Altera Flip Chip BGA warpage
Abstract: with or without underfill DSASW0010612 cte table epoxy substrate you ad electronics Power consumption of FCBGA 53RD
Text: Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package 1 Kuo-Chin Chang*, 2Yuan Li, 1Chung-Yi Lin, and 1Mirng-Ji Lii 1 Taiwan Semiconductor Manufacturing Company, Ltd. 6, Creation Rd. 2, HsinChu Science Park, HsinChu 300, TAIWAN * Tel: 886-3-5785112 Ext.6274; Fax: 886-3-5641737; E-mail: [email protected]
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IPC-6012
Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel
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1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6012
IPC-D-279
IPC-6013
IPC-6016
IPC-2223
ipc 7094
IPC-7094
IPC-2226
IPC-6011
IPC-7525
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IPC-6011
Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications
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1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6011
IPC-D-279
IPC-6013
ipc 7094
IPC-6012
IPC-2223
IPC 6012
IPC-6016
IPC-2221
IPC-2222
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DBGA
Abstract: cte table ic bga DIMPLE BGA FR4 0.8mm thickness 0.65mm pitch BGA BGA cte BGA Solder Ball collapse bga thermal cycling reliability
Text: 2ND LEVEL INTERCONNECT RELIABILITY OF CERAMIC AREA ARRAY PACKAGES Shingo Sato, Noriyuki Shimizu*, Shin Matsuda, Shoji Uegaki and Sachio Ninomiya Kyocera Corporation Kyoto, Japan Biography During temperature cycling test TCT , CBGAÕs failure usually occurs in the form of an
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NATIONAL SEMICONDUCTOR ink MARKING
Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as
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WLCSP smt
Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None
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AN69061
AN69061
WLCSP smt
EIA-481-D-2008
Cu OSP and Cu SOP
qfn tray pocket size 5 x 6
SUF1577-15
WLCSP stencil design
without underfill
SAC396
cte table flip chip substrate
SAC 2.3 Ag bump composition
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IDT71V2576
Abstract: IDT71V2578 IDT71V3576 IDT71V3578 cte table ic bga SSIO-24 71V2578
Text: PRELIMINARY IDT71V2576 IDT71V2578 IDT71V3576 IDT71V3578 128K X 36, 256K X 18, 3.3V SYNCHRONOUS SRAMS WITH 2.5V I/O OPTION, PIPELINED OUTPUTS, BURST COUNTER, SINGLE CYCLE DESELECT FEATURES: DESCRIPTION: • 128K x 36, 256K x 18 memory configurations • Supports high system speed:
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IDT71V2576
IDT71V2578
IDT71V3576
IDT71V3578
200MHz
183MHz
166MHz
150MHz
133MHz
71V2576
IDT71V2576
IDT71V2578
IDT71V3576
IDT71V3578
cte table ic bga
SSIO-24
71V2578
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transistor smd G46
Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Text: FBGA User’s Guide Version 4.2 -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG
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N32-2400
22142J
transistor smd G46
fluke 52 k/j Thermocouple
7512 pin diodes in micro semi data sheet
smd transistor marking ey
SMD MARKING CODE h5
MCP Technology Trend
BGA-64 pad
AMD reflow soldering profile BGA
SMD MARKING CODE l6
BGA Solder Ball 0.6mm
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TDA9321H
Abstract: SAB9078HS smd transistor 2fh SAB9079HS SQFP128 TDA8310 TDA9143 TDA831 mp1192 TDA9321
Text: INTEGRATED CIRCUITS DATA SHEET SAB9079HS Multistandard Picture-In-Picture PIP controller Preliminary specification File under Integrated Circuits, IC02 2000 Jan 13 Philips Semiconductors Preliminary specification Multistandard Picture-In-Picture (PIP) controller
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SAB9079HS
SAB9079HS
545004/50/01/pp48
TDA9321H
