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    delamination

    Abstract: delamination leadframe CSAM J-STD-020C die paddle SLZA002 texas instruments reliability report
    Text: Moisture-Sensitivity Classification of Flange-Mounted Packages at Texas Instruments Application Report Literature Number: SLZA002 September 2007 2 SLZA002 – September 2007 Submit Documentation Feedback Contents 1 2 3 4 Introduction. 5


    Original     		PDF SLZA002 delamination delamination leadframe CSAM J-STD-020C die paddle SLZA002 texas instruments reliability report

    JEDEC J-STD-020C

    Abstract: JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A
    Text: IPC/JEDEC J-STD-020C July 2004 Supersedes IPC/JEDEC J-STD-020B July 2002 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public


    Original     		PDF J-STD-020C J-STD-020B 1-580987-46-X JEDEC J-STD-020C JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A

    Reflow

    Abstract: JEDEC J-STD-020d.1 JEP-140 JEP140 J-STD-035 JESD22-B112 JEDEC J-STD-020d JESD47 JESD22-B108 IPC-020d-5-1
    Text: IPC/JEDEC J-STD-020D.1 March 2008 Supersedes IPC/JEDEC J-STD-020D August 2007 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public


    Original     		PDF J-STD-020D J-STD-020D Reflow JEDEC J-STD-020d.1 JEP-140 JEP140 J-STD-035 JESD22-B112 JEDEC J-STD-020d JESD47 JESD22-B108 IPC-020d-5-1

    200B

    Abstract: AN598 DK-2750 RG41 popcorn defect analysis to-220
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		PDF AN598 200B AN598 DK-2750 RG41 popcorn defect analysis to-220

    texas instruments packing label

    Abstract: SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64
    Text: TEXAS INSTRUMENTS Notification for the Qualification of the S-Pad Leadframe Conversion for Certain TQFP Packages October 17, 1995 Abstract Texas Instruments Advanced System Logic ASL is converting conventionally designed leadframes to the newly designed Small Pad (S-Pad) leadframe. This breakthrough in device packaging will make


    Original     		PDF 7150M CDC582 CDC586 CDC2582 CDC2586 SN250056 SN74ACT2235-XX SN74ACT7807-XX SN74ACT7808-XX SN10067 texas instruments packing label SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64

    Moisture Sensitivity Levels MICROCHIP PIC Package

    Abstract: 78610 delamination leadframe barber excursion AN598
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		PDF AN598 Moisture Sensitivity Levels MICROCHIP PIC Package 78610 delamination leadframe barber excursion AN598

    AUS308

    Abstract: AUS308 thermal kester 256 AUS303 AUS-308 aus5 kester 245 solder wire Lead Free reflow soldering profile BGA
    Text: Challenges in Manufacturing Reliable Lead-Free and RoHS-Compliant Components WP-CHMFGRELLDFR-2.0 White Paper The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that


    Original     		PDF

    tm 1628 smd

    Abstract: AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		PDF AN598 DS00599B-page tm 1628 smd AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN

    1n4733 smd

    Abstract: moisture during operation triac scr schematic AN599 capacitors coefficient of thermal expansion soft solder die bonding TP2222A triac triggering ic DS00598A-page Triac soft turn on
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		PDF AN598 DS00599B-page 1n4733 smd moisture during operation triac scr schematic AN599 capacitors coefficient of thermal expansion soft solder die bonding TP2222A triac triggering ic DS00598A-page Triac soft turn on

    JEP113-B

    Abstract: MIL-B-81705B JESD22-A113-B delamination leadframe WOLFSON SUFFIX REV J-STD-020A WOLFSON SUFFIX V moisture sensitive handling and packaging WAN-108
    Text: WAN-108 Moisture Sensitivity Classification and Plastic IC Packaging w Applications Note, November 2001, Rev 1.2 CONTENTS BRIEF SUMMARY . 1 WHY ARE PARTS MOISTURE SENSITIVE?. 1


    Original     		PDF WAN-108 A113-B) J-STD-020A, JESD22-A113-B: JEP113-B: WAN-108 JEP113-B MIL-B-81705B JESD22-A113-B delamination leadframe WOLFSON SUFFIX REV J-STD-020A WOLFSON SUFFIX V moisture sensitive handling and packaging

    HSMS-286

    Abstract: HSMS-282 HSMP-38 QSMS-295 295C punch anvil QSMS HSMS-281 HSMS-285 marking codes sc70
    Text: Date: To: December 1, 2000 All Agilent customers using SOT-323 SC70 3-Lead Diodes From : Boon-Teong CHAN, QA/CS Manager Subject : Recall Notification for SOT-323 (SC-70 3-Lead) Surface Mount Diode Unused Inventory-Potential Vf Instability Background Analysis of a customer return in November has identified a potential Vf instability for subject diodes manufactured


