ADV0505
Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The
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Original
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ADV0505
and14
12C-0707-E19
12F-1111-119
1F3-1313-D19
1F1-1717-A19
12U-1919-G19
12Y-2323-919
12Y-3333-419
12Y-3535-419
ADV0505
FBGA-484
daewon tray
daewon
FBGA672
PEAK TRAY bga
1f1-1717-a19
12C-0707-E19
FBGA256
Daewon BGA 7x7
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PDF
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daewon
Abstract: DAEWON drawing
Text: u Chapter 7 Trays Organic Pin Grid Array: 453-Pin OGF Notes: See next page for detailed views 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 60°C. 3 This drawing is for trays manufactured by DaeWon Semiconductor Packaging C
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453-Pin
daewon
DAEWON drawing
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PDF
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daewon
Abstract: Trays DAEWON drawing 453-Pin
Text: u Chapter 7 Trays Ceramic Pin Grid Array: 321-Pin, 453-Pin CGF Notes: See next page for detailed views 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 65°C. 3 This drawing is for trays manufactured by DaeWon Semiconductor Packaging Co.
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Original
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321-Pin,
453-Pin
daewon
Trays
DAEWON drawing
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PDF
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DAEWON tray drawing
Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
Text: Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect
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PDF
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Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher
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Original
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and5-741-9148
Kostat tray
KS-8308
CAMTEX
Kostat
DAEWON tray 48
DAEWON tray drawing
JEDEC Kostat
CERAMIC PIN GRID ARRAY CPGA AMD
daewon
D-12G-56LD-A13
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PDF
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DAEWON tray 48
Abstract: daewon tray daewon 3476a 12B-0609-F19 12B-0608-F19 VBK048 TRAY MPPO DAEWON FBGA FBGA 6x8
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: FAA 064 322.6 315.0 * 2.54 R. 4 PLACES VACUUM PICKUP CELLS 10 PLACES (6 CENTER CELLS, 4 SIDE CELLS) 5.62* X 7.62 SEE DETAIL "D" Z Y SEE DETAIL "E" X X 112.0 135.9* ±0.25 92.1 * 16.00 B 12.7 * 11.95 CHAMFER
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Original
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3417-1a
27458b
3467b
26040h
DAEWON tray 48
daewon tray
daewon
3476a
12B-0609-F19
12B-0608-F19
VBK048
TRAY MPPO
DAEWON FBGA
FBGA 6x8
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PDF
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daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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Original
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AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
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PDF
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daewon
Abstract: TRAY MPPO DAEWON tray 48 33 x 33 DAEWON tray FBD63 tray 8X14 FBC 30 A DAEWON 64 8X14 12b-0809-f19
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: FBC 048, VBD 064 322.6 REF. 2.54 R. 4 PLACES 6.35* 315.0* VACUUM PICKUP CELLS 18 PLACES 16 CENTER CELLS, 2 SIDE CELLS SEE DETAIL "D" X Y CLOSED CELLS 8 PLACES 7.62 Z SEE DETAIL "E" X X 119.9 ±0.25 135.9* 92.1
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Original
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26048i
3412-2a
26396f
FBD63
12F-0814-D19
3412-2b
daewon
TRAY MPPO
DAEWON tray 48
33 x 33 DAEWON tray
FBD63
tray 8X14
FBC 30 A
DAEWON 64
8X14
12b-0809-f19
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PDF
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DAEWON tray drawing
