CKE2 Search Results

CKE2 Price and Stock

Filter by Manufacturer


Cornell Dubilier Electronics Inc 475CKE250M CAP ALUM 4.7UF 20% 250V RADIAL
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	475CKE250M	Bulk	28,563		1	1 $0.37 10 $0.217 100 $0.1397 1000 $0.09854 10000 $0.08185	Buy Now
Mouser Electronics	475CKE250M		8,807			1 $0.37 10 $0.159 100 $0.109 1000 $0.098 10000 $0.081	Buy Now
TTI	475CKE250M	Bulk			32,000	1 - 10 - 100 - 1000 - 10000 -	Buy Now
Cornell Dubilier Electronics Inc 105CKE250M CAP ALUM 1UF 20% 250V RADIAL TH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	105CKE250M	Bulk	19,982		1	1 $0.33 10 $0.194 100 $0.1225 1000 $0.08458 10000 $0.06921	Buy Now
Mouser Electronics	105CKE250M		1,943			1 $0.33 10 $0.14 100 $0.094 1000 $0.083 10000 $0.064	Buy Now
Cornell Dubilier Electronics Inc 226CKE250MLU CAP ALUM 22UF 20% 250V RADIAL TH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	226CKE250MLU	Bulk	3,482		1	1 $0.94 10 $0.581 100 $0.94 1000 $0.28803 10000 $0.24676	Buy Now
Mouser Electronics	226CKE250MLU		113			1 $0.78 10 $0.356 100 $0.315 1000 $0.241 10000 $0.229	Buy Now
Cornell Dubilier Electronics Inc 107CKE250MQV CAP ALUM 100UF 20% 250V RADIAL
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	107CKE250MQV	Bulk	2,857		1	1 $2.6 10 $1.689 100 $1.2055 1000 $0.94785 10000 $0.84295	Buy Now
Mouser Electronics	107CKE250MQV		2			1 $2.22 10 $1.67 100 $1.15 1000 $1.02 10000 $0.829	Buy Now
TTI	107CKE250MQV	Bulk			4,200	1 - 10 - 100 - 1000 - 10000 $0.84	Buy Now
Cornell Dubilier Electronics Inc 226CKE200MLQ CAP ALUM 22UF 20% 200V RADIAL TH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	226CKE200MLQ	Bulk	596		1	1 $0.92 10 $0.567 100 $0.3799 1000 $0.28026 10000 $0.23978	Buy Now
Mouser Electronics	226CKE200MLQ		500			1 $0.76 10 $0.54 100 $0.37 1000 $0.26 10000 $0.216	Buy Now
TTI	226CKE200MLQ	Bulk			800	1 - 10 - 100 - 1000 $0.274 10000 $0.213	Buy Now

