Untitled
Abstract: No abstract text available
Text: DIP32-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 4.70 TYP. 3/Dec. 11, 1996
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DIP32-P-600-2
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DIP32
Abstract: dip32 package
Text: PACKAGE DIMENSIONS DIP32 41.9 ± 0.3 17 1 16 14.0 ± 0.3 32 1.27 2.54 GD-D03201H-2 Ver.2004-03-10 15.24 3.3 4.83M AX 0.45 ± 0.1 0.64M IN 1.91 0 to 15° 0.25 ± 0.13 UNIT : mm
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Original
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DIP32
GD-D03201H-2
DIP32
dip32 package
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PDF
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dip32 package
Abstract: DIP32
Text: SANYO Semiconductor Dual In-line Package 32Pin Plastic DIP32 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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32Pin
DIP32
600mil)
ED-7303A)
51min
08max
DIP32
dip32 package
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PDF
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DIP32
Abstract: diode databook dip32 package
Text: DIP32-P-600-2.54 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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DIP32-P-600-2
DIP32
diode databook
dip32 package
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PDF
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Untitled
Abstract: No abstract text available
Text: Adapters - Phyton, Inc. Page 1 of 2 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Downloads All Programmers Products E-Shop Support Contact News Site Map AE-Q32U DIP32/QFP32 universal adapter. Device Search Description:
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AE-Q32U
DIP32/QFP32
ChipProg-48
DIP-32
QFP-32
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PDF
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Untitled
Abstract: No abstract text available
Text: AE-TS32W Page 1 of 2 AE-TS32W DIP32/TSOP32 specialized adapter for Flash memory. Device package dimensions: 8 x 20 mm, 0.5 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: z z z ChipProg+ ChipProg-40
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AE-TS32W
DIP32/TSOP32
ChipProg-40
ChipProg-48,
PA32TS20-OT
DIP-32
TSOP-32
com/downloads/adp/HTML/ae-ts32w
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PDF
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DIP32
Abstract: LC33864M LC33864P LC33864P-80 en4701 EN4701A
Text: Ordering number : EN4701A CMOS LSI LC33864P-80, M-70/80/10 512 K 65536 words x 8 bits Pseudo-SRAM Overview Package Dimensions The LC33864 series is com posed o f pseudo static RAM unit: mm that operate on a single 5 V pow er supply and is organized 3192-DIP32
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OCR Scan
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EN4701A
LC33864P-80,
M-70/80/10
LC33B64
LC33864
32-pin
DIP32
LC33864M
LC33864P
LC33864P-80
en4701
EN4701A
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PDF
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DIP32-P-400-2
Abstract: DIP32-P-400
Text: 32P4F Plastic 32pin 400mil DIP Weight g 3.24 Lead Material Alloy 42 17 1 16 E 32 c JEDEC Code – e1 EIAJ Package Code DIP32-P-400-2.54 Symbol L A1 A A2 D e SEATING PLANE b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.08
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32P4F
32pin
400mil
DIP32-P-400-2
DIP32-P-400
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32P4
Abstract: JEDEC 600Mil dip
Text: 32P4 Plastic 32pin 600mil DIP JEDEC Code – Lead Material Alloy 42 17 1 16 E 32 e1 c EIAJ Package Code DIP32-P-600-2.54 Weight g 4.08 D L A1 A A2 Symbol SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.1 0.51
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32pin
600mil
DIP32-P-600-2
32P4
JEDEC 600Mil dip
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PDF
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sot201
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP32: plastic dual in-line package; 32 leads 600 mil SOT201-1 ME D A2 L A A1 c e Z (e 1) w M b1 MH b 17 32 pin 1 index E 1 16 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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DIP32:
OT201-1
OT201-1
sot201
