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    CERAMIC LEADLESS CHIP CARRIER LCC 32 SOCKET Search Results

    CERAMIC LEADLESS CHIP CARRIER LCC 32 SOCKET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    CERAMIC LEADLESS CHIP CARRIER LCC 32 SOCKET Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


    Original     		A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package PDF

    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


    Original     		PDF

    i87C51

    Abstract: i87C52 ST72T71N5B1 i80c51 i87c51fa sab8031 89CXX 80c154 intel PIC16C84 MICROCHIP DATA BOOK Z08614
    Text: Flash MCU Order Code Guide Atmel Intel Philips AMD Microchip Zilog Matra Dallas Siemens AT89C51 i80C31 i80C51 i87C51 PCx80C31 SC80C31 PCx80C51 SC80C51 SC87C51 8751 87C51 PIC16C73 PIC16C74 Z84C01, Z84C50, Z08614 Z80C30, Z85C30, Z86C15 Z85230, Z850230, Z86C30


    Original     		AT89C51 i80C31 i80C51 i87C51 PCx80C31 SC80C31 PCx80C51 SC80C51 SC87C51 87C51 i87C51 i87C52 ST72T71N5B1 i80c51 i87c51fa sab8031 89CXX 80c154 intel PIC16C84 MICROCHIP DATA BOOK Z08614 PDF

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays PDF

    Untitled

    Abstract: No abstract text available
    Text: Raytheon Electronics Semiconductor Division R296XX/R297XX S tandard PROMs and P ow er-S w itched SPROMs Features Description • Devices are available in military -55°C to +125°C temperature range • Standard PROMs are offered in power-switched SPROM


    OCR Scan     		R296XX/R297XX 24-pin, PDF

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817 PDF

    Untitled

    Abstract: No abstract text available
    Text: LPR520/521 LPR520/521 DEVICES INCORPORATED 4 x 16-bit Multilevel Pipeline Register 4 x 16-bit Multilevel Pipeline Register DEVICES INCORPORATED FEATURES DESCRIPTION ❑ Four 16-bit Registers ❑ Implements Double 2-Stage Pipeline or Single 4-Stage Pipeline


    Original     		LPR520/521 16-bit LPR520 LPR521 IDT29FCT520/ IDT29FCT521 Am29520/ Am29521 PDF

    Untitled

    Abstract: No abstract text available
    Text: PRECISION BULK METAL FOIL TECHNOLOGY A COM PANY OF V I S H A Y VISHAY MODELS VSM85, VSM86, VSM87, VSM88 and VSM89 VISHAY RESISTORS Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance


    OCR Scan     		VSM85, VSM86, VSM87, VSM88 VSM89 VSM88 Departme25 PDF

    Untitled

    Abstract: No abstract text available
    Text: WTL 2516/2516A/2516B/2516C PARALLEL ARRAY MULTIPLIER PRELIMINARY DATA APRIL, 1986 Features SELECTABLE O U TPU T M ODE 16 x 16 PA R A LLEL ARRAY M U LTIPLIER O utput latch m ode selectable for clocked or transpar­ ent operation LOW P O W E R k C M O g ^ IT H T T L C O M PA TIB LE I/O


    OCR Scan     		2516/2516A/2516B/2516C 2516C MPY16K PDF

    Untitled

    Abstract: No abstract text available
    Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product


    Original     		VSM85, VSM86, VSM87, VSM88 VSM89 26-Mar-02 PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 52 socket

    Abstract: VSM85 VSM85, 86, 87, 88, 89 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket
    Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product


    Original     		VSM85, VSM86, VSM87, VSM88 VSM89 03-Jan-03 CERAMIC LEADLESS CHIP CARRIER LCC 52 socket VSM85 VSM85, 86, 87, 88, 89 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PDF

    LMU8UPC70

    Abstract: LMU08 30R212 98 100 16 capacitor LMU8UKMB45 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket A7A-600
    Text: LMU08/8U 8 x 8-bit Parallel Multiplier D E V IC F S IN C O R P O R A TE D DESCRIPTION FEATURES □ □ □ □ □ 20 ns Worst-Case Multiply Time Low Power CMOS Technology LMU08 Replaces TRW TMC208K LMU8U Replaces TRW TMC28KU T w o’s Complement LMU08 , or


    OCR Scan     		LMU08/8U LMU08 TMC208K TMC28KU LMU08) MIL-STD-883, 40-pin 44-pin LMU8UPC70 30R212 98 100 16 capacitor LMU8UKMB45 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket A7A-600 PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 52

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 socket lcc 28 socket
    Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product


    Original     		VSM85, VSM86, VSM87, VSM88 VSM89 08-Mar-05 CERAMIC LEADLESS CHIP CARRIER LCC 52 CERAMIC LEADLESS CHIP CARRIER LCC 52 socket lcc 28 socket PDF

    VSM85

    Abstract: 29r4 R757 VSM87 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket 12 CERAMIC LEADLESS CHIP CARRIER LCC lcc 28 socket
    Text: P R E C I S I O N B U L K M E T A L F O I L T E C H N O L O G Y VISHAY MODELS VSM85, VSM86, VSM87, VSM88 and VSM89 Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance


    Original     		VSM85, VSM86, VSM87, VSM88 VSM89 VSM88 VSM89 VSM85 29r4 R757 VSM87 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket 12 CERAMIC LEADLESS CHIP CARRIER LCC lcc 28 socket PDF

    Untitled

    Abstract: No abstract text available
    Text: mm « _ _ LMU08/8U — 8 x 8-bit Parallel Multiplier D E V IC F S IN C O R P O R A TE D [ FEATURES □ □ □ □ □ 20 ns Worst-Case Multiply Time Low Power CMOS Technology LMU08 Replaces TRW TMC208K LMU8U Replaces TRW TMC28KU T w o’s Complement LMU08 , or


    OCR Scan     		LMU08/8U LMU08 TMC208K TMC28KU LMU08) MIL-STD-883, 40-pin 44-pin PDF

    Untitled

    Abstract: No abstract text available
    Text: VITESSE FEATURES • Serial Data Rates up to 1.25 Gb/s • Parallel Data Rates up to 155 Mb/s • ECL 100K Compatible Parallel Data I/Os • Divide-by-8 Clock for Synchronization of Par­ allel Data to Interfacing Chips • SONET Frame Recovery Circuitry VS8012


    OCR Scan     		VS8012) STS-24 52-pin VS8011 VS8012 VS8061 16-bit VS8062 VS80XX PDF

    Untitled

    Abstract: No abstract text available
    Text: I mi in«/«11 LMÜ03/EU 8 x 8-bit Parallel Multiplier IJbVIÜI-S INuuHHÜKA IH □ 20 ns Worst-Case Multiply Time □ LMU8U Replaces TRW TMC28KU □ Tw o’s Complement LMU08 , or Unsigned Operands (LMU8U) □ Three-State Outputs The LMU08 and LMU8U are high­


    OCR Scan     		03/EU LMU08 TMC208K TMC28KU LMU08) MIL-STD-883, 40-pin 44-pin PDF

    Untitled

    Abstract: No abstract text available
    Text: LPR520/521 4 x 16-bit Multilevel Pipeline Register V IC I S INCORPORA ILL DESCRIPTION FEATURES □ Four 16-bit Registers □ Implements Double 2-Stage Pipe­ line or Single 4-Stage Pipeline Register □ Hold, Shift, and Load Instructions □ Separate Data In and Data Out Pins


    OCR Scan     		LPR520/521 16-bit MIL-STD-883, 40-pin 44-pin LPR520 LFR521 PDF

    LMU08PC70

    Abstract: smd diode 8U LMU08 LMU08PC35 LMU08PC50 TMC208K TMC28KU LMU08JC70
    Text: LMU08/8U LMU08/8U DEVICES INCORPORATED 8 x 8-bit Parallel Multiplier 8 x 8-bit Parallel Multiplier DEVICES INCORPORATED FEATURES ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ DESCRIPTION 20 ns Worst-Case Multiply Time Low Power CMOS Technology LMU08 Replaces TRW TMC208K


    Original     		LMU08/8U LMU08 TMC208K TMC28KU LMU08) MIL-STD-883, 40-pin 44-pin LMU08PC70 smd diode 8U LMU08PC35 LMU08PC50 TMC208K TMC28KU LMU08JC70 PDF

    2Mbit EPROM

    Abstract: 7LV02
    Text: PRELIMINARY Advanced Micro Devices Am27LV020/Am27LV020B 2 Megabit 262,144 x 8-Bit Low Voltage CMOS EPROM DISTINCTIVE CHARACTERISTICS • Single 3.3 V power supply — Regulated power supply 3.0 V -3.6 V — Unregulated power supply 2.7 V -3 .6 V (battery-operated systems)


    OCR Scan     		Am27LV020/Am27LV020B 28-pin 32-pin CLV032 Am27LV020 06971D 2Mbit EPROM 7LV02 PDF

    AA10

    Abstract: PIC16C54 32816 C038A
    Text: PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: Examples: XXXXXXXXXX - XX X/XX XXX QTP, SQTP, or ROM Code or Special Requirements Case D J K L P S W CB JN JW PQ SJ SL SM SN SO SP SS TS VS 27C256T - 15I/J PIC16C54 - RCI/SO


    Original     		27C256T 15I/J PIC16C54 14-Lead DS00049F-page AA10 32816 C038A PDF

    VSM85

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32 socket
    Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product


    Original     		VSM85, VSM86, VSM87, VSM88 VSM89 08-Apr-05 VSM85 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PDF

    Am27C020

    Abstract: No abstract text available
    Text: a Advanced Micro Devices Am27C020 2 Megabit 262,144 x 8-Bit CMOS EPROM DISTINCTIVE CHARACTERISTICS • Fast access time ■ 100% Flashrite programming — 90 ns ■ Low power consumption — Typical programming time of 32 seconds ■ Latch-up protected to 100 mA from -1 V to


    OCR Scan     		Am27C020 28-pin 32-pln KS000010 PDF