Find more CKE2 price and stock on Findchips.com

CKE2 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply	Original	PDF	AS4DDR32M72PBG1 32Mx72 333Mbps 23mm-1 208-PBGA
Untitled Abstract: No abstract text available Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm	Original	PDF	AS4DDR232M72PBG 32Mx72 AS4DDR232M72PBG
ACT-D16M96S Abstract: BSA1 BS-B1 Text: Standard Products ACT-D16M96S High Speed 16MegaBit x 96 3.3V Synchronous DRAM Multichip Module May 29, 2007 FEATURES ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ Six 6 low power 4M x 16 x 4 banks Synchronous Dynamic Random Access Memory chips in one MCM	Original	PDF	ACT-D16M96S 16MegaBit 50-MHz 192-cycle SCD3370 BSA1 BS-B1
lmc6762 Abstract: intel core i5 650 processor st 2n2222a 82371AB 82443BX 245417 intel mobile pentium III 600 650 mhz MD22 equivalent mmc-1 celeron MMC-2 Text: Celeron Processor Mobile Module: Mobile Module Connector 2 MMC-2 at 700 MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, and 450 MHz Datasheet Product Features • ■ ■ ■ ■ ■ ■ ■ ■ Mobile Celeron processor with processor speeds of 700 MHz, 650 MHz, 600 MHz,	Original	PDF	128-K lmc6762 intel core i5 650 processor st 2n2222a 82371AB 82443BX 245417 intel mobile pentium III 600 650 mhz MD22 equivalent mmc-1 celeron MMC-2
DPDD192MX8XSBY5 Abstract: No abstract text available Text: ADVANCE D COM P ON E NTS PACKAG I NG 1.5 Gigabit CMOS DDR SDRAM DPDD192MX8XSBY5 • • R I T FEATURES: O • • • • • VDD DQ0 VDDQ NC DQ1 VSSQ NC DQ2 VDDQ NC DQ3 VSSQ NC NC VDDQ NC A13 VDD DNU CS2 WE CAS RAS CS0 CS1 BA0 BA1 A10/AP A0 A1 A2 A3 VDD 1	Original	PDF	DPDD192MX8XSBY5 A10/AP 30A254-03 DPDD192MX8XSBY5
FW82443MX100 Abstract: Q728 440MX intel pciset 82443MX AC97 intel DOC PIIX4E 31X24 Text: R Intel 82443MX PCIset Specification Update April 2001 Notice: The Intel® 82443MX PCIset may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this Specification Update.	Original	PDF	82443MX FW82443MX100 Q728 440MX intel pciset AC97 intel DOC PIIX4E 31X24
H8/3005 Abstract: HD6413004F HD6413004TE HD6413004VF HD6413004VTE HD6413005F HD6413005VF OMC952723089 Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog	Original	PDF	FP-80A) TFP-80C) H8/3004, H8/3005 HD6413004F HD6413004TE HD6413004VF HD6413004VTE HD6413005F HD6413005VF OMC952723089
hd6417604sf28 Abstract: GE SCR Manual circut diagram of power supply of computer Hitachi Stacked CSP Hitachi Stacked CSP memory MAS 10 RCD SCR bt 107 SH7604 SH7000 HD6417604SVF20 Text: SH7604 Hardware Manual ADE-602-085C Rev. 4.0 9/19/01 Hitachi, Ltd. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in	Original	PDF	SH7604 ADE-602-085C TBP-176 SH7604 hd6417604sf28 GE SCR Manual circut diagram of power supply of computer Hitachi Stacked CSP Hitachi Stacked CSP memory MAS 10 RCD SCR bt 107 SH7000 HD6417604SVF20
