Untitled
Abstract: No abstract text available
Text: MAXIMUM SOLUTIONS Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications.
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EIA-700
VME64
VME64X
891-10-064-30-12000ethod
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Untitled
Abstract: No abstract text available
Text: MAXIMUM solutions Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications.
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EIA-700
VME64
VME64X
891-10-064-3ethod
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PDF
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EIA-783
Abstract: EIA-364-13 contact retention EIA-700 AAAB
Text: MAXIMUM solutions Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications.
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Original
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EIA-700
VME64
VME64X
EIA-783
EIA-364-13 contact retention
EIA-700 AAAB
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PDF
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EIA-783
Abstract: No abstract text available
Text: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions
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Original
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EIA-700
EIA-783
EIA-783
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PDF
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Untitled
Abstract: No abstract text available
Text: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions
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Original
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EIA-700
EIA-783
330mm
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PDF
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Untitled
Abstract: No abstract text available
Text: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions
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Original
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EIA-700
EIA-783
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PDF
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sda 5222
Abstract: No abstract text available
Text: 13 10 3 A :iRcun SIZE DIM.B DIM. C DIM. D I3.90 .547 I8.90 .744 23.90 .941 28.90 1.138 33.90 1.335 35.90 1.413 38.90 1.531 43.90 1.728 45.90 1.807 48.90 1.925 53.90 2.122 58.90 2.319 63.90 2.516 9.00 .354 14.00 .551 19.00 .748 24.00 .945 29.00 1.142 31.00
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SDA-71439-3*
sda 5222
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PDF
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71436-2164
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm Size 64 circuits Leaf-style design protects pins Antiflux design Low insertion force High-temperature LCP housing for use with reflow solder processes • ■
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E29179
71436-2164
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PDF
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71436-2164
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm Size 64 circuits Leaf-style design protects pins Antiflux design Low insertion force High-temperature LCP housing for use with reflow solder processes • ■
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Original
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St2164
71436-2164
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PDF
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71436-2164
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm Size 64 circuits Leaf-style design protects pins Antiflux design Low insertion force High-temperature LCP housing for use with reflow solder processes • ■
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PDF
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71439
Abstract: 71436-2164 71439-2164
Text: FEATURES AND SPECIFICATIONS 0.40 to 1.60mm .016 to .063" Pitch A Features and Benefits Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm Size 64 circuits Leaf-style design protects pins Antiflux design Low insertion force High-temperature LCP housing for use with reflow
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Original
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E29179
71439
71436-2164
71439-2164
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PDF
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71436-2164
Abstract: 71439-0164 71439-1164 71439-2164 2864 71439-2864 714390164 71439-3864
Text: Features and Benefits Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm Size 64 circuits Leaf-style design protects pins Antiflux design Low insertion force High-temperature LCP housing for use with reflow solder processes • ■ ■ ■ ■ ■ Reference Information
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Original
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E29179
Phosph71436-1164
71436-2164
71439-0164
71439-1164
71439-2164
2864
71439-2864
714390164
71439-3864
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PDF
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71741-0001
Abstract: No abstract text available
Text: 0.40 to 1.60mm .016 to .063" Pitch PCB and Wire Connectors 1.00mm (.039") A Mezzanine Board-to-Board Plug/Receptacle Features and Benefits • Mated heights: 8, 10, 12, 13 and 15mm ■ Leaf-style design protects pins ■ Low insertion force ■ For use in combinations of 1 to 4 mated pairs
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PS-71741-9999
E29179
25mmm
71741-0001
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PDF
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style 2464
Abstract: 714393464 PS-71436-999 3464 71436-2464 71439-1864 71436-2164 71439-0164
Text: 71436/71439 Dual Row, SMT Vertical Stacking Features and Benefits • Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm ■ Size 64 circuits ■ Leaf-style design protects pins ■ Low insertion force ■ For use in combinations of 1 to 4 mated pairs ■ High-temperature LCP housing for use with lead-free
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PS-71436-9999
E29179
style 2464
714393464
PS-71436-999
3464
71436-2464
71439-1864
71436-2164
71439-0164
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PDF
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Untitled
Abstract: No abstract text available
Text: 12 13 10 CIRCUIT SIZE DIM. A DIM. B DIM. C DIM. D I3.90 .547 I8.90 .744 23.90 .94 I 28.90 1.138 33.90 1.335 35.90 I.4I3 38.90 1.53 I 43.90 1.728 45.90 1.807 48.90 1.925 53.90 2 . 122 58.90 2.3 I9 63.90 2.5 I6 9.00 .354 I4.00 .55 I I9.00 .748 24.00 .945 29.00
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08/1B/ZO
SD-71436-003
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PDF
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TI436
Abstract: ES-88 PK-70873-0E07 TI436-0764
Text: 13 12 10 * THE PRIMARY SHIPPING CARTON WILL BE LABEL "COMPLIANT TO RoHS DIRECTIVE 20D2/95/EC AND ELV ANNEX II OF DIRECTIVE 2000/53/EC" CARTONS WITHOUT THIS LABEL MAY CONTAIN PRODUCT WITH LEAD. CIRCUIT SIZE 30 50 60 70 [xH 6.60 .260 6.55 + 0. 13/-0. .248 L_
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20D2/95/EC
2000/53/EC"
SDA-71436-0*
TI436
ES-88
PK-70873-0E07
TI436-0764
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PDF
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AM 5890 S
Abstract: No abstract text available
Text: - B - 1 • 00 ■35 . 03S .014 2 0 /. n n n n n n n n n n n-n-nl liw i n n n n n n n n n n i r 5.60*0.20 3.66 .144 [220 J S U U U U U U D T D T Ì u-fl -IUUÜÜUUUUUUÜ i =E 4.21 1.75 .166 .069 8.79 6.10 .240 ■SEE NOTE 6 6.60 .260 rtn 1.05 .04 I r I— ii
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SDA-71439-
AM 5890 S
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PDF
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AAAB OP
Abstract