SAB9078HS
smd transistor 2fh
SQFP128
TDA8310
TDA9143
TDA831
mp1192
TDA9321
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JESD-26
Abstract: RAI-5-039 mineral spirits bulk modulus Silicone mold release agent JESD-22 KITAGAWA MINERAL SPIRITS
Text: Package Reliability All products and packages offered by National Semiconductor Corporation meet the minimum reliability qualification requirements outlined in Table 1 and Table 2 for hermetic and plastic packages, respectively. These minimum requirements are applied to new packages as well as to existing
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TB451
Abstract: intersil standard part marking wlcsp inspection
Text: Technical Brief 451 PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Introduction SOLDER BALL: Sn/Ag/Cu There is an industry-wide trend towards using the smallest package possible for a given pin count. This is driven primarily by the handheld products market where the trend towards
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intersil standard part marking
wlcsp inspection
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Untitled
Abstract: No abstract text available
Text: ADVANCE M i m n M 2 5 b K X 1 8 , 1 2 8 K X 3 2 /3 6 I 3.3V I/O, PIPELINED, SCD SYNCBURST SRAM Q X /M f^ D I in Q T O T I M v D U l l O I MT58LC256K18D9, MT58LC128K32D9, MT58LC128K36D9 C D A M 3.3V Supply, Pipelined, Burst Counter and Single-Cycle Deselect
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MT58LC256K18D9,
MT58LC128K32D9,
MT58LC128K36D9
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Untitled
Abstract: No abstract text available
Text: KM736V799 128Kx36 Synchronous SRAM Document Title 128Kx36-Bit Synchronous Pipelined Burst SRAM Revision History Rev. No 0.0 0.1 History Draft Date Remark Initial d ra ft A pril . 14. 19 98 P re lim in a ry C h a n g e U n d e rs h o o t s p e c A pril . 20. 19 98
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KM736V799
128Kx36
128Kx36-Bit
100-TQFP-1420A
50REF
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Untitled
Abstract: No abstract text available
Text: ADVANCE M i m n M 2 5 b K X 1 8 , 1 2 8 K X 3 2 /3 6 I 2.5V I/O, PIPELINED, DCD SYNCBURST SRAM Q X /M f^ D I i n Q T O T I M v D U l l O I MT58LC256K18F1, MT58LC128K32F1, MT58LC128K36F1 C D 3.3V Supply, +2.5V I/O, Pipelined, Burst Counter and Double-Cycle Deselect
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MT58LC256K18F1,
MT58LC128K32F1,
MT58LC128K36F1
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Untitled
Abstract: No abstract text available
Text: IBM041811PLA Preliminary 6 4 K x 18 P IP E L IN E S R A M Features • 6 4 K x 18 O rganization • • 0 .5 Micron C M O S Technology • Self-tim ed W rite O peration • S ynchronous Pipeline M o d e O f Operation • Byte W rite Capability • Single + 3 .3 V ± 5 % P ow er S upply and Ground
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IBM041811PLA
MMDM05DSU-00
IBM041811
119X10
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scb68459
Abstract: SA1000 floppy disk spindle controller scn68454 ISCN68454 SCN68000 SCN68454C6A52 SCN68454C6I48 SCN68454C6N48 ST506
Text: Signetics M icro p ro ce sso r P rod ucts DESCRIPTION The SCN68454 Intelligent Multiple Disk C ontroller IMDC provides the tradition al and advanced features required to control W inchester type rigid disks and floppy disks. It can control up to four rigid or floppy disk drives, in any com bi
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SCN68454
SA1000
ST506
16-bit
SCN68454
N68454
scb68459
floppy disk spindle controller
ISCN68454
SCN68000
SCN68454C6A52
SCN68454C6I48
SCN68454C6N48
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f9001
Abstract: NAFI tae 2026 CV17 LQFP32 PCD5008 PCD5013 PCD5013H 8668A X1HB
