAD CERAMIC METAL SEAL CERAMIC LID FLATPACK PACKAGE A PIN NO. 1 ID AREA INCHES -A- D -B- S1 b E1 0.004 M H A-B S Q D S 0.036 M H A-B S D S C
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038mm)
K18C
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PDF
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Z84C0010PEC
Abstract: MIL-STD-883C CPS95CO0125 84C00 10X10 Z84C90 64 CERAMIC LEADLESS CHIP CARRIER LCC ceramic QFP Package 100 lead
Text: PACKAGE INFORMATION CPS95CO0125 CUSTOMER P ROCUREMENT S PECIFICA TION PACKAGE INFORMATION ORDERING CODES IC PACKAGE CODES TEMPERATURE A = VQFP Very Small QFP C = Ceramic Sidebrazed D = Cerdip E = Ceramic Window F = Plastic Quad Flatpack G = Ceramic PGA (Pin Grid Array)
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Original
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CPS95CO0125
Z84C0010PEC
MIL-STD-883C
CPS95CO0125
84C00
10X10
Z84C90
64 CERAMIC LEADLESS CHIP CARRIER LCC
ceramic QFP Package 100 lead
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PDF
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71200-H1
Abstract: y-parameter x-band mmic lna X-band lna MAAM28000-A1 MAAM71200-H1 X-band low noise amplifiers mmic case styles maam 23000-A1
Text: Application Note M542 Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers Abstract Rev. V4 Package Description Manufacturer 5 lead, ceramic Kyocera 6 lead, ceramic Kyocera Leadless, 6 port, ceramic StratEdge 7 lead, ceramic Kyocera 8 lead, ceramic
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PDF
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54F74
Abstract: F1024 SS02
Text: Philips Semiconductors Military FAST Products Product specification Dual D-type flip-flop 54F74 DESCRIPTION ORDER CODE PACKAGE DESCRIPTION* 14-Pin Ceramic DIP 54F74/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F74/BDA GDFP-T14 20-Pin Ceramic LLCC 54F74/B2A CQCC2-N20
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OCR Scan
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54F74
14-Pin
54F74/BCA
GDIP1-T14
54F74/BDA
GDFP-T14
20-Pin
54F74/B2A
CQCC2-N20
54F74
F1024
SS02
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PDF
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philips dl 711 delay
Abstract: DL 711 PHILIPS
Text: Philips Semiconductors Military FAST Products Product specification Dual D-type flip-flop 54F74 DESCRIPTION ORDER CODE PACKAGE DESCRIPTION* 14-Pin Ceramic DIP 54F74/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F74/BDA GDFP-T14 20-Pin Ceramic LLCC 54F74/B2A CQCC2-N20
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OCR Scan
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54F74
54F74
500ns
philips dl 711 delay
DL 711 PHILIPS
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PDF
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Military FAST Products Product specification Dual D-type flip-flop 54F74 DESCRIPTION ORDER CODE PACKAGE DESCRIPTION* 14-Pin Ceramic DIP 54F74/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F74/BDA GDFP-T14 20-Pin Ceramic LLCC 54F74/B2A CQCC2-N20
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OCR Scan
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54F74
54F74
500ns
711002b
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PDF
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F1024
Abstract: HDS02 54F74 fl024 SS02
Text: Philips Semiconductors Military FAST Products Product specification Dual D-type flip-flop 54F74 DESCRIPTION ORDER CODE PACKAGE DESCRIPTION* 14-Pin Ceramic DIP 54F74/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F74/BDA GDFP-T14 20-Pin Ceramic LLCC 54F74/B2A CQCC2-N20
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OCR Scan
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54F74
54F74
500ns
711002b
F1024
HDS02
fl024
SS02
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PDF
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MONOLITHIC MEMORIES
Abstract: MMI Monolithic Memories, Inc. 341-0558-C
Text: Military PAL Devices MMI PACKAGE DESIGNATOR J/JS W L PACKAGE TYPE CERAMIC DIP CERAMIC FLATPACK CERAMIC LEADLESS CHIP CARRIER Product Introduction Procedures All new products released by the Military Products Division must successfully pass Mil-Std-883 Class B processing prior to new
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OCR Scan
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Mil-Std-883
productL-STD-883
MONOLITHIC MEMORIES
MMI Monolithic Memories, Inc. 341-0558-C
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PDF
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cdfp4-f16
Abstract: No abstract text available
Text: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045
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Original
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MIL-STD-1835
CDFP4-F16
038mm)
cdfp4-f16
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PDF
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Untitled
Abstract: No abstract text available
Text: Ceramic Packages Ceramic Metal Seal Flatpack Packages Flatpack K14.B A e 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045 0.115 1.14 2.92 - b 0.015 0.022 0.38 0.56 - b1
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Original
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235lating
038mm)
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PDF
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K16.B Package
Abstract: No abstract text available
Text: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K16.B A e 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.115 - 2.92 - b 0.015 0.022 0.38 0.56 - b1 0.015 0.019
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Original
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038mm)
K16.B Package
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PDF
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K20.A Package
Abstract: CDFP4-F20 AA2020
Text: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K20.A MIL-STD-1835 CDFP4-F20 (F-9A, CONFIGURATION B) 20 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045
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Original
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MIL-STD-1835
CDFP4-F20
038mm)
K20.A Package
CDFP4-F20
AA2020
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PDF
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CDFP3-F28
Abstract: No abstract text available
Text: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B) A e 28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045
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Original
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MIL-STD-1835
CDFP3-F28
F-11A,
038mm)
CDFP3-F28
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PDF
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CDFP4-F24
Abstract: No abstract text available
Text: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B) 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045
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Original
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MIL-STD-1835
CDFP4-F24
038mm)
CDFP4-F24
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PDF
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Untitled
Abstract: No abstract text available
Text: Ceramic Packages Ceramic Metal Seal Flatpack Packages Flatpack E 1 K42.A TOP BRAZED 42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE N e INCHES A A SYMBOL MIN MAX MIN MAX NOTES A - 0.100 - 2.54 - b 0.017 0.025 0.43 0.64 - S1 b1 0.017 0.023 0.43 0.58 - c 0.007
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Original
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038mm)
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PDF
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CDFP3-F14
Abstract: K14.A Package
Text: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045
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Original
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MIL-STD-1835
CDFP3-F14
18lating
038mm)
CDFP3-F14
K14.A Package
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PDF
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K18A
Abstract: No abstract text available
Text: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K18.A A e 18 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.100 - 2.54 - b 0.015 0.022 0.38 0.56 - b1 0.015 0.019
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Original
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038mm)
K18A
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PDF
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K28B
Abstract: No abstract text available
Text: Ceramic Packages Ceramic Metal Seal Flatpack Packages Flatpack K28.B A e 28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045 0.125 1.14 3.18 - b 0.015 0.022 0.38 0.56 - b1
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Original
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038mm)
K28B
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PDF
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