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    DENSE-PAC MICROSYSTEMS Search Results

    DENSE-PAC MICROSYSTEMS Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    74AC11086D Texas Instruments Quadruple 2-Input Exclusive-OR Gates 16-SOIC -40 to 85 Visit Texas Instruments Buy
    74AC11244DW Texas Instruments Octal Buffers/Drivers 24-SOIC -40 to 85 Visit Texas Instruments Buy
    74AC11245DW Texas Instruments Octal Bus Transceivers 24-SOIC -40 to 85 Visit Texas Instruments Buy
    74AC16244DGGR Texas Instruments 16-Bit Buffers And Line Drivers With 3-State Outputs 48-TSSOP -40 to 85 Visit Texas Instruments Buy

    DENSE-PAC MICROSYSTEMS Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    4648T

    Abstract: 8M624 M8283
    Text: DENSE- PAC MI CROSYSTEMS D7E D | Dense-Pac Microsystems, Ine . S75T415 ODaanfl ñ ]~ 32KX8T BASED HIGH SPEED CMOS EEPROM FAMILY - PRELIMINARY * 7 ^ - / 3 DESCRIPTION: The Dense-Pac 32Kx8T Based Family is a-high performance series of Electrically Erasable and


    OCR Scan     		32Kx8T DPE4648T 64Kx8 DPE4968T DPE41288T DPE51288T DPE42568T DPE45128T DPE8M612T DPE8M624T 4648T 8M624 M8283 PDF

    Untitled

    Abstract: No abstract text available
    Text: f n n i M ' • DPZ256X8A3 - * V * Dense-Pac Microsystems, Inc. ^ _ 256K X 8 FLASH EEPROM DENSE-STACK MODULE PRELIMINARY DESCRIPTION: The DPZ256X8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic


    OCR Scan     		DPZ256X8A3 DPZ256X8A3 Z256X8 S52EE 120ns 150ns 170ns 200ns 250ns PDF

    6001.005

    Abstract: a724 64KX32 64KX4 DO001
    Text: DENSE-PAC MICROSYSTEMS 07E D | 57Se 41S ODQaiMO O | 64KX4 BASED Dense-Pac Microsystems, Ine. CM O S SRAM FAMILY -7 = *ñ -¿> 3 -/Q y '- DESCRIPTION: The Dense-Pac 64KX4 Based Family consiste of static random acce ss m em ories SRA M S) organized as described below.


    OCR Scan     		64KX4 DPS5124 DPS6432 64KX32, 128KX DPS12832 256KX 512KX wta002 DPS12832 6001.005 a724 64KX32 DO001 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 6 Megabit SRAM/FLASH EEPROM DPSZ384X16BIA3-ABS MICROSYSTEMS PRELIMINARY DESCRIPTION: The DPSZ384X16BIA3-ABS "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic


    OCR Scan     		DPSZ384X16BIA3-ABS DPSZ384X16BIA3-ABS 30A206-00 PDF

    Untitled

    Abstract: No abstract text available
    Text: □PM DPS256X16A3 Dense-Pac Microsystems, Ina O CERAMIC 256K X 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS256X16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC mounted on a


    OCR Scan     		DPS256X16A3 DPS256X16A3 A0-A16 PDF

    DPS41129-1201

    Abstract: 2712B 27128 eprom ci 2764 DPS41129 DPS40128-100C
    Text: DENSE-PAC MICROSYSTEMS 07E D | 275^415 □□□0120 M | - 8KX8 BASED Dense-Pac m . / r Microsystems, Inc. CM O S SRAM FAMILY DESCRIPTION: The Dense-Pac 8 K X 8 Based Family of Static Random A ccess M em ories SRAM , com plete w ith memory •interface logic and on-board capacitors are available in


    OCR Scan     		DPS1124 DPS40128 DPS41129 DPS40192 DPS41193 DPS40256 DPS41257 128KX DPS91288 DPS41129-1201 2712B 27128 eprom ci 2764 DPS40128-100C PDF