Abstract: TRAY MPPO daewon tray daewon mppo 12c daewon thee 12C-1111-E19 CABGA MPPO 12C-1111-E261
Text: R E V IS IO N S REV 01 02 DESCRIPTION MPPO 150‘C TRAY ADDED NEW PACKAGE, AC/ACG 100 & NOTES DATE 0 2 /2 1 /0 5 0 6 /0 1 /0 6 APPRO VED K K Thee KK Thee 6.35 S E E D ETA IL 'D ' !-»! 0.20 »3=DIAfzWI -10.20 M IAI X (M 7.62 m 311.15 - • +0.25 -0.13
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OCR Scan
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11x11
MSC17011
P7-134-
MSC-1702
DAEWON tray drawing
TRAY MPPO
daewon tray
daewon mppo 12c
daewon
thee
12C-1111-E19
CABGA
MPPO
12C-1111-E261
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PDF
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daewon
Abstract: 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: FLA 069, VBG 080, FEE 088, TLE 088, TSA 088, VBG 088, VBL 088 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 14 PLACES SEE DETAIL "D" X Y (12 CENTER CELLS, 2 SIDE CELLS) 6.35 * 7.62 BUMPS 11 PLACES Z SEE DETAIL "E"
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Original
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3472b
26946h
f27839b-opt2
daewon
3472A
DAEWON tray 10 x 9
12B-8116-119
12B-0811-119
DAEWON FBGA 8X11
daewon* fbga
DAEWON FBGA
TRAY MPPO
daewon* fbga 8*11
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PDF
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12B-0608-F19
Abstract: DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A
Text: Chapter 5 Trays Very Very Thin Small Outline No Lead Package: WNF 008 322.6 2.54 R. 4 PLACES * 315.0 VACCUM PICKUP CELLS 14 PLACES Y (12 CENTER CELLS, 2 SIDE CELLS) CLOSED CELLS 2 PLACES 6.35 SEE DETAIL "D" X BUMPS 12 PLACES * 7.62 Z SEE DETAIL "E" X
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Original
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0X45M
3466b
26022i
12B-0608-F19
DAEWON tray 48
daewon
daewon tray
FBGA 6x8
TRAY fbga 6X8
DAEWON FBGA
MPPO
fBGA package tray
3466A
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PDF
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daewon tray
Abstract: daewon TRAY MPPO 56LD MPPO DAEWON 100 3468B
Text: Chapter 5 Trays Shrink Small Outline Package: SSO 056 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 8 PLACES 6.35 * X Y 7.62 Z (4 CENTER CELLS, 4 SIDE CELLS) SEE DETAIL "E" X X 105.90 ±0.25 135.9* 92.1 * 21.18 B 12.7 * 25.70 15.00 16.15 CHAMFER
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Original
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3468b
26254d
daewon tray
daewon
TRAY MPPO
56LD
MPPO
DAEWON 100
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PDF
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daewon
Abstract: DAEWON tray 48 daewon tray 260 9 130 451 044 DAEWON FBGA 9 140 010 044 daewon tray TRAY MPPO
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: NLB 044, VDA 044, VDD 044, NLB 056, NSB 056 3416 \ f27328a \ 12-13-07 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 17 Oct 2008 5-63
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Original
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f27328a
f29719a
f29858a
daewon
DAEWON tray 48
daewon tray 260
9 130 451 044
DAEWON FBGA
9 140 010 044
daewon tray
TRAY MPPO
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PDF
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3469b
Abstract: daewon tray daewon FBe63 DAEWON FBGA MPSU 60 transistor DETAIL FBGA tray TRAY DAEWON MPSU
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: UDA 048, VDG 048 3535 \ 28809b \ 1.5.5 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 15 Aug 2007 5-35 Chapter 5 Trays Fine-Pitch Ball Grid Array: UDA 048, VDG 048
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Original
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28809b
3469b
26637c
daewon tray
daewon
FBe63
DAEWON FBGA
MPSU 60 transistor
DETAIL
FBGA tray
TRAY DAEWON MPSU
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PDF
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EN4900GC
Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
Text: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.
