C2929
Abstract: Chomerics Thermattach C2121 C2121M APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB C4040T C2121M cts
Text: Series APF Forged Heat Sinks ELECTRONIC COMPONENTS Technical Data Low Height Thin-Fin Forged Aluminum Features • Precision Forging Technology for High Power Applications • Low Profile Thin Fins • Designed for BGA and Other Surface Mount Packages • Select From Multiple Fin Heights
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Original
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/T410,
C2929
Chomerics Thermattach
C2121
C2121M
APF19-19-06CB
APF19-19-10CB
APF19-19-13CB
APF30-30-06CB
C4040T
C2121M cts
|
PDF
|
Chomerics Thermattach
Abstract: T412 T411 APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB T410 Chomerics
Text: Series APF Low Height Thin-Fin Forged Heat Sinks Technical Data Features • Precision Forging Technology for High Power Applications • Low Profile Thin Fins • Designed for BGA and Other Surface Mount Packages • Select from Multiple Fin Heights • Improved Thermal Performance
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Original
|
APF19-19-06CB
APF19-19-10CB
APF19-19-13CB
APF30-30-06CB
APF30-30-10CB
APF30-30-13CB
APF40-40-06CB
APF40-40-10CB
APF40-40-13CB
APF19-19-10CB/A01
Chomerics Thermattach
T412
T411
APF19-19-06CB
APF19-19-10CB
APF19-19-13CB
APF30-30-06CB
T410
Chomerics
|
PDF
|
Chomerics Thermattach
Abstract: ARCLAD 8223 T410 T412 Chomerics
Text: Thermal Management Solution for BGA, PGA, CQFP, and PQFP This Series 658 is a omnidirectional pin fin heat sink for both natural and forced- Features and Benefits: convection applications. ♦ Available in four standard heights, .25 in., .35 in., 45 in., and .60 in.
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Original
|
wake6-3000
658rev2
Chomerics Thermattach
ARCLAD 8223
T410
T412
Chomerics
|
PDF
|
CU1100
Abstract: CPR19-19-12U C2525M C1919S C2121M CPR19-19-15U CPR19-19-20U CPR19-19-25U c2929m C2121M cts
Text: Series CPR Forged Copper Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights
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Original
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CPR19-19-12U
CPR19-19-15U
CPR19-19-20U
CPR19-19-25U
CU1100
CPR19-19-12U
C2525M
C1919S
C2121M
CPR19-19-15U
CPR19-19-20U
CPR19-19-25U
c2929m
C2121M cts
|
PDF
|
C2121M
Abstract: APR27-27-12CB C2727M APR19-19-12CB APR19-19-15CB APR19-19-20CB APR19-19-25CB C4040T APR35 C2727S
Text: Series APR Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights
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Original
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APR19-19-12CB
APR19-19-15CB
APR19-19-20CB
APR19-19-25CB
C4040T
C4343T
C4545T
C2121M
APR27-27-12CB
C2727M
APR19-19-12CB
APR19-19-15CB
APR19-19-20CB
APR19-19-25CB
C4040T
APR35
C2727S
|
PDF
|
C4040T
Abstract: APR19-19-12CB APR19-19-15CB APR19-19-20CB APR19-19-25CB APR27-27-12CB APR35 C2323M
Text: CTS Series APR Forged Heat Sinks FORGED HEAT SINKS WITH PIN FINS Technical Data DESIGN FEATURES ELECTRONIC COMPONENTS • Precision forging technology for high power applications Forged Aluminum Heat Sinks with Pin Fins • Omnidirectional pins F•eatures
|
Original
|
/T410,
C4040T
APR19-19-12CB
APR19-19-15CB
APR19-19-20CB
APR19-19-25CB
APR27-27-12CB
APR35
C2323M
|
PDF
|
AN1018
Abstract: heat sink Chomerics Thermattach T412 APF19-19-13CB APF30-30-06CB APF19-19-06CB APF19-19-10CB
Text: Technical Brief AN1018 Low Height Thin-Fin Forged Heat Sink Introduction Board space constraints and increased demands for thermal management control are challenges that engineers must consider with each new application. Unused input power is lost as heat, which can destroy
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Original
|
AN1018
/T410,
AN1018
heat sink
Chomerics Thermattach
T412
APF19-19-13CB
APF30-30-06CB
APF19-19-06CB
APF19-19-10CB
|
PDF
|
AER19-19-12CB
Abstract: AER19-19-15CB APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB
Text: Series AER Forged Heat Sinks CTS FORGED HEAT SINKS WITH PLATE FINS ELECTRONIC COMPONENTS Technical Data DESIGN FEATURES • Precision forging technology for high power applications • Designed A forluminum BGA and other surface mount with packages Forged
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Original
|
/T410,
AER19-19-12CB
AER19-19-15CB
APF19-19-06CB
APF19-19-10CB
APF19-19-13CB
APF30-30-06CB
|
PDF
|
AER25-25-12CB
Abstract: AER19-19-12CB AER19-19-15CB AER19-19-18CB AER19-19-21CB c2525 AER21-21-23CB C1919S C2121M
Text: Series AER Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights
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Original
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AER19-19-12CB
AER19-19-15CB
AER19-19-18CB
AER19-19-21CB
AER19-19-23CB
AER19-19-28CB
