DS 7408 DOOSAN Search Results

DS 7408 DOOSAN Result Highlights (5)

Part	Manufacturer	Description
67997-408HLF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch
69167-408HLF	Amphenol Communications Solutions	PV Shrouded Header, Wire to Board connector, 2 Wall Shrouded Header - Through Hole - Single row - 8 Positions 2.54mm - Vertical.
71607-408LF	Amphenol Communications Solutions	Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Right Angle, Surface Mount, Single row ,8 Positions, 2.54mm (0.100in) Pitch
92417-408HLF	Amphenol Communications Solutions	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
78207-408HLF	Amphenol Communications Solutions	PV Shrouded Header, Wire to Board connector, 2 Wall Shrouded Header - Through Hole - Double row - 8 Positions 2.54mm - Right Angle.

DS 7408 DOOSAN Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
MCL-E-679 hitachi Abstract: DS 7408 Doosan MCL-E-679 R1766 doosan 7409 Isola FR406 MCL-E-67 hitachi DS 7408 toshiba TLC LCD toshiba tlc Text: Multi Layer Board Multi Layer Board • INTRODUCTION Multi Layer Board MLB technology evolves at a faster pace every day. Multiprocessor scaling and differential impedance requirements, coupled with the need for faster high-performance materials, is driving circuit density and layer counts upward.	Original	135/DSC 130/TMA 150/DSC 145/TMA /100sec C-96/20/65 C-96/20/6 MCL-E-679 hitachi DS 7408 Doosan MCL-E-679 R1766 doosan 7409 Isola FR406 MCL-E-67 hitachi DS 7408 toshiba TLC LCD toshiba tlc	PDF

Catalog Datasheet

Type

Document Tags

PDF

MCL-E-679 hitachi

Abstract: DS 7408 Doosan MCL-E-679 R1766 doosan 7409 Isola FR406 MCL-E-67 hitachi DS 7408 toshiba TLC LCD toshiba tlc
Text: Multi Layer Board Multi Layer Board • INTRODUCTION Multi Layer Board MLB technology evolves at a faster pace every day. Multiprocessor scaling and differential impedance requirements, coupled with the need for faster high-performance materials, is driving circuit density and layer counts upward.

Original

135/DSC 130/TMA 150/DSC 145/TMA /100sec C-96/20/65 C-96/20/6 MCL-E-679 hitachi DS 7408 Doosan MCL-E-679 R1766 doosan 7409 Isola FR406 MCL-E-67 hitachi DS 7408 toshiba TLC LCD toshiba tlc

PDF