Text: P hilips S em ico n d uctors FLEX roaming decoder II C O N TE N TS 1 F E A TU R E S 2 A P P LIC A T IO N S 3 G E N E R A L D ES C R IPTIO N 4 Q U IC K R EFE R E N C E D ATA 5 O R D E R IN G IN FO R M A TIO N 6 B LO C K D IA G R AM 7 P IN NING 8 F U N C T IO N A L D ES C R IPTIO N
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BGA153-1422-1
Abstract: G31D
Text: TOSHIBA TC55YK1618XB-666f-500t-400 T EN T A T IV E T O S H IB A M O S D IG IT A L IN T E G R A T E D C IR C U IT S IL IC O N G A T E C M O S 1,048,576-WORD BY 18-BIT SYNCHRONOUS STATIC RAM DESCRIPTION The TC55YK1618XB is a 18,874,368-bit synchronous static random access memory SRAM organized
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TC55YK1618XB-666f-500t-400
TC55YK1618XB
368-bit
TC55YK1618XB-666
D031D2Ì
BGA153-1422-1
G31D
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DA05 display
Abstract: display DA05 TDA9321H 741071 A302 w3 PICTURE TUBE DA03 DA115 SAB9079HS SQFP128
Text: Philips Semiconductors Preliminary specification Multistandard Picture-ln-Picture PIP controller 0 . D0n7nu0 FEATURES • Suitable for single PIP, double window and multi PIP applications BUS • Data formats 4 : 1 : 1 (all modes) and 4 : 2 : 2 (most modes)
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bAB9079nb
DA05 display
display DA05
TDA9321H
741071
A302 w3
PICTURE TUBE
DA03
DA115
SAB9079HS
SQFP128
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Untitled
Abstract: No abstract text available
Text: ADVANCE 256K x 18/128K x 36 2.5V I/O, LATCHED LATE WRITE SRAM MT59L256V18L MT59L128V36L 4.5Mb LATE WRITE SRAM FEATURES • • • • • • • • • • • • • • • • • Fast cycle times 5ns, 5.5ns and 6ns 256K x 18 or 128K x 36 configurations
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18/128K
MT59L256V18L
MT59L128V36L
18/128KX
MT59L256V18L
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Untitled
Abstract: No abstract text available
Text: 1.0 Product Description The R S8228 Octal ATM Transm ission Convergence TC PH Y device dram ati cally increases the level o f integration for switches and access systems. The R S8228 integrates all o f the ATM Layer processing functions found in the ATM
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S8228
af-phy0043
RS8228
N8228DSA
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Untitled
Abstract: No abstract text available
Text: ADVANCE 256K x 18/128K x 36 2.5V I/O, PIPELINED LATE WRITE SRAM MICRON I TECHNOLOGY, INC. MT59L256V18P MT59L128V36P 4.5Mb LATE WRITE SRAM FEATURES • • • • • • • • • • • • • • • • Fast cycle times 4.5ns, 5ns, 6ns and 7ns 256K x 18 or 128K x 36 configurations
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18/128K
MT59L256V18P
MT59L128V36P
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Untitled
Abstract: No abstract text available
Text: ADVANCE M ir a r i M 2 5 5 K X I 8 /1 2 8 K X 3 6 I LVTTL, FLOW-THROUGH LATE WRITE SRAM d 5 M h ^ ,J IV IU I A T F •- MT59L256L18F MT59L128L36F WRITE SRAM Dual Clock and Single Clock FEATURES • • • • • • • • • • • • • • • •
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MT59L256L18F
MT59L128L36F
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MCM6573A
Abstract: S3888 MCM6576 MCM6575 character generator matrix pattern acab acab chip MCM66740 MCM66750 MCM6673 n25E
Text: M M O T O R O L A 8 1 9 2-B IT REA D O N L Y M EM O RIES RO W S E L E C T C H A R A C T E R G E N E R A T O R S T h e M C M 6 6 7 0 0 is a m ask-p ro g ra m m a b le 8 1 9 2 -b it h o rrzontal-scan (ro w select} c h a ra c te r gen erator. It c o n ta in s
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MCM66700
8192-bit
MCM6573A
S3888
MCM6576
MCM6575 character generator matrix pattern
acab
acab chip
MCM66740
MCM66750
MCM6673
n25E
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