SED1330
Abstract: No abstract text available
Text: These drawings and specifications are the property of Densitron Corporation and may not be reproduced, copied or used without written permission 1. 2. 3. 4. REVISIONS REV. DESCRIPTION A RELEASED ON ECN #E1269 DATE APPROVED 02/12/02 MA Specification subject to change without notice.
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E1269
LM4729·
128G240
LM4729
SED1330
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RJ45 speed tech
Abstract: HALO HFJ11-S101E-s1 HFJ11-S101E-s1 HFJ11-S101E hfj11 speed tech rj45 S101E
Text: APPROVED MANUFACTURERS LIST FOR WEB PARTS 498-0070 -WEB ITEM NUMBER PART DESCRIPTION CONNECTOR/TRANSFORMER RJ45 10 BASE-T REVISION HISTORY Rev B C D ECO # Description of Change E12399 Release part to web store. E12694 Add Speed Tech part. E12784 REMOVE SPEED TECH/PRIDE TECH.
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E12399
E12694
E12784
HFJ11-S101E-S1
RJ45 speed tech
HALO HFJ11-S101E-s1
HFJ11-S101E-s1
HFJ11-S101E
hfj11
speed tech rj45
S101E
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Toshiba TLX-1741-C3M LCD display
Abstract: kcb104vg2ca-a43 LQ088H9DR01 TOSHIBA TLX-1741-C3M KCS077VG2EA-A43 LM32P073 tlx-1741-c3m M170EN04 LP104S06-A1 DMF50081N
Text: LCD Module to ERG Inverter Part Number Cross-Reference Guide LCD Manufacturer Acer Acer AND AND AND AND AND AND AND AND AND AND AND AND AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics AU Optronics
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L150X2M-1
L170E3-4
AND08C351-HB
AND10C209A-4HB
AND10C209A-DHB
AND10C209A-HB
AND10C273-4HB
AND10C273-DHB
AND10C273-HB
AND10C306L
Toshiba TLX-1741-C3M LCD display
kcb104vg2ca-a43
LQ088H9DR01
TOSHIBA TLX-1741-C3M
KCS077VG2EA-A43
LM32P073
tlx-1741-c3m
M170EN04
LP104S06-A1
DMF50081N
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bergquist
Abstract: 2500S2
Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at
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2500S20
2500S20
bergquist
2500S2
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Untitled
Abstract: No abstract text available
Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier
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1500S30
E1269
D2240
1500S30
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a3000
Abstract: No abstract text available
Text: Gap Pad A3000 Thermally Conductive, Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.6 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Reduced tack on one side to aid in application assembly • Electrically isolating
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A3000
E1269
a3000
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Untitled
Abstract: No abstract text available
Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at
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2500S20
E1269
D2240
2500S20
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Ultimate Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material Features and Benefits • Thermal conductivity: 1.3 W/m-K • Ultra conformability • Gel-like modulus TYPICAL PROPERTIES OF GAP PAD VO ULTIMATE PROPERTY
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E1269
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO • Thermal conductivity: 0.8 W/m-K • Enhanced puncture, shear and tear resistance • Conformable gap filling material • Electrically isolating
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E1269
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Untitled
Abstract: No abstract text available
Text: Gap Pad HC1000 “Gel-Like” Modulus Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD HC1000 PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus • Fiberglass reinforced for puncture,
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HC1000
E1269
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bergquist
Abstract: BERGQUIST GP1500 E1269 D149 D150 D2240 D257 D374 D575 D792
Text: Gap Pad 1500 Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500 PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Un-reinforced construction for additional compliancy • Conformable, low hardness
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E1269
D2240
bergquist
BERGQUIST GP1500
E1269
D149
D150
D2240
D257
D374
D575
D792
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Untitled
Abstract: No abstract text available
Text: Gap Filler 1100SF Two-Part Thermally Conductive, Silicone-Free, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1100SF PROPERTY Color / Part A • Thermal conductivity: 1.1 W/m-K • No silicone outgassing or extraction
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100SF
1100SF
1100SF
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Untitled
Abstract: No abstract text available
Text: Gap Pad 5000S35 High thermal conductivity plus “S-Class” softness and conformability Features and Benefits • High thermal conductivity: 5 W/m-K • Highly conformable,“S-Class” softness TYPICAL PROPERTIES OF GAP PAD 5000S35 PROPERTY Color IMPERIAL VALUE
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5000S35
5000S35
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gf3500s35
Abstract: GF-3500 D2196 3500S35 GF35 D149 D150 D2240 D257 D792
Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 • Thermal conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage
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3500S35
D2196
E1269
3500S35
gf3500s35
GF-3500
D2196
GF35
D149
D150
D2240
D257
D792
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Untitled
Abstract: No abstract text available
Text: Gap Pad 1000SF Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1000SF PROPERTY Color • Thermal conductivity: 0.9 W/m-K • No silicone outgassing • No silicone extraction • Reduced tack on one side to aid in
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1000SF
E1269
1000SF
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Soft Highly Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO SOFT • Thermal conductivity: 0.8 W/m-K • Conformable, low hardness • Enhanced puncture, shear and tear resistance
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E1269
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Ultra Soft Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus
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bergquist
Abstract: No abstract text available
Text: Sil-Pad A2000 Higher Performance, High Reliability Insulator Features and Benefits • Thermal impedance: 0.32°C-in2/W @50 psi • Optimal heat transfer • High thermal conductivity: 3.0 W/m-K TYPICAL PROPERTIES OF SIL-PAD A2000 PROPERTY Color IMPERIAL VALUE
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A2000
D2240
E1269
bergquist
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Untitled
Abstract: No abstract text available
Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE
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bergquist
Abstract: D575 E1269 5000S35 D149 D150 D2240 D257 D374 D792
Text: Gap Pad 5000S35 High thermal conductivity plus “S-Class” softness and conformability Features and Benefits TYPICAL PROPERTIES OF GAP PAD 5000S35 • High thermal conductivity: 5 W/m-K PROPERTY • Highly conformable,“S-Class” softness Color • Natural inherent tack reduces interfacial
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5000S35
E1269
D2240
5000S35
bergquist
D575
E1269
D149
D150
D2240
D257
D374
D792
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Untitled
Abstract: No abstract text available
Text: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction
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1500R
E1269
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Untitled
Abstract: No abstract text available
Text: Gap Filler 1000 Two-Part Thermally Conductive,Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 1000 PROPERTY Color / Part A • Thermal conductivity: 1.0 W/m-K • Ultra-conforming,designed for fragile and low-stress applications
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D2196
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Untitled
Abstract: No abstract text available
Text: Gap Pad A2000 High Performance,Thermally Conductive Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD A2000 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Electrically isolating
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A2000
E1269
D2240
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Untitled
Abstract: No abstract text available
Text: Gap Pad 2200SF Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2200SF PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Silicone-free formulation • Medium compliance with easy handling
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2200SF
E1269
D2240
2200SF
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