IBM "embedded dram"
Abstract: m5m4v4169 Intel 1103 DRAM Nintendo64 IBM98 toshiba fet databook dynamic memory controler MOSYS eDRAM "1t-sram" MoSys
Text: ABSTRACT MODERN DRAM ARCHITECTURES by Brian Thomas Davis Co-Chair: Assistant Professor Bruce Jacob Co-Chair: Professor Trevor Mudge Dynamic Random Access Memories DRAM are the dominant solid-state memory devices used for primary memories in the ubiquitous microprocessor systems of
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conn95]
64-Mbit
Woo00]
EE380
class/ee380/
Wulf95]
Xanalys00]
Yabu99]
IBM "embedded dram"
m5m4v4169
Intel 1103 DRAM
Nintendo64
IBM98
toshiba fet databook
dynamic memory controler
MOSYS eDRAM
"1t-sram"
MoSys
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MPC8313C
Abstract: 516-ball POWERPC 8548 MMU mpc8270cxxmiba The PowerPC 620 ISA MPC180LMB MPC823 MPC823E MPC850 MPC755CT
Text: Network/Embedded Processors Quarter 4, 2007 SG1007Q42007 Rev 0 SECURITY AND INTEGRATED COMMUNICATIONS PROCESSORS Security Processors Description Packaging Speed MHz Rev Voltage Core (V) Voltage IO/tol (V) Status MPC180LMB Product Security co-processor which interfaces gluelessly to 8xx system bus and 8260 local bus.
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SG1007Q42007
MPC180LMB
100-pin
MPC184VF
32-bit
252-ball
MPC824x
MPC8313C
516-ball
POWERPC 8548 MMU
mpc8270cxxmiba
The PowerPC 620 ISA
MPC180LMB
MPC823
MPC823E
MPC850
MPC755CT
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PH6N
Abstract: TRANSISTOR PH6N transistor ph4n
Text: SPEAr600 Embedded MPU with dual ARM926 core, flexible memory support, powerful connectivity features and programmable LCD interface Datasheet − production data Features • Dual ARM926EJ-S core up to 333 MHz: – Each with 16 Kbytes instruction cache + 16
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SPEAr600
ARM926
ARM926EJ-S
8/16-bit
DDR1333
PH6N
TRANSISTOR PH6N
transistor ph4n
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DDR133
Abstract: DDR200 K4X56163PE
Text: K4X56163PE-L F G Mobile-DDR SDRAM 16M x16 Mobile DDR SDRAM FEATURES • 1.8V power supply, 1.8V I/O power • Double-data-rate architecture; two data transfers per clock cycle • Bidirectional data strobe(DQS) • Four banks operation • Differential clock inputs(CK and CK)
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K4X56163PE-L
A10/AP
200us
DDR133
DDR200
K4X56163PE
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1. Mobile Computing block diagram
Abstract: DDR2-667 STLS2E02 STLS2F01 Loongson block stages of laptop computers cache architecture for MIPS 1 stls
Text: Low power 64-bit CPU 1GHz, power-efficient, MIPS-based CPU for affordable computing, thin clients and web appliances STMicroelectronics’ ST STLS is a family of processors addressing all the applications requiring high levels of performance and low power dissipation. The STLS
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64-bit
MIPS-64
STLS2E02
DDR1-333
STLS2F01
DDR2-667
FLOONGSON1007
1. Mobile Computing block diagram
DDR2-667
STLS2E02
STLS2F01
Loongson
block stages of laptop computers
cache architecture for MIPS 1
stls
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D80008
Abstract: No abstract text available
Text: PRELIMINARY INFORMATION L9D340G64BG2 4.0 Gb, DDR3, 64 M x 64 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: 1 00 1 enter-ter inated, u ull IO a age: 16 22 , 13 21 atri 2 1 all Matri all it : 1 00 S a e a ing oot rint er all en an ed, I edan e
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L9D340G64BG2
LDS-L9D340G64BG2-C
D80008
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transistor PH6n
Abstract: transistor PH7n ph5n PH6N transistor ph4n transistor ph0n ph7n ph1n lk1 K20 transistor ph5n
Text: SPEAr600 Embedded MPU with dual ARM926 core, flexible memory support, powerful connectivity features and programmable LCD interface Features • Dual ARM926EJ-S core up to 333 MHz: – Each with 16 Kbytes instruction cache + 16 Kbytes data cache ■ High performance 8-channel DMA
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SPEAr600
ARM926
ARM926EJ-S
8/16-bit
DDR1333
transistor PH6n
transistor PH7n
ph5n
PH6N
transistor ph4n
transistor ph0n
ph7n
ph1n
lk1 K20
transistor ph5n
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G.975.1
Abstract: DDR3 layout OTN Framer MXP2 ODTU12 stm 4 muxponder CBR10G tt 6222-1 HD-SDI over sdh OTN SWITCH
Text: MXP2 Datasheet - G00676-07 20 Gb/s SONET/SDH/OTN Mapper and Multiplexor MXP2 20 Gb/s SONET/SDH/OTN Mapper and Multiplexor Document Number: G00676 Version Number: 7 Released on: 2 March 2011 Security: PROPRIETARY and CONFIDENTIAL PRELIMINARY EXAR Corporation and the EXAR Corporation logo are trademarks of EXAR Corporation.