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PCN1-110704
EFM32G890F128
J-STD-020D,
JESD22-A113
JESD22-A104
C/125
JESD22-A103
JESD22-A102
JESD22-A110
EN4900GC
NC7720
CEL9220HF10
EME-G760L
EME-G760
HL832nxa
Yizbond
Hitachi EN4900GC
CEL9220
DS-7409HG
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PDF
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daewon
Abstract: DAEWON FBGA LAA064 FBGA 137 DAEWON LAA
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: LAA 064, LSA 064, LSE 064, LAA 080, LSB 080, MMB 112, FTM 115, FTM 137, FVE 137, FWC 137, FWD 137 3694 \ f27326 \ 5.21.8 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook
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f27326
3474b
27327d
daewon
DAEWON FBGA
LAA064
FBGA 137
DAEWON LAA
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PDF
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daewon
Abstract: VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ 044 3648 \ f28384b \ 8.1.7 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 6 Dec 2007 5-39 Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ044
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Original
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f28384b
VDJ044
28805c
3477b
27776c
daewon
VDJ044
TRAY MPPO
Trays 14 x 20
DAEWON FBGA
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PDF
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daewon
Abstract: DAEWON tray 48 3471A daewon tray DAEWON FBGA
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: NLA 048, NSA 048, VDC 048, NLA 060, MTA 133, NLC 133 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 10 PLACES BUMPS 8 PLACES Y (2 CENTER CELLS, 8 SIDE CELLS) 6.35 * SEE DETAIL "D" X 7.62 Z SEE DETAIL "E"
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Original
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29718b
29716a
daewon
DAEWON tray 48
3471A
daewon tray
DAEWON FBGA
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PDF
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DAEWON tray drawing
Abstract: TRAY 15X15 daewon tray daewon CABGA daewon msc1701 TRAY MPPO Package tray 15X15 DAEWON drawing MSA-3032
Text: REVISIONS REV 02 OBS D E S C R IP T IO N ADDED NEW PACKAGE - D A TE B C /B C G 196 & B F /B F G 2 8 9 OBSOLETE THE DRAWING CONVERTED TO P 7 - 2 4 6 - 0 0 0 A PPRO V ED 1 1 /0 1 / 0 7 0 5 /1 5 /0 9 KK Thee KK Thee 6 .3 5 S E E D E T A IL 'D ' !-»! o.go (H) I a T x W I
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OCR Scan
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P7-246-000)
15X15
-30VS
MSC17011
P7-139-
MSC-1707
DAEWON tray drawing
TRAY 15X15
daewon tray
daewon CABGA
daewon
msc1701
TRAY MPPO
Package tray 15X15
DAEWON drawing
MSA-3032
|
PDF
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daewon
Abstract: CO-029 daewon tray 21154-AB 125-3131-913N DAEWON JEDEC TRAY Shipping Trays 21154-BB
Text: Product Change Notification PCN #: 809 Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.
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Original
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31X31
21154-AB
21154-BB
daewon
CO-029
daewon tray
21154-AB
125-3131-913N
DAEWON JEDEC TRAY
Shipping Trays
21154-BB
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PDF
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CABGA 8X8
Abstract: DAEWON tray drawing 12C-0808-E19 BFG 183 MSA-3032 daewon CABGA daewon tray E261 msc1701 daewon
Text: REVISIONS REV 00 01 DESCRIPTION IN IT IA L R ELEASE A DDED NEW PAC KA G E - — 6,35 DATE 0 1 /1 4 /0 5 APPROVED QUAN LUU 0 4 /2 2 /0 9 KK Thee B F /B F G 81 h0-l Q.gQ H I aTxWI — 7,62 -|Q.gQ(H)|A|Z(l 311.15- +0.25 -0.13 -1 3 2 .0 8 • +0.25 -0.13
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OCR Scan
|
83-lOVS
P7-176-000
MSC-1777
MSC17011
CABGA 8X8
DAEWON tray drawing
12C-0808-E19
BFG 183
MSA-3032
daewon CABGA
daewon tray
E261
msc1701
daewon
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PDF
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FC-BGA
Abstract: T0812012 daewon tray
Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.
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AN-659-1
FC-BGA
T0812012
daewon tray
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PDF
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KS-886H
Abstract: Kostat tray
Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive
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AN-657-1
KS-886H
Kostat tray
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PDF
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DAEWON tray drawing
Abstract: TRAY DAEWON MPSU DAEWON tray 48 daewon CABGA MPSU 140 DAEWON tray 10 x 9
Text: 6 3 1 REVISION HISTORY NDTE i 1. TRAYS MUST MEET A L L REQUIREMENTS OF AMKDR/ANAM # 01-0431-228 3 PROCUREMENT SPEC FDR SHIPPING TRAY. 2. B A K EA B LE TRAYS ARE INTENDED TD BE CONTINUOUSLY BAKED FDR 48 HDURS AT THE BAK E TEMPERATURE AS SPECIFIED . 3. TDTAL U SA BLE C E L L CDUNT IS 220.
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OCR Scan
|
5M-1994.
DAEWON tray drawing
TRAY DAEWON MPSU
DAEWON tray 48
daewon CABGA
MPSU 140
DAEWON tray 10 x 9
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PDF
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