82443BX Abstract: 443BX 82371EB PIIX4E HA21C Text: Intel 440BX AGPset: 82443BX Host Bridge/Controller Datasheet April 1998 Order Number: 290633-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability	Original	PDF	440BX 82443BX 04565-001-Sao USA/0498/PSA 443BX 82371EB PIIX4E HA21C
Untitled Abstract: No abstract text available Text: W3E16M64S-XBX 16Mx64 DDR SDRAM FEATURES BENEFITS  DDR Data Rate = 200, 250, 266Mbps  50% SPACE SAVINGS  Package: • 219 Plastic Ball Grid Array PBGA , 21 x 25mm  Reduced part count  2.5V ±0.2V core power supply  Reduced I/O count	Original	PDF	W3E16M64S-XBX 16Mx64 266Mbps
Untitled Abstract: No abstract text available Text: 35 /,0,1$5<,1 250$7,21 /'% E''56'5$0,QWHJUDWHG0RGXOH ,02' %HQHILWV )($785(6 ''56'5$0'DWD5DWH DQG0ESV 3DFNDJH xPP[PP(QFDSVXODWHG %DOOULGDUUD\ 3%*$ EDOOV PPSLWFK 99&RUH3RZHUVXSSO\	Original	PDF	265mm2 1060mm2 625mm2
motherboard intel schematics diagram Abstract: 440BX 443ZX INTEL application notes INTEL MOTHERBOARD SCHEMATICS 440BX PCIset 443BX Intel 243735 440ZX-66 AGPset Text: Migrating from a 440ZX-66 AGPset to a 440BX AGPset in a Celeron Processor Design Application Note July 1999 Order Number: 273259-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual	Original	PDF	440ZX-66 440BX CK100 33MHz 100/66MHz 133/66MHz 82443ZX 82443BX motherboard intel schematics diagram 443ZX INTEL application notes INTEL MOTHERBOARD SCHEMATICS 440BX PCIset 443BX Intel 243735 AGPset
HD6433837D Abstract: HD6473837F HD6473837FI HD6433832SD HD6433835 HD6433836 HD6433837 HF751 HD6433837SE HD6473834F Text: H8/3834 Series H8/3837 HD6433837, HD6433837S, HD64473837 H8/3836 HD6433836, HD6433836S H8/3835 HD6433835, HD6433835S H8/3834 HD6433834, HD6433834S, HD6473834 H8/3833 HD6433833, HD6433833S H8/3832 HD6433832S Hardware Manual ADE-602-054D Rev. 5.0 9/24/97 Hitachi, Ltd.	Original	PDF	H8/3834 H8/3837 HD6433837, HD6433837S, HD64473837 H8/3836 HD6433836, HD6433836S H8/3835 HD6433835, HD6433837D HD6473837F HD6473837FI HD6433832SD HD6433835 HD6433836 HD6433837 HF751 HD6433837SE HD6473834F
Untitled Abstract: No abstract text available Text: 16GB, 32GB x72, ECC, QR 240-Pin DDR3L LRDIMM Features 1.35V DDR3L SDRAM LRDIMM MT72KSZS2G72LZ – 16GB MT72KSZS4G72LZ – 32GB Features Figure 1: 240-Pin LRDIMM (MO-269 RC/C) • 240-pin, load-reduced dual in-line memory module (LRDIMM) • Memory buffer (MB)	Original	PDF	240-Pin MT72KSZS2G72LZ MT72KSZS4G72LZ 240-pin, PC3-12800, PC3-10600, PC3-8500, PC3-6400 09005aef8410dd71 kszs72c2g