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G00676-07
G00676
G.975.1
DDR3 layout
OTN Framer MXP2
ODTU12
stm 4 muxponder
CBR10G
tt 6222-1
HD-SDI over sdh
OTN SWITCH
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DDR3-1066
Abstract: DDR3-1333 L9D320G32BG6 0-575V
Text: ADVANCE INFORMATION L9D320G32BG6 2.0 Gb, DDR3, 64 M x 32 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 16mm x 12mm, 10 x 13 matrix w/ 129 balls • Matrix ball pitch: 1.00mm
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L9D320G32BG6
LDS-L9D320G32BG6-A
DDR3-1066
DDR3-1333
L9D320G32BG6
0-575V
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L9D340G64BG2I15
Abstract: DDR3-1066 DDR3-1333 L9D340G64B L9D340G64BG2
Text: PRELIMINARY INFORMATION L9D340G64BG2 4.0 Gb, DDR3, 64 M x 64 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 16mm x 22mm, 13 x 21 matrix w/ 271balls
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L9D340G64BG2
271balls
LDS-L9D340G6BG2-A
L9D340G64BG2I15
DDR3-1066
DDR3-1333
L9D340G64B
L9D340G64BG2
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MPC8379
Abstract: AN2583 ddr1 sdram mpc8343 sdram controller 001B MPC8347 MPC8349 MPC8540 MPC8541E
Text: Freescale Semiconductor Application Note AN2583 Rev. 5, 08/2007 Programming the PowerQUICC III/ PowerQUICC II Pro DDR SDRAM Controller The Freescale PowerQUICC™ III and PowerQUICC II Pro devices are the latest PowerQUICC integrated communication processors and the first PowerQUICC
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AN2583
MPC8379
AN2583
ddr1 sdram
mpc8343
sdram controller
001B
MPC8347
MPC8349
MPC8540
MPC8541E
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mpc8314
Abstract: KMPC Freescale SST MPC mpc8313 etsec Ethernet freescale 352 tepbga MPC864x Freescale usb mcf51jm128 MPC55XX CONFIG P2010 MPC823
Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: CWH-PPC-8540N-VE, MPC55xx
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CWH-PPC-8540N-VE,
MPC55xx
SG1007Q22009
MPC184VF
mpc8314
KMPC
Freescale SST MPC
mpc8313 etsec Ethernet
freescale 352 tepbga
MPC864x
Freescale usb mcf51jm128
MPC55XX CONFIG
P2010
MPC823
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db9 JTAG CONNECTOR
Abstract: Xilinx 8.1i spear linux ips project Head200 spear DDR133 CD ROM board diagram development board Xilinx Ethernet development
Text: SPEAr Head200 development board SPEAr Head200 core and FPGA customization mode supported, for quick and easy project development The SPEAr Head200 development board from STMicroelectronics has been specifically designed to provide a quick and easy route to SPEAr Head200 based project
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Head200
FLSPEARHDB0206
db9 JTAG CONNECTOR
Xilinx 8.1i
spear linux
ips project
spear
DDR133
CD ROM board diagram
development board
Xilinx Ethernet development
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Untitled
Abstract: No abstract text available
Text: Intel Xeon® Processor E3-1200 v2 Product Family Datasheet – Volume 2 of 2 May 2012 Document Number: 326773-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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E3-1200
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BA 5810
Abstract: MPC8548 mpc8379 MPC85xxEC uboot freescale mpc8313 MPC83xx 001B MPC8572 MPC8343 MPC8347
Text: Freescale Semiconductor Application Note AN2583 Rev. 8, 12/2008 Programming the PowerQUICC III/PowerQUICC™ II Pro DDR SDRAM Controller The Freescale PowerQUICC™ III and PowerQUICC™ II Pro devices are the latest PowerQUICC integrated communication processors and the first PowerQUICC
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AN2583
BA 5810
MPC8548
mpc8379
MPC85xxEC
uboot freescale mpc8313
MPC83xx
001B
MPC8572
MPC8343
MPC8347
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LM 7447
Abstract: IBM PowerPC 7448 user guide XPC823E MCF5327 MCF5328 MCF5329 MCF5372 MCF5372L MCF5373 MCF5373L
Text: Network and Communications Processors Quarter 4, 2005 SG1007Q42005 Rev 0 About This Revision–Q4/2005 When new products are introduced, a summary of new products will be provided in this section. However, the New Product section will only appear on this page when new products
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SG1007Q42005
Q4/2005
SG1007Q42005
LM 7447
IBM PowerPC 7448 user guide
XPC823E
