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    Untitled

    Abstract: No abstract text available
    Text: PROCESS CPD77X Schottky Rectifier 3 Amp Schottky Rectifier Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 61 x 61 MILS Die Thickness 5.9 MILS Anode Bonding Pad Area 55 x 55 MILS Top Side Metalization Ti/Ag - 2,500Å/30,000Å Back Side Metalization


    Original     		CPD77X CTLSH3-30M833 22-March PDF

    2N2645

    Abstract: cpd83v-cmpd7000-ws 1N3070 CPZ25 CPD83V-1N4148-WN CP191V-2N2222A-WN CPZ25-CMZ5937B-WR CPD83V CPD83V-1N4148-WS CPD98V
    Text: PCN #: 119 Notification Date: 16 December 2010 mailto:[email protected] http://www.centralsemi.com/processchange Product / Process Change Notice Parts Affected: Small signal discrete semiconductor wafers. Extent of Change: Wafer diameter has been changed from 4” to 5”.


    Original     		CPD83V-1N914-WN CPD83V-1N914A-WN CPD83V-CMPD7000-WS CPD83V-1N4148-WS CPD83V-1N914-WR CPD92X-CMPD6263-WR CPZ25-CMZ5937B-WN CPZ25-CMZ5940B-WN CPZ25-1N4752A-WN CPZ25-1N5918B-WN 2N2645 cpd83v-cmpd7000-ws 1N3070 CPZ25 CPD83V-1N4148-WN CP191V-2N2222A-WN CPZ25-CMZ5937B-WR CPD83V CPD83V-1N4148-WS CPD98V PDF