Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    CORNER RELIEF CARRIER TAPE Search Results

    CORNER RELIEF CARRIER TAPE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    9513APC-G Rochester Electronics LLC 9513A - Rochester Manufactured 9513, System Timing Controller, 44 PLCC Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    LMX2325TMX-G Rochester Electronics LLC LMX2325 - RoHS - T/R, PLL Freq Synthesizer Visit Rochester Electronics LLC Buy
    65142-001LF Amphenol Communications Solutions Din Accessory Strain Relief Flat Cable Visit Amphenol Communications Solutions
    10073978-018LF Amphenol Communications Solutions Minitek® 2.00mm, Wire to Board Connector, Strain Relief for Receptacle. Visit Amphenol Communications Solutions
    67016-010LF Amphenol Communications Solutions Quickie®, Wire To Board, Strain Relief, 10 Positions Visit Amphenol Communications Solutions

    CORNER RELIEF CARRIER TAPE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ACTEL CCGA 624 mechanical

    Abstract: CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste
    Text: Application Note AC190 Ceramic Column Grid Array Introduction Ceramic Column Grid Array CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections


    Original     		AC190 624-pin CG624) CG1152) 1272-pin ACTEL CCGA 624 mechanical CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste PDF

    408-1379

    Abstract: AMP catalog 82003 komax 433 nas 7103 KOMAX 333 operating instructions komax 200277-2 201355-1 201692-4 21393
    Text: RoHS Ready M Series Pin and Socket Connectors AMP M Series Pin and Socket Connectors NOTE: All part numbers are RoHS Compliant M Series Connectors Product Facts • Most connectors intermateable with connectors made to MIL-C-28748 requirements Standard Housings


    Original     		MIL-C-28748 wire42 408-1379 AMP catalog 82003 komax 433 nas 7103 KOMAX 333 operating instructions komax 200277-2 201355-1 201692-4 21393 PDF

    Untitled

    Abstract: No abstract text available
    Text: AXR 7 ULTRA LOW-PROFILE RECEPTACLE OF 2.9 mm I/O CONNECTORS FOR PORTABLE EQUIPMENT FEATURES 1. Ultra low-profile receptacle of 2.9 mm 2. Plug construction which accepts any direction (topside up or upside down) for mounting receptacles onto the boards Since the lock is released in the sideways


    Original     		PDF

    AXR61154

    Abstract: No abstract text available
    Text: AXR 6 I/O BACK CONNECTORS FOR PC CARD I/O CONNECTORS FOR PC CARD FEATURES APPLICATIONS 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating stress and offer high contact reliability. PC CARD, PDA etc. Contact The bellows type contacts are fabricated


    Original     		PDF

    134 kHz RFID

    Abstract: db9f connector M513 MASY-007028-000100 MASY-007028-0001TB MASY-007028-0001TR MASY-007028-SW01TB
    Text: MASY-007028-000100 Synthesizer, SMT for RFID Covering all UHF Bands Rev. V2 Features • • • • • • • • • Description Fully Integrated VCO, PLL, Loop Filter Includes TCXO with <10 PPM Stability Low Phase Noise High Performance, Low Cost Covers US, European and Japanese RFID Bands


    Original     		MASY-007028-000100 134 kHz RFID db9f connector M513 MASY-007028-000100 MASY-007028-0001TB MASY-007028-0001TR MASY-007028-SW01TB PDF

    Pb95Sn5

    Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
    Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377


    Original     		DS2411: DS2415: DS2417: DS2432: DS2433: DS2502: DS2760: DS2761: DS2762: DS9503: Pb95Sn5 pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37 PDF

    Untitled

    Abstract: No abstract text available
    Text: AXR6.fm 87 ページ ２００３年１２月２２日 月曜日 午後１２時２分 AXR 6 I/O BACK CONNECTORS FOR PC CARD I/O CONNECTORS FOR PC CARD FEATURES APPLICATIONS 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating


    Original     		PDF

    HUGHES mcw 550

    Abstract: hughes welder welder hughes mcw 550 ECCOBOND 56c SN62PRMAB3 relative permittivity beryllium copper ferrite welder ECCOBOND 300 kester Re SOLDER PASTE mcw-550
    Text: Ferrodisc and Drop-In* Devices Overview Ferrodisc and Drop-In circulators and isolators manufactured by M/A-COM are ex­ tremely well suited for all types of microwave integrated circuits MIC’s . The rapidly growing awareness and utilization of these devices in microwave systems of all


    OCR Scan     		PDF

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    JIS C 0806

    Abstract: CONNECTOR BACK SHELL AXR61154 AXR62151 AXR62156 HP4338B
    Text: AXR 6 I/O CONNECTORS FOR PC CARD FEATURES 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating stress and offer high contact reliability. Contact The bellows type contacts are fabricated by bending thin sheet metal. They offer