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PDF
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Untitled
Abstract: No abstract text available
Text: 32P4Y Plastic 32pin 300mil DIP 17 1 16 E 32 c JEDEC Code – Lead Material Alloy 42 e1 EIAJ Package Code DIP32-P-300-2.54 Weight g Symbol L A1 A A2 D SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 4.75 0.51
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32P4Y
32pin
300mil
DIP32-P-300-2
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PDF
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JEDEC 600Mil dip
Abstract: "lead material" DIP 32P4
Text: EIAJ Package Code DIP32-P-600-2.54 32P4 e b 16 1 D 17 Lead Material Alloy 42 32 JEDEC Code – Weight g 4.08 SEATING PLANE b1 A L E A2 A1 A A1 A2 b b1 c D E e e1 L Symbol Plastic 32pin 600mil DIP c Mar.’98 Dimension in Millimeters Min Nom Max – – 5.1
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DIP32-P-600-2
32pin
600mil
JEDEC 600Mil dip
"lead material" DIP
32P4
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PDF
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SOT201
Abstract: DIP32 package DIP32
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane DIP32: plastic dual in-line package; 32 leads 600 mil SOT201-1 ME D A2 L A A1 c e Z (e 1) w M b1 MH b 17 32 pin 1 index E 1 16 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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DIP32:
OT201-1
MO-015
SOT201
DIP32 package
DIP32
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PDF
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DIP32
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package 32Pin Plastic DIP32 600mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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32Pin
DIP32
600mil)
ED-7303A
51min
08max
DIP32
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PDF
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USB "DALI bridge"
Abstract: ST7FLITE09Y0B6 inDART ST72334N4 ST7FLITE29F2B6 ST7FLITE05Y0B6 ST7MDT20M-EPB hid usb circuit board dvp 336 ST7C334-INDART
Text: BACK NEXT MCU / MPU STMICROELECTRONICS Current 8-Bit Microcontrollers DIP-16 DIP-20 DIP-20 STMicroelectronics CURRENT STANDARD 8-BIT MICROCONTROLLERS cont. Abbreviations: ST7 Industry Standard Fast Core Architecture 8-Bit • • • Fast multiplication: 11 cycles or 1.37 µsecs for 8 x 8 bits (16-bit result).
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DIP-16
DIP-20
16-bit
DIP-42
511-ST7MDT20-DVP3
511-ST7MDT20-T32/DVP
511-ST7MDT20-T44/DVP
511-ST7MDT20-T64/DVP
511-ST7MDT20-T80/DVP
USB "DALI bridge"
ST7FLITE09Y0B6
inDART
ST72334N4
ST7FLITE29F2B6
ST7FLITE05Y0B6
ST7MDT20M-EPB
hid usb circuit board
dvp 336
ST7C334-INDART
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Untitled
Abstract: No abstract text available
Text: ¡Ordering number : ENi%5093A CMOS LSI No. * 5093A SA%YO LC378200PP, PM-10/LC378200PP, PM-20LV 8 MEG 1048576 words x 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Package Dimensions Overview The LC378200PP, PM-10 and LC378200PP, PM-20LV are 8388608-bit M ask Program m able Read Only
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OCR Scan
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LC378200PP,
PM-10/LC378200PP,
PM-20LV
3192-DIP32
LC378200PP]
PM-10
PM-20LV
8388608-bit
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PDF
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em78p372nso14j
Abstract: em78p372 EM78P259ND18J EM78P259NS EM78P153SP EM78P372N EM78P153SN EM78P374 IC51-0644-1972 EM78F661NA
Text: UWTR EM78 series USB writer UWTR v1.05.09 support body list 1 Support body sort by Body : (The Red line is update for v1.05.09) IC body Supporting Devices Package Type Package UWTR ADPNum UWTR SMD socket number Textool Part number EM78F541N EM78F541NAD16
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EM78F541N
EM78F541NAD16
DIP16
300mil
UWTR-ADP037
EM78F541NASO16A
150mil
UWTR-SO16/14-150
OTS-16-1
em78p372nso14j
em78p372
EM78P259ND18J
EM78P259NS
EM78P153SP
EM78P372N
EM78P153SN
EM78P374
IC51-0644-1972
EM78F661NA
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Untitled
Abstract: No abstract text available