MCF5327
MCF5328
MCF5329
MCF5372
MCF5372L
MCF5373
MCF5373L
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AMCC date code
Abstract: MPC180LMB LM 7447 mc7447A freescale 352 tepbga MCF5208 SG1007 GBIC EVALUATION BOARD CodeTAP 68360 KMPC
Text: Network and Communications Processors Quarter 3, 2005 SG1007Q32005 Rev 0 About This Revision–Q3/2005 When new products are introduced, a summary of new products will be provided in this section. However, the New Product section will only appear on this page when new products
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SG1007Q32005
Q3/2005
MCF5208
SG1007Q32005
AMCC date code
MPC180LMB
LM 7447
mc7447A
freescale 352 tepbga
MCF5208
SG1007
GBIC EVALUATION BOARD
CodeTAP 68360
KMPC
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MS08QD4
Abstract: MCF52236 MPC56xx instruction set digrf MCF52252 MMM6000 MMM7010 MPC5602B MS08EL32 MPC56xx
Text: SG1000mini Freescale Semiconductor Product Selector Guides Quarter 2, 2009 Product Selector Guide Cross-Reference, SG1000CR Automotive, SG187 Analog and Mixed Signal Power Management, SG1002 Digital Signal Processors DSP , SG1004 Network/Embedded Processors, SG1007
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SG1000mini
SG1000CR
SG187
SG1002
SG1004
SG1007
SG1009
SG1010
SG1013
32-Bit
MS08QD4
MCF52236
MPC56xx instruction set
digrf
MCF52252
MMM6000
MMM7010
MPC5602B
MS08EL32
MPC56xx
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TRANSISTOR PH6N
Abstract: ph6n transistor PH7n ph5n transistor ph5n transistor ph4n transistor ph0n ph7n M95xx "ph4n"
Text: SPEAr600 Embedded MPU with dual ARM926 core, flexible memory support, powerful connectivity features and programmable LCD interface Datasheet − production data Features • Dual ARM926EJ-S core up to 333 MHz: – Each with 16 Kbytes instruction cache + 16
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SPEAr600
ARM926
ARM926EJ-S
8/16-bit
DDR1333
TRANSISTOR PH6N
ph6n
transistor PH7n
ph5n
transistor ph5n
transistor ph4n
transistor ph0n
ph7n
M95xx
"ph4n"
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ddr3 pinout
Abstract: wrs4 MR1121
Text: PRELIMINARY INFORMATION L9D340G64BG2 4.0 Gb, DDR3, 64 M x 64 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: s 6CC 6CC1 6 Ò 6 s 6 CENTER TERMINATED PUSHPULL )/ s 0ACKAGE MM X MM X MATRIX W BALLS s -ATRIX BALL PITCH MM
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L9D340G64BG2
DDR3-1333
DDR3-1066
DDR3-800
LDS-L9D340G64BG2-B
ddr3 pinout
wrs4
MR1121
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b10 45g
Abstract: srt 8n PS-AC150 DDR3-1066 DDR3-1333
Text: ADVANCE INFORMATION L9D345G72BG5 4.5 Gb, DDR3, 64 M x 72 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 25mm x 25mm, 16 x 16 matrix w/ 255 balls • Matrix ball pitch: 1.00mm
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L9D345G72BG5
LDS-L9D345G72BG5-A
b10 45g
srt 8n
PS-AC150
DDR3-1066
DDR3-1333
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LG MS 7541 MOTHERBOARD SERVICE MANUAL
Abstract: DDR3 DRAM layout AM2r2 Processor Functional amd socket s1g4 ED58 diode lg monitor 700e diagram A854 TOM - 2088 - BH IC TOP 8901 AMD Infrastructure Roadmap
Text: 31116 Rev 3.48 - April 22, 2010 AMD Family 10h Processor BKDG Cover page BIOS and Kernel Developer’s Guide BKDG For AMD Family 10h Processors Advanced Micro Devices 1 31116 Rev 3.48 - April 22, 2010 AMD Family 10h Processor BKDG 2005–2010 Advanced Micro Devices, Inc. All rights reserved.
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amba bus architecture
Abstract: PPC440 AMBA AMBA APB bus protocol
Text: The CoreConnect Bus Architecture Recent advances in silicon densities now allow for the integration of numerous functions onto a single silicon chip. With this increased density, peripherals formerly attached to the processor at the card level are integrated onto the same die as the processor. As a result, chip designers must now address issues
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Untitled
Abstract: No abstract text available
Text: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 2 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-3000K and i7-3000 Processor Series for the LGA-2011 Socket
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LGA-2011
i7-3960X
i7-3000K
i7-3000
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