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Discontinued products I/O CONNECTORS FOR PC CARD FEATURES 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating stress and offer high contact reliability. Contact The bellows type contacts are fabricated by bending thin sheet metal. They offer


    Original     		PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    WLCSP smt

    Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
    Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None


    Original     		AN69061 AN69061 WLCSP smt EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition PDF

    ablebond 8380

    Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING
    Text: CHAPTER 12 ADVANCED PACKAGE APPLICATIONS TAPE CARRIER PACKAGE INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized


    Original     		IPC-SM-782A J-STD-001 ablebond 8380 land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING PDF

    Ablebond 8380

    Abstract: X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716
    Text: Advanced Package Applications: Tape Carrier Package 12.1 12 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is


    Original     		ANSI/J-STD-001, Ablebond 8380 X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716 PDF

    Ablebond 8380

    Abstract: A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability tms 3615 A5716 A5707-01 alpha Resistors slide
    Text: 12 Tape Carrier Package 12.1 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These


    Original     		PDF

    axc8

    Abstract: sharp EIA 577 sharp color tv schematic diagram AXP 209 IC 945 mercury MOTHERBOARD CIRCUIT diagram 13001 s 8d semiconductors cross index schematic WELDER semiconductors cross reference axa dvd SMD MARKING CODE p4S
    Text: Group Catalog Connectors 2008-2009 Narrow-pitch connectors I/O connectors Interface connectors Sockets for memory card Connectors for industrial equipment IC sockets Group Catalog Connectors 2008-2009 These materials are printed on ECF pulp. These materials are printed with earth-friendly vegetable-based soybean oil ink.


    Original     		AKCT1B91E 200709-8YT axc8 sharp EIA 577 sharp color tv schematic diagram AXP 209 IC 945 mercury MOTHERBOARD CIRCUIT diagram 13001 s 8d semiconductors cross index schematic WELDER semiconductors cross reference axa dvd SMD MARKING CODE p4S PDF

    30f 124 equivalent

    Abstract: MC14513 C04-026 binary bcd conversion logic diagram CAZ MARKING C04022 R1C390
    Text: TC7135 4-1/2 Digit A/D Converter Features General Description • • • • • • • • The TC7135 4-1/2 digit A/D Converter ADC offers 50 ppm (1 part in 20,000) resolution with a maximum nonlinearity error of 1 count. An auto-zero cycle reduces zero error to below 10 µV and zero drift to


    Original     		TC7135 TC7135 D-85737 NL-5152 DS21460C-page 30f 124 equivalent MC14513 C04-026 binary bcd conversion logic diagram CAZ MARKING C04022 R1C390 PDF

    Untitled

    Abstract: No abstract text available
    Text: High Power Resistive Products Resistors and Terminations: Engineering Guidelines DESIGN, MEASUREMENT AND PERFORMANCE As the wireless revolution extends component requirements upward in frequency, higher in operating power, and smaller in size, performance demands on resistive devices grow ever


    Original     		MTT-33, PDF

    APA2613

    Abstract: No abstract text available
    Text: APA2613 6W Stereo Class-D Audio Power Amplifier Features • • General Description Supply Voltage is 8V ~ 26V The APA2613 is a stereo, high efficiency, Class-D audio Class D operation eliminates heat sink & reduce power supply requirement amplifier available in TSSOP-28Pand QFN4x4-28A pins


    Original     		APA2613 APA2613 TSSOP-28Pand QFN4x4-28A JESD-22, MIL-STD-883-3015 PDF

    APA2614

    Abstract: No abstract text available
    Text: APA2614 15W Stereo Class-D Audio Power Amplifier Features • • General Description Supply Voltage is 8V ~ 26V The APA2614 is a stereo, high efficiency, Class-D audio Class D operation eliminates heat sink & reduce power supply requirement amplifier available in TSSOP-28Pand QFN4x4-28 pins


    Original     		APA2614 APA2614 TSSOP-28Pand QFN4x4-28 JESD-22, MIL-STD-883-3015 PDF

    APA2613A

    Abstract: No abstract text available
    Text: APA2613A 8W Stereo Class-D Audio Power Amplifier Features • • General Description Supply Voltage is 8V ~ 26V The APA2613A is a stereo, high efficiency, Class-D audio Class D operation eliminates heat sink & reduce power supply requirement amplifier available in TSSOP-28Pand QFN4x4-28A pins


    Original     		APA2613A APA2613A TSSOP-28Pand QFN4x4-28A JESD-22, MIL-STD-883-3015 PDF

    fr108

    Abstract: Ever Ohms chip resistor
    Text: AT C H I G H P O W E R R E S I S T I V E P R O D U C T S ATC Resistors and Terminations: Engineering Guidelines Design, Measurement and Performance Structures, Implementations, and Configurations . . . . . . . . . . . . . . . . . . . . .36 Specs and Specmanship . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37


    Original     		84-WA/HT-110. MTT-33, fr108 Ever Ohms chip resistor PDF