Text: [Ordering number: EN %5092A CMOS LSI No.S*i5092A SAMYÖ LC374200RP, RM-10/LC374200RP, RM-20LV 4 MEG 524288 words x 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Overview Package Dimensions The LC374200RP, RM-10 and LC374200RP, RM-20LV are 4194304-bit M ask Program m able R ead Only
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OCR Scan
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i5092A
LC374200RP,
RM-10/LC374200RP,
RM-20LV
RM-10
4194304-bit
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PDF
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HMU 1
Abstract: No abstract text available
Text: ¡Ordering number : EN%; 5090A | CMOS LSI No. X 5090A SAXYO LC378100PP, PM-10/LC3781OOPP, PM-20LV 8 MEG 1048576 words x 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Overview Package Dimensions The LC3781 OOPP, PM-10 and LC378100PP, PM-20LV a re 8 3 8 8 6 0 8 -b it M ask P ro g ra m m a b le R ead O nly
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OCR Scan
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LC378100PP,
PM-10/LC3781OOPP,
PM-20LV
LC3781
PM-10
PM-20LV
HMU 1
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PDF
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marking Sanyo
Abstract: M 3211 TSOP44 M 3211 A
Text: MEMORY P A C K A G E D IM EN SIO N S 0A11 of Sanyo Memory package dimensions are illustrated below. #A11 dimensions are in mm, and dimensions which are not followed by min. or max. are represented by typical values. •N o marking is indicated. Package Dimensions 3192 unit : mm
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OCR Scan
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DIP32
600mil)
TSOP44
TSOP50n
marking Sanyo
M 3211
M 3211 A
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PDF
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Winslow ADAPTICs
Abstract: DIP40 PIC16C64
Text: Winslow ADAPTICs W939x DIP to PLCC T lead adapter series - o . r oooooooooooooooooooo B C oooooooooooooooooooo U e j - 0 . 24 " T ~ 0 . 4” 0 . 050 " - Part Num ber Top Package Bottom Package Device ‘A ’ ‘B’ ‘C ‘D’ ‘E’ W9390 DIP20
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OCR Scan
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W939x
W9390
W9391
W9392
W9393
W9394
W9395
W9396
W9397
W9398
Winslow ADAPTICs
DIP40
PIC16C64
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PDF
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Untitled
Abstract: No abstract text available
Text: ¡O rdering nu m b e r : E N SK5092A CMOS LSI NO .3& 5092A LC374200RP, RM-10/LC374200RP. RM-20LV 4 MEG 524288 words x 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Overview Package Dimensions The LC374200RP, RM-10 and LC374200RP, RM-20LV are 4 1 94304-bit M ask P rogram m able Read Only
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OCR Scan
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SK5092A
LC374200RP,
RM-10/LC374200RP.
RM-20LV
RM-10
94304-bit
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PDF
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tca 780
Abstract: SOP32 DIP32 TA4F
Text: ¡Ordering number : ENì*< 5090A CMOS LSI No. 5090A LC3781OOPP, PM-10/LC3781OOPP, PM-20LV 8 MEG 1048576 words x 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Overview Package Dimensions The LC3 781 OOPP, PM-10 and LC378100PP, PM-20LV are 8 3 8 8 6 0 8 -b it M ask Program m able Read Only
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OCR Scan
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LC3781
PM-10/LC3781
1P48576
LC378100PP,
PM-10
PM-20LV
8388608-bit
tca 780
SOP32
DIP32
TA4F
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PDF
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SOP32 data sheet
Abstract: LC371100SM LC371100SM-10 LC371100SM-20LV LC371100SP LC371100SP-10 LC371100SP-20LV LC371100ST LC371100ST-10 LC371100ST-20LV
Text: Ordering number : EN*5087C CMOS LSI LC371100SP, SM, ST-10/20LV 1 MEG 131072 wordsx 8 bits Mask ROM Internal Clocked Silicon Gate Preliminary Overview Package Dimensions The LC371100SP, LC371100SM and LC371100ST are 131,072-word × 8-bit organization (1,048,576-bit) mask
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5087C
LC371100SP,
ST-10/20LV
LC371100SM
LC371100ST
072-word
576-bit)
LC371100SP-10,
LC371100SM-10
SOP32 data sheet
LC371100SM-20LV
LC371100SP
LC371100SP-10
LC371100SP-20LV
LC371100ST-10
LC371100ST-20LV
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