AER19-19-33CB
C4040T
C4343T
C4545T
AER25-25-12CB
AER19-19-12CB
AER19-19-15CB
AER19-19-18CB
AER19-19-21CB
c2525
AER21-21-23CB
C1919S
C2121M
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HIGH TEMP FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6 mm
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Original
|
FHS-090
21x21
45x45
/T410
/T411
/T412
FHE40-40-40/A01/T
FHE40-40-40/T710/T
RevD1014
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical
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Original
|
27x27
40x40
RevA0614
FHP27-27-21
/T710
/T410
/T411
/T412
FHP27-27-21/T710/T
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FEX Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprint 35x35 mm and 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical
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Original
|
35x35
40x40
sup35-20
FEX40-40-20
/T710
/T410
/T411
/T412
withT710
FEX40-40-20/T710/T
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINKS – FHE SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 45.0
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Original
|
21x21
45x45
FHE35-35-26
/T410
/T411
/T412
FHE43-43-26/T710/T
RevB1014
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FHE Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6
|
Original
|
21x21
45x45
FHE35-35-27
/T710
/T410
/T411
/T412
FHE35-35-27/T710/T
RevA0614
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical
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Original
|
27x27
40x40
CB1014
FHP27-27-20
/T410
/T411
/T412
FHP27-27-20/T710/T
RevB1014
|
PDF
|
zif rod
Abstract: No abstract text available
Text: – THERMAL MANAGEMENT PRODUCTS CATALOG www.ctscorp.com CTS TABLE OF CONTENTS PAGE HI-TEMP FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES 10 ZIF STANDARD CIRCUIT BOARD RETAINERS
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Original
|
O-126,
O-202,
O-218
O-220
zif rod
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1
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Original
|
21x21
45x45
confid43-43-16
FHL31-31-18
/T710
/T410
/T411
/T412
FHL43-43-16/T710/T
RevA0614
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1
|
Original
|
21x21
45x45
confid3-17
FHL31-31-17
/T410
/T411
/T412
FHL43-43-17/T710/T
RevB1014
|
PDF
|
Untitled
Abstract: No abstract text available
Text: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES
|
Original
|
O-126,
O-202,
O-218
O-220
|
PDF
|
LAD66A4
Abstract: PGA zif socket 478 electroless nickel MIL-STD-810 TX0547 TX0522ND 8815 k cts ocxo CTS ocxo 125 ocxo cts 03 transistor c4040
Text: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE ADHESIVE PEEL AND STICK HEAT SINKS 3 FORGED HEAT SINKS WITH PLATE FINS 4 FORGED HEAT SINKS WITH PIN FINS 6 CLIP AND TAPE STYLES 7 ZIF STANDARD CIRCUIT BOARD RETAINERS
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Original
|
O-126,
O-202,
O-218
O-220
LAD66A4
PGA zif socket 478
electroless nickel MIL-STD-810
TX0547
TX0522ND
8815 k
cts ocxo
CTS ocxo 125
ocxo cts 03
transistor c4040
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6
|
Original
|
FHS-090
21x21
45x45
/T410
/T411
/T412
FHE40-40-40/A01/T
RevB0314
|
PDF
|
0.3mm pitch BGA
Abstract: vme 3u board standards 4-40 Kapton Washer led matrix 16X16 c2929 rod 456 LAT03B5U PGA zif socket 478 t410 TRANSISTOR up3-to3-b
Text: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS CTS Electronic Components - California CTS ® TABLE OF CONTENTS PAGE CORPORATE PROFILE 2 ADHESIVE PEEL AND STICK HEAT SINKS 3 FORGED HEAT SINKS WITH PLATE FINS 4 FORGED HEAT SINKS WITH PIN FINS
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Original
|
O-126,
O-202,
O-218
O-220
O-126/127/220
O-202
0.3mm pitch BGA
vme 3u board standards
4-40 Kapton Washer
led matrix 16X16
c2929
rod 456
LAT03B5U
PGA zif socket 478
t410 TRANSISTOR
up3-to3-b
|
PDF
|
POWER TRANSFORMER E154515
Abstract: scheme e131175 sampo E159656 foxconn e253117 e131175 XEPEX E140166 sony bando power transformer power transformer e190246 tamradio transformer e199273
Text: 10129 LIST OF COMPANY IDENTIFICATIONS The List of Company Identifications contains the trade names, trademarks, or other designations authorized for use in lieu of these Company names. ‘‘ ’’ — 2CS SRL ’’ — ACT CO LTD ‘‘ ‘‘ ’’ — 3E HK LTD
|
Original
|
|
PDF
|
IXF1010
Abstract: T-710 36ga intel fan
Text: Intel IXF1010 Thermal Design Considerations Preliminary Application Note July 2002 This document contains preliminary information on new products. Information is subject to change without notice. Verify with your local Intel sales office that you have the latest datasheet before finalizing a design.
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Original
|
IXF1010
552-CBGA
T-710
36ga
intel fan
|
PDF
|