    Original     		PDF OT-323 SC-70 QSMS-295C HSMS-282C* HSMS-282C HSMS-286 HSMS-282 HSMP-38 QSMS-295 295C punch anvil QSMS HSMS-281 HSMS-285 marking codes sc70

    IPC-SM-786A

    Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE ic packages A113 PMC-951041 baxter iv bag GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICES
    Text: APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES HANDLING OF MOISTURE SENSITIVE PLASTIC PACKAGES APPLICATION NOTE ISSUE 3: SEPTEMBER 1997 PMC-Sierra, Inc. 105 - 8555 Baxter Place Burnaby, BC Canada V5A 4V7 604 .415.6000 APPLICATION NOTE


    Original     		PDF PMC-951041 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE ic packages A113 PMC-951041 baxter iv bag GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICES

    822 smd

    Abstract: MIL-STD-81705 MIL-B-81705 cap intel 815 reflow profile manufacturing process calcium chloride molecular sieve A5753-01 Cu6Sn5 A5760 MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs
    Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the


    Original     		PDF

    JESD-26

    Abstract: RAI-5-039 mineral spirits bulk modulus Silicone mold release agent JESD-22 KITAGAWA MINERAL SPIRITS
    Text: Package Reliability All products and packages offered by National Semiconductor Corporation meet the minimum reliability qualification requirements outlined in Table 1 and Table 2 for hermetic and plastic packages, respectively. These minimum requirements are applied to new packages as well as to existing


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    intel packaging handbook 240800

    Abstract: Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging
    Text: 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM CH08WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 8 MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.1. INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and


    Original     		PDF CH08WIP intel packaging handbook 240800 Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging

    SMD codes databook

    Abstract: SMD CODE databook 822 smd EQUIVALENCE datasheet for all smd components moisture sensitive handling and packaging MIL-B-81705 cap manufacturing process calcium chloride ic shelf life MIL-STD-38510 QFP Shipping Trays
    Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the


    Original     		PDF

    SMD CODE 9Z

    Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
    Text: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2


    Original     		PDF 300mm SMD CODE 9Z 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products

    KE-G1250

    Abstract: KE-G1250 mold compound KEG1250LKDS PI7C8150BNDIE-33 JESD22-A-113-E JESD22-A113E PI7C8150BND reflow profile PBGA 256 reflow profile PI7C8150BNDE QA-1800
    Text: Pericom Semiconductor Corp. • 3545 North First St. • San Jose, CA 95134 • USA PRODUCT/PROCESS CHANGE NOTICE PCN PCN Number: 10-04 Means of Distinguishing Changed Devices: Date Issued: September 10, 2010 Product Mark Product(s) Affected: PI7C8150x (see affected part number list)


    Original     		PDF PI7C8150x KE-G1250 PD-2016 MS-034B/AAF-1 256-Pin, KE-G1250 mold compound KEG1250LKDS PI7C8150BNDIE-33 JESD22-A-113-E JESD22-A113E PI7C8150BND reflow profile PBGA 256 reflow profile PI7C8150BNDE QA-1800

    Untitled

    Abstract: No abstract text available
    Text: 1 20 August, 2013 Agenda  Motivation: Environmental and health endangerment of lead.  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:    2 Cooperations and partners Requirements, Applications and Approaches for possible solutions


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    kic 125

    Abstract: ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Text: 2 4 Performance Characteristics of IC Packages 1/22/97 10:05 AM CH04WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES 4.1. IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages:


    Original     		PDF CH04WIP kic 125 ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES

    Ablebond 71-1

    Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board
    Text: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages  DC resistance R of leads or pins  Capacitance (C) including lead-to-lead and loading capacitances  Inductance (L) including only self-inductance values for pins traces and wires (PGA) or


    Original     		PDF 93-WA-EEP-6 91-WA-EEP-27 91-WA-EEP-31 pp1059-1070 pp357-366 Ablebond 71-1 Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board

    electronic energy meters

    Abstract: Analog Devices Single Phase analog Energy Meter ic measurement electronic schematic energy meter
    Text: I N D U S T R Y P E R S P E C T I V E IC Technology and Failure Mechanisms Understanding reliability standards can raise quality of meters Guest column by Etienne Moulin, Analog Devices Inc. Electronic energy meters and electronic components reliability Today, utilities operate in a competitive


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Mini-Circuits AN-060-045 Excellence in Performance Proven strategies for producing the world’s best RF MMIC’s AN-60-045, REV. A, M150261, 04/14/2015 SH 1 OF 17 Mini-Circuits Table of Contents Page Introduction 2 Quality Designed-in Transient Current Protection Circuits


    Original     		PDF AN-060-045 AN-60-045, M150261, IPC/JEDECJ-STD-020C

    TSOP 48 thermal resistance

    Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
    Text: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate


    Original     		PDF MS-024 TSOP 48 thermal resistance TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024