Untitled Abstract: No abstract text available Text: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp	Original	PDF	AS4DDR232M64PBG 32Mx64 AS4DDR232M64PBG
Untitled Abstract: No abstract text available Text: 97SD3248 1.5Gb SDRAM 8-Meg X 48-Bit X 4-Banks Logic Diagram One Amplifier Memory FEATURES: DESCRIPTION: • 1.5 Giggabit ( 8-Meg X 48-Bit X 4-Banks) • RAD-PAK radiation-hardened against natural space radiation • Total Dose Hardness: >100 krad (Si), depending upon space mission	Original	PDF	97SD3248 48-Bit MIL-PRF-38535
WEDPNF8M722V-XBX Abstract: No abstract text available Text: White Electronic Designs WEDPNF8M722V-XBX 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n Sector Architecture •One 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm	Original	PDF	WEDPNF8M722V-XBX 8Mx72 16KByte, 32KByte, 64KBytes WEDPNF8M722V-XBX 100MHz 100ns
DDR3 LRDIMM Abstract: MT72JSZS4G72LZ-1G9 MT72JSZS4G72LZ-1G9E2A7 DDR3 DIMM SPD LRDIMM LRDIMM TSE-200 Text: 32GB x72, ECC, QR 240-Pin DDR3 LRDIMM Features DDR3 SDRAM LRDIMM MT72JSZS4G72LZ – 32GB Features Figure 1: 240-Pin LRDIMM (MO-269 RC/C) • 240-pin, load-reduced dual in-line memory module (LRDIMM) • Memory buffer (MB) isolates DRAM interface from card edge	Original	PDF	240-Pin MT72JSZS4G72LZ 240-pin, PC3-14900, PC3-12800, PC3-10600, PC3-8500, PC3-6400 t08-368-3900 09005aef83b62686 DDR3 LRDIMM MT72JSZS4G72LZ-1G9 MT72JSZS4G72LZ-1G9E2A7 DDR3 DIMM SPD LRDIMM LRDIMM TSE-200
Untitled Abstract: No abstract text available Text: White Electronic Designs WEDPN16M72V-XBX 16Mx72 Synchronous DRAM FEATURES The 128MByte 1Gb SDRAM is a high-speed CMOS, dynamic random-access, memory using 5 chips containing 268,435,456 bits. Each chip is internally conﬁgured as a quad-bank DRAM with a synchronous interface. Each of	Original	PDF	WEDPN16M72V-XBX 16Mx72 128MByte 864-bit 100MHz, 125MHz 100MHz
AX12 Abstract: No abstract text available Text: 97SD3232 1 Gb SDRAM 8-Meg X 32 Bit X 4-Banks Logic Diagram One Amplifier Memory FEATURES: DESCRIPTION: • 1 Gigabit ( 8-Meg X 32-Bit X 4-Banks) • RAD-PAK radiation-hardened against natural space radiation • Total Dose Hardness: >100 krad (Si), depending upon space mission	Original	PDF	97SD3232 32-Bit AX12
97SD3240 Abstract: AX12 Text: 97SD3240 1.25Gb SDRAM 8-Meg X 40-Bit X 4-Banks Logic Diagram One Amplifier Memory FEATURES: DESCRIPTION: • 1.25 Gigabit ( 8-Meg X 40-Bit X 4-Banks) • RAD-PAK radiation-hardened against natural space radiation • Total Dose Hardness: >100 krad (Si), depending upon space mission	Original	PDF	97SD3240 40-Bit 97SD3240 AX12
W3E64M72S-XBX Abstract: No abstract text available Text: White Electronic Designs W3E64M72S-XBX ADVANCED* 64Mx72 DDR SDRAM BENEFITS FEATURES Data rate = 200, 250, 266 and 333Mbs 66% Space Savings vs. TSOP Package: Reduced part count • 219 Plastic Ball Grid Array PBGA , 25 x 32mm 55% I/O reduction vs TSOP 2.5V ±0.2V core power supply	Original	PDF	W3E64M72S-XBX 64Mx72 333Mbs 512MByte W3E64M72S-ESB W3E64M72S-XBX
A 3760 0549 Abstract: 0835 0771 4188 1107 Text: MIL-C-39014/2 Pin DIP HOW TO O R D E R Military Type Designation: Styles CKR22, CKR23, CKR24 Dash Number Option MIL-C-39014/22 Appropriate Dash Number Part No. Example CKR22 BX K 104 R S tyle. Voltage-Temperature Limits _ Note 1 = Leads centered within ±.005*	OCR Scan	PDF	MIL-C-39014/2 CKR22, CKR23, CKR24 MIL-C-39014/22 CKR22 let0841 A 3760 0549 0835 0771 4188 1107
3VF1 Abstract: 82443ZX PMB 3330 PMB 8815 intel AF 82801 Text: intei Intel 440ZX AGPset: 82443ZX Host Bridge/Controller Datasheet November 1998 Order Number: 290650-001 intei Inform ation in this docum ent is provided in connection w ith Intel products. No license, express o r im plied, by estoppel or otherwise, to a ny intellectual	OCR Scan	PDF	440ZX 82443ZX 82801AA 82801AB 3VF1 PMB 3330 PMB 8815 intel AF 82801

CKE2 Search Results

CKE2 Price and Stock

Cornell Dubilier Electronics Inc 475CKE250M

Cornell Dubilier Electronics Inc 105CKE250M

Cornell Dubilier Electronics Inc 226CKE250MLU

Cornell Dubilier Electronics Inc 107CKE250MQV

Cornell Dubilier Electronics Inc 226CKE200MLQ

CKE2 Datasheets Context Search

Untitled

Untitled

ACT-D16M96S

lmc6762

DPDD192MX8XSBY5

FW82443MX100

H8/3005

hd6417604sf28

82443BX

Untitled

Untitled

motherboard intel schematics diagram

HD6433837D

Untitled

Untitled

Untitled

WEDPNF8M722V-XBX

DDR3 LRDIMM

Untitled

AX12

97SD3240

W3E64M72S-XBX

A 3760 0549

3VF1