EIA-556-A
Abstract: xilinx packaging label polystyrene EIA-556A
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
equipmQ100
TQ144
VQ100
EIA-556-A
xilinx packaging label
polystyrene
EIA-556A
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Instruments
Abstract: AN13F IC 7404 GP ttl ceramic oscillator using 7404 HP-HEMT-6000 precision Sine 1Mhz Wave Generator sinewave-generator of ic 7475 used in fastest finger first ttl 7474 sine wave 7404 ttl inverter photos
Text: Application Note 13 April 1985 High Speed Comparator Techniques Jim Williams INTRODUCTION Comparators may be the most underrated and underutilized monolithic linear component. This is unfortunate because comparators are one of the most flexible and universally applicable components available. In large
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2N2369
HP5082-2810
2N3866
2N5160
LT1016
2N2369
an13f
AN13-32
Instruments
AN13F
IC 7404 GP
ttl ceramic oscillator using 7404
HP-HEMT-6000
precision Sine 1Mhz Wave Generator
sinewave-generator
of ic 7475 used in fastest finger first
ttl 7474 sine wave
7404 ttl inverter photos
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MADR-007097-000100
Abstract: MADR-009190-000100
Text: MA4SW510 HMIC Silicon SP5T PIN Diode Switch RoHS Compliant V5 Features ♦ Broad Bandwidth ♦ Specified from 50 MHz to 20 GHz ♦ Usable from 50 MHz to 26.5 GHz ♦ Lower Insertion Loss and Higher Isolation than Comparable pHEMT/ Discrete Component Designs
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MA4SW510
30dBm
MA4SW510
MADR-007097-000100
MADR-009190-000100
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Untitled
Abstract: No abstract text available
Text: MA4SW410 HMIC Silicon SP4T PIN Diode Switch RoHS Compliant V6 Features ♦ Broad Bandwidth ♦ Specified from 50 MHz to 20 GHz ♦ Usable from 50 MHz to 26.5 GHz ♦ Lower Insertion Loss and Higher Isolation than Comparable pHEMT or Discrete Component Designs
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MA4SW410
30dBm
MA4SW410
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Three bond
Abstract: MADR-009190-000 MA4SW410
Text: MA4SW410 HMIC Silicon SP4T PIN Diode Switch RoHS Compliant V5 Features ♦ Broad Bandwidth ♦ Specified from 50 MHz to 20 GHz ♦ Usable from 50 MHz to 26.5 GHz ♦ Lower Insertion Loss and Higher Isolation than Comparable pHEMT/ Discrete Component Designs
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MA4SW410
30dBm
MA4SW410
Three bond
MADR-009190-000
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Untitled
Abstract: No abstract text available
Text: MA4SW110 MA4SW210 MA4SW310 HMIC Silicon PIN Diode Switches RoHS Compliant V8 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Broad Bandwidth Specified from 50 MHz to 20 GHz Usable from 50 MHz to 26.5 GHz Lower Insertion Loss and Higher Isolation than Comparable pHEMT/Discrete Component Designs
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MA4SW110
MA4SW210
MA4SW310
30dBm
MA4SW110,
MA4SW210
MA4SW310
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00709
Abstract: MA4SW210 MADR-007097-000100 MA4SW110 MADR-009190-000
Text: MA4SW110 MA4SW210 MA4SW310 HMIC Silicon PIN Diode Switches RoHS Compliant V8 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Broad Bandwidth Specified from 50 MHz to 20 GHz Usable from 50 MHz to 26.5 GHz Lower Insertion Loss and Higher Isolation than Comparable pHEMT/Discrete Component Designs
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MA4SW110
MA4SW210
MA4SW310
30dBm
MA4SW110
MA4SW110,
00709
MADR-007097-000100
MADR-009190-000
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RS-170
Abstract: MV95408 5501 7 segment MP20 RS-343A
Text: JULY 1994 DS2177-2.1 MV95408 50MHz 8-BIT CMOS VIDEO DAC The MV95408 is a CMOS 8-bit, 50MHz Digital to Analog converter, designed for use in both video graphics and general digital television applications. A very low external component count has been achieved by including the loop amplifier and reference
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DS2177-2
MV95408
50MHz
MV95408
RS-170
5501 7 segment
MP20
RS-343A
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EIA and EIAJ standards 783
Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to
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SZZA021A
EIA and EIAJ standards 783
JEDEC tray standard dimension
abstract for water level indicator
EIA-481-x
EIA standards 783
EIA 783
JEDEC Matrix Tray outlines
QFP Shipping Trays
EIA-783
EIA 481 TSSOP
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EIA and EIAJ standards 783
Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare
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SZZA021B
EIA and EIAJ standards 783
EIA standards 783
EIA 783
eia783
EIA-783
ic shipping tray
tsop Shipping Trays
SZZA021B
tray matrix bga
ti packing label
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JEDEC Matrix Tray outlines
Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare
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SZZA021C
JEDEC Matrix Tray outlines
ti packing label
dck3
QFP Shipping Trays
tray bga 64
EIA-468 label location
EIA standards 783
EIA-481-x
dbv4
EIA-783
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BFG95
Abstract: No abstract text available
Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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UG112
UG072,
UG075,
XAPP427,
BFG95
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xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
xilinx part marking
xilinx topside marking
UG112
qfn 3x3 tray dimension
FGG484