    DPS128X16AA3

    Abstract: Dense-Pac Microsystems DPS128X16A
    Text: CDPM ETSTMIS QGQGHME M • DPC EÒE D DENSE-PAC MICROSYSTEMS DPS128X16AA3 Dense-Pac Microsystems, Inc. ^ HIGH SPEED CERAMIC 128K X 16 CM OS SRAM MODULE ADVANCED INFORMATION “ 7= ^-2^ D ESCRIPTIO N; The DPS128X16AA3 "DENSE-STACK" module is a revolutionary new


    OCR Scan     		DPS128X16AA3 DPS128X16AA3 A0-A16 I/00-I/015 30a045-21 X-46-23-H Dense-Pac Microsystems DPS128X16A PDF

    Untitled

    Abstract: No abstract text available
    Text: T □PM Dense-Pac Microsystems, Inc. ^ DPS256X16AA3 HIGH SPEED CERAMIC 256K X 16 CMOS SRAM MODULE ADVANCED INFORMATION DESCRIPTION: The DPS256X16AA3 "DENSE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a


    OCR Scan     		DPS256X16AA3 DPS256X16AA3 A0-A16 Ij/04 30A045-01 PDF

    Untitled

    Abstract: No abstract text available
    Text: □PM DPS256X16AA3 Dense-Pac Microsystems, Inc. HIGH SPEED CERAMIC 256K X 16 CMOS SRAM MODULE O ADVANCED INFORMATION DESCRIPTION: The DPS256X16AA3 "DENSE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a


    OCR Scan     		DPS256X16AA3 DPS256X16AA3 30A04WJ1 PDF

    256K STACK RAM

    Abstract: 9000-098J making A10
    Text: DENSE-PAC MICROSYSTEMS 2ÛE D • 575^415 OODQSOb i* M D P C DPS256X16AA3 HIGH SPEED CERAMIC 256K X 16 CMOS SRAM MODULE ADVANCED INFORMATION DESCRIPTION: The DPS256X16AA3 "DENSE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems'


    OCR Scan     		DPS256X16AA3 DPS256X16AA3 A0-A16 I/00-I/015 30A045-01 9000-098J? E7ST41S T-46-23-14 256K STACK RAM 9000-098J making A10 PDF

    Untitled

    Abstract: No abstract text available
    Text: H Q DPS512S8A3 . . # Dense-Pac Microsystems, Inc. 0 512K X 8 BUFFERED/DECODED C M O S SR A M M O D U L E PRELIMINARY DESCRIPTION: The DPS512S8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip


    OCR Scan     		DPS512S8A3 DPS512S8A3 I/07A, PDF

    Untitled

    Abstract: No abstract text available
    Text: _ DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CM O S SRAM DPS128C32BV3 DESCRIPTION: The DPS128C32BV3 "VERSA-STACK" m odule is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless


    OCR Scan     		DPS128C32BV3 DPS128C32BV3 PDF

    Untitled

    Abstract: No abstract text available
    Text: OPM / V Dense-Pac Microsystems, Inc^ DPS512S8A3 512K X 8 BUFFERED/DECODED CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS512S8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC along with memory interface logic and capacitors mounted


    OCR Scan     		DPS512S8A3 DPS512S8A3 PDF

    4kx16 sram

    Abstract: No abstract text available
    Text: DENSE-PAC m C R O S Y S T E M S D7E D | 275^415 DGDGIDD 1 | 4KX4 BASED Dense-Pac 7^ Microsystems, Inc. DESCRIPTION: CMOS SRAM FAMILY - DIPS DPS88H04 - 7 V i/ * - P 3 - / Z- The 4KX4 Based Family is part of a new line of high speed static RAM modules developed by Dense-Pac Microsys­


    OCR Scan     		DPS88H04 DPS84H08 DPS88H04 DPS88H08 DPS88H16 4KX16 DPS88H08 DPS88H16-35M DPS88H16-55M DPS4X16-25C 4kx16 sram PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 MICROSYSTEMS DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC


    OCR Scan     		DPS128X32CV3/DPS128X32BV3 DPS128X32CV3/DPS128X32BV3 500mV DPS128X32CV3 California92841-1428 30A044-24 27STH1S 000170E! PDF

    Untitled

    Abstract: No abstract text available
    Text: □PM DPS512X16A3 . Dense-Pac Microsystems Inc. O CERAMIC 512K X 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS512X16A3 "DENSE-STACK" module is a re v o lu tio n a ry n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless


