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    CERAMIC PIN GRID ARRAY PACKAGE WIRE BOND Search Results

    CERAMIC PIN GRID ARRAY PACKAGE WIRE BOND Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    CERAMIC PIN GRID ARRAY PACKAGE WIRE BOND Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    GI 312 diode

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame ceramic pin grid array package wire bond VIC064 CPGA 168 lead frame CERAMIC PIN GRID ARRAY 144 pins VIC068A CERAMIC PIN GRID ARRAY wire lead frame description of transistor bc 148 CY7C964
    Text: Qualification Report November, 1994 - QTP# 93101 Version 1.1 CMOS2AN PROCESS MARKETING PART NUMBER VIC64 DEVICE DESCRIPTION VMEbus Interface Controller with D64 VIC068A VMEbus Interface Controller VAC068A VMEbus Address Controller CY7C964 Bus Interface Logic Circuit


    Original     		VIC64 VIC068A VAC068A CY7C964 VIC64, VIC064/VIC068A 144-pins VIC64/VIC068A/VAC068A/7C964 GI 312 diode CERAMIC PIN GRID ARRAY CPGA lead frame ceramic pin grid array package wire bond VIC064 CPGA 168 lead frame CERAMIC PIN GRID ARRAY 144 pins VIC068A CERAMIC PIN GRID ARRAY wire lead frame description of transistor bc 148 CY7C964 PDF

    footprint jedec MS-026 TQFP

    Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
    Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES


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    CPGA large cavity

    Abstract: ceramic pin grid array package plating FLATPACK hermetic centrifuge
    Text: CERAMIC/HERMETIC data sheet CERAMIC/HERMETIC Common Package Families Ceramic / Hermetic Package Assembly: Ceramic / Hermetic packages are commonly used for applications requiring high performance and high reliability. They can generally withstand higher temperatures than traditional plastic packages, and the


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    88 lead cpga

    Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
    Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING PDF

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


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    fcBGA PACKAGE thermal resistance

    Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
    Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America


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    ppga package

    Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


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    outline of the heat slug for JEDEC

    Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


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    CERAMIC PIN GRID ARRAY wire lead frame

    Abstract: BGA and QFP Package TO metal package aluminum kovar TSOP 2E TSOP 54 Package nail qfp 32 land pattern ceramic pin grid array package plating ceramic pin grid array package lead finish PGA wire bonding
    Text: Package Lineup/ Forms/ Structures 1. Package Lineup 2. Package Forms 3. Package Structures DB81-10002-2E 1 Package Lineup/ Forms/ Structures 1. Package Lineup PACKAGE 1. Package Lineup The packages are classified as follows, according to form, material, and the mounting methods


    Original     		DB81-10002-2E CERAMIC PIN GRID ARRAY wire lead frame BGA and QFP Package TO metal package aluminum kovar TSOP 2E TSOP 54 Package nail qfp 32 land pattern ceramic pin grid array package plating ceramic pin grid array package lead finish PGA wire bonding PDF

    ACTEL CCGA 624 mechanical

    Abstract: CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste
    Text: Application Note AC190 Ceramic Column Grid Array Introduction Ceramic Column Grid Array CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections


    Original     		AC190 624-pin CG624) CG1152) 1272-pin ACTEL CCGA 624 mechanical CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste PDF

    LSI Logic

    Abstract: Flip Chip Substrate led flip-chip heatsink Signal Path Designer
    Text: Flip Chip Ball Grid Array FPBGA Package Family Overview LSI Logic's FPBGA packages offer flip chip die interconnect, and support leadcounts in excess of 1700 to target high performance, high pin count applications. LSI Logic is the first company to qualify a flip chip package using


    Original     		B20022 LSI Logic Flip Chip Substrate led flip-chip heatsink Signal Path Designer PDF

    underfill

    Abstract: EM HEATSINK PROFILE Swatch Group wristwatch lcd flip chip bga 0,8 mm ceramic pin grid array package wire bond ACF COG DSAE005753 acf film watch IC
    Text: EM-MARIN Gold or Solder Chip Bumping, the choice is application dependent. Author: Jörg Jasper, EM-Marin Evolution In the late 1960s, Swiss watchmakers developed highvolume tape-automated-bonding TAB technology in order to meet the requirement to put the watch IC into


    Original     		1960s, Th-9/00 underfill EM HEATSINK PROFILE Swatch Group wristwatch lcd flip chip bga 0,8 mm ceramic pin grid array package wire bond ACF COG DSAE005753 acf film watch IC PDF

    CERAMIC PIN GRID ARRAY wire lead frame

    Abstract: CY7C374 EME-6300H ceramic pin grid array package lead finish
    Text: Qualification Report December 1995, QTP# 94045, Version 1.0 128-Macrocell Flash CPLD CY7C374 PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:


    Original     		128-Macrocell CY7C374) CY7C374 84-pin 100-pin 128-Macrocell 7C374A JEDEC22 CERAMIC PIN GRID ARRAY wire lead frame CY7C374 EME-6300H ceramic pin grid array package lead finish PDF

    JM7000

    Abstract: ltx credence tester ltx ts80 teradyne flex tester credence tester sic wafer j937 optocoupler NAND SiC-JFET ceramic pin grid array package wire bond
    Text: Custom Product Capabilities Micross Components formerly Austin Semiconductor has loyally served the Military & Hi-Rel custom assembly and test marketplace for over 22 years. Custom support has been the company foundation since its inception, with the philosophy that if it can be defined by the customer, Micross will support the


    Original     		800Mhz JM7000 ltx credence tester ltx ts80 teradyne flex tester credence tester sic wafer j937 optocoupler NAND SiC-JFET ceramic pin grid array package wire bond PDF

    BTS4020

    Abstract: BTS402 smd elco 10uf 35v smx 5138 microsd kyocera ceramic resonator through hole KC2520c military passive component smd elco 10*f 35v smx gsc3e qualcomm 7200
    Text: AVX is the technology leader in the Passive electronic component and connector markets. Each year AVX Corporation accepts the challenge of helping Design Engineers create superior products for their customers. Our team of innovators around the world, utilize cutting edge research, design expertise and materials


    Original     		S-WN0815M608-R BTS4020 BTS402 smd elco 10uf 35v smx 5138 microsd kyocera ceramic resonator through hole KC2520c military passive component smd elco 10*f 35v smx gsc3e qualcomm 7200 PDF

    Matthey

    Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, Matthey sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap PDF

    tucker

    Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, tucker CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1 PDF

    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


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    footprint dip

    Abstract: TSOP 86 Package CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC TQFP 80 PACKAGE footprint ceramic pin grid array package lead finish
    Text: Plastic Packages National Semiconductor offers a wide variety of plastic packages for through-hole and surface mount applications. Many of these plastic packages provide cost-effective solutions to achieving greater board density surface-mount packages and high performance. Plastic packages are extensively


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    Robinson Nugent pga

    Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, Robinson Nugent pga burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa PDF

    LVDT sensor for aerospace

    Abstract: 38354 MIL-PRF-38354 slotted optocouplers lvdt sensor MIL-R-39017 thick film Ul listed resistor microelectronic application of rtd MIL-PRF-3835 UL-1412
    Text: Clive House, 12-18 Queens Road Weybridge, Surrey KT13 9XB, England Telephone: +44 0 1932 841310 Facsimile: +44 (0) 1932 846450 Email: [email protected] Website: www.ttelectronics.com Company registration No. 87249 tt electronics plc 2005 • Issue A · 04.05


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    Curtice

    Abstract: LP3000 MIL-HDBK-263 P100
    Text: Filtronic LP3000/LPV3000 2W Power PHEMT Solid State DRAIN PAD x4 FEATURES • • • • • +33.5 dBm Typical Power at 18 GHz 7 dB Typical Power Gain at 18 GHz SOURCE BOND PAD (x2) +30.5 dBm at 3.3V Battery Voltage Low Intermodulation Distortion 45% Power-Added-Efficiency at 18 GHz


    Original     		LP3000/LPV3000 LP3000 DSS-027 Curtice MIL-HDBK-263 P100 PDF

    capacitor 630v

    Abstract: make SMPS inverter welding machine Kyocera Kinseki CRYSTAL CX smd 0306 package KT2520 electronic passive components catalog AVX vARICON qpl ic laptop motherboard skycap LCD inverter 94v 0
    Text: AVX is the technology leader in the Passive electronic component and connector markets. Each year AVX Corporation accepts the challenge of helping Design Engineers create superior products for their customers. Our team of innovators around the world, utilize cutting edge research, design expertise and materials


    Original     		S-WN0610M1006-R capacitor 630v make SMPS inverter welding machine Kyocera Kinseki CRYSTAL CX smd 0306 package KT2520 electronic passive components catalog AVX vARICON qpl ic laptop motherboard skycap LCD inverter 94v 0 PDF

    toshiba laptop battery pack pinout

    Abstract: GTX3000P IBM POWER3 processor driclad toshiba laptop schematic diagram MCP Technology Trend P2SC stacked transistors SOI RF IBM Microelectronics ASIC ibm ASIC SRAM
    Text: 4 volume 4 A publication of IBM Microelectronics IBM Helps Juniper Networks Produce Revolutionary Internet Backbone Router Nancy Adinolfe, R. K. Anand, and Alison Seaman In This Issue Introduction Fourth Quarter 1998, Vol. 4, No.4 1 IBM Helps Juniper Networks Produce


    Original     		64-bit S/390TM 256-Mb 60-micron 10-mil toshiba laptop battery pack pinout GTX3000P IBM POWER3 processor driclad toshiba laptop schematic diagram MCP Technology Trend P2SC stacked transistors SOI RF IBM Microelectronics ASIC ibm ASIC SRAM PDF