HQG160
reballing
top marking 957 so8
FF1148
fcBGA PACKAGE thermal resistance
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3N44
Abstract: TA8795BF rainbow
Text: TA8795BF TENTATIVE TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8795BF VIDEO SIGNAL PROCESSOR IC FOR LCD TVs Offered in a flat 60-pin plastic package, the TA8795BF is a multi-system IC integrating video, chroma, and sync signal processor circuits for PAL, NTSC, and SECAM systems with B, G,
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TA8795BF
60-pin
TA8795BF
58MHz
433619MHz
25ppm
20ppm
30ppm
3N44
rainbow
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TA8795BF
Abstract: V29P v17b 338N
Text: TA8795BF TENTATIVE TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8795BF VIDEO SIGNAL PROCESSOR IC FOR LCD TVs Offered in a flat 60-pin plastic package, the TA8795BF is a multi-system IC integrating video, chroma, and sync signal processor circuits for PAL, NTSC, and SECAM systems with B, G,
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TA8795BF
60-pin
TA8795BF
58MHz
433619MHz
25ppm
20ppm
30ppm
V29P
v17b
338N
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
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xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
xilinx topside marking
xilinx part marking
pcb footprint FS48, and FSG48
smd code v36
CF1752
reballing
recommended layout CSG324
BGA reflow guide
XC2VP7 reflow profile
SMD MARKING CODE C1G
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Untitled
Abstract: No abstract text available
Text: User's Guide SLAU477 – December 2012 ADS42B4x EVM This is the user’s guide for the ADS42B4x EVM Revision A . The ADS42B49 (dual-channel, 14-bit, up to 250 MSPS) is a dual analog-to-digital converter family. This EVM is specifically suited for interfacing with
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SLAU477
ADS42B4x
ADS42B49
14-bit,
TSW1400
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foxconn LS 36 manual
Abstract: TIA-455-11 sm 4109 fujikura power cable a3s marking Telcordia GR-20-CORE GR-765-CORE SIECOR optical cable 1996 Alcoa Fujikura 3m fiber jumper with fixed RIFOCS
Text: 502-1199 Engineering Report 09Mar06 Rev A 5 dB SC Singlemode Fiber Optic Buildout Attenuators 1. SCOPE This report covers testing performed by Telcordia Technologies Inc. on Tyco Electronics 5 dB SC Singlemode Fiber Optic Buildout Attenuators to the requirements of Telcordia GR-910-CORE, Generic
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09Mar06
GR-910-CORE,
DA-1542)
GR-910)
GR-910
foxconn LS 36 manual
TIA-455-11
sm 4109
fujikura power cable
a3s marking
Telcordia GR-20-CORE
GR-765-CORE
SIECOR optical cable 1996
Alcoa Fujikura 3m fiber jumper with fixed
RIFOCS
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esm elint
Abstract: shelter
Text: E le c tro n ic P ro d u c ts an d S y s te m s Systems Andrew provides complete integrated systems for inter cepting, collecting, monitoring, identifying and locating signal emitters. Component products available for complex systems include high performance antennas,
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"tunnel diode" oscillator
Abstract: 74123 74123A 2N4393 74AS00 TTL AN13 application circuits of ic 74123 LT1016 precision Sine 1Mhz Wave Generator time delay circuit for ic 74123
Text: um Application Note 13 A pril 1985 TECHNOLOGY High Speed Com parator Techniques Jim Williams IN TR O D U C TIO N Comparators may be the most underrated and under utilized monolithic linear component. This is unfortunate because comparators are one of the most flexible and
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OCR Scan
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2N2369.
"tunnel diode" oscillator
74123
74123A
2N4393
74AS00 TTL
AN13
application circuits of ic 74123
LT1016
precision Sine 1Mhz Wave Generator
time delay circuit for ic 74123
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Untitled
Abstract: No abstract text available
Text: Si GEC PLESSEY S r M I C O N I U C 'I O K s DS2431-2.1 MV95308 30MHz 8-B1T CMOS VIDEO DAC The MV95308 is a CMOS 8-bit, 30MHz Digital to Analog converter, designed for use in both video graphics and general digital television applications. A very low external component count has been
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DS2431-2
MV95308
30MHz
MV95308
10OnF
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Untitled
Abstract: No abstract text available
Text: p^ n 1 il GEC PLESSEY S E MIC O N I I t I l> K S MV95408 50MHz 8-BIT CMOS VIDEO DAC The MV95408 is a CMOS 8-bit, 50MHz Digital to Analog converter, designed lo r use in both video graphics and general digital television applications. A very low external component count has been
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MV95408
50MHz
MV95408
fl522
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PDF
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sync di
Abstract: NT5C TA8795BF 6p43 pe
Text: TO SHIBA TENTATIVE TA8795BF TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8795BF VIDEO SIGNAL PROCESSOR IC FOR LCD TVs Offered in a flat 60-pin plastic package, the TA8795BF is a multi-system 1C integrating video, chroma, and sync signal processor circuits for PAL, NTSC, and SECAM systems with
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OCR Scan
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TA8795BF
60-pin
TA8795BF
58MHz
25ppm
30ppm
NR-18
20ppm
sync di
NT5C
6p43 pe
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PDF
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