    OCR Scan     		DPS512X16A3 DPS512X16A3 1024K A0-A16 30A045-10 PDF

    Untitled

    Abstract: No abstract text available
    Text: ► DPS512X16AA3 Dense-Pac Microsystems, Inc. 0 HIGH SPEED CERAMIC 512K X 16 CMOS SRAM MODULE ADVANCED INFORMATION DESCRIPTION: The DPS512X16AA3 "DENSE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired


    OCR Scan     		DPS512X16AA3 DPS512X16AA3 1024K 30A045-11 PDF

    making A10

    Abstract: DPS512S8AA3
    Text: DENSE-PAC MICROSYSTEMS CDPM EñE D • 275^415 0000534 T ■ DPC DPS512S8AA3 HIGH SPEED CERAMIC 512K X 8 BUFFERED/DECODED CMOS SRAM MODULE Dense-Pac Microsystems, Inc. ^ ADVANCED INFORMATION _ 7^6-23-/V DESCRIPTION: The DPS512S8AA3 "DENSE-STACK" module is a revolutionary new high


    OCR Scan     		DPS512S8AA3 DPS512S8AA3 I/04A I/03A I/02A 1/01A I/07A I/06A 1/01B* making A10 PDF

    CIT- 20

    Abstract: DPS84H08-25C DPS84H08-25I DPS84H08-25M DPS84H08-55C ZIP-DPS4X16 4kx4 ram DPS88H16-25M 30A016-00
    Text: DENSE-PAC MICROSYSTEMS G7E D | 27ST41S OGOOIOD 1 I 4KX4 BASED Dense-Pac Microsystems, Inc. C M O S SR A M FA M ILY - D IP S -7 = D E SC R IP T IO N : - 7V The 4KX4 Based Family b part of a new line of high speed static RAM modules developed by Dense-Pac Microsys­


    OCR Scan     		27ST41S DPS84H08 DPS88H04 DPS88H08 DPS88H16 -16KX8 4KX16 NeedH16-55I DPS88H16-25M DPS88H16-45M CIT- 20 DPS84H08-25C DPS84H08-25I DPS84H08-25M DPS84H08-55C ZIP-DPS4X16 4kx4 ram 30A016-00 PDF

    30AQ

    Abstract: No abstract text available
    Text: DENSE-PAC 4 Megabits CMOS SRAM MICROSYSTEMS DPS256X16n3 DESCRIPTION: The DPS256X16n3 SRAM “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded


    OCR Scan     		DPS256X16n3 50-pin 256Kx16 512Kx8 120ns 150ns -t-85 5QA097-04 30AQ PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE PAC 4 Megabit High Speed CMOS SRAM DPS256X16Cn3/DPS256X16Bn3 MICROSYSTEMS DESCRIPTION: The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		DPS256X16Cn3/DPS256X16Bn3 DPS256X16Cn3/DPS256X16Bn3 50-pin DPS256X16Cn3/DPS256X16Bn3STACK California92841-1428 30A097-34 275T41S D0D1742 PDF

    Untitled

    Abstract: No abstract text available
    Text: _ \ \ '7 ' X{L _ DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 "V ERSA -STA C K " module is a revolutionary n ew high speed memory subsystem using Dense-Pac


    OCR Scan     		DPS128X32CV3/DPS128X32BV3 500mV 0A044-2 PDF

    ERL+35 BN3

    Abstract: No abstract text available
    Text: DENSE-PAC 2 Megabit High Speed CMOS SRAM DPS128X16Cn3/DPS128X16Bn3 MICROSYSTEMS DESCRIPTION: The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		DPS128X16Cn3/DPS128X16Bn3 DPS128X16Cn3/DPS128X16Bn3 50-pin 6Cn3/DPS128X1 ERL+35 BN3 PDF

    Untitled

    Abstract: No abstract text available
    Text: □PM DPS512X16A3 O PRELIMINARY Dense-Pac Microsystems, Inc. CERAMIC 512K X 16 CM O S SRAM MODULE DESCRIPTION: The DPS512X16A3 "DENSE-STACK" module is a re v o lu tio n a ry n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless


    OCR Scan     		DPS512X16A3 DPS512X16A3 1024K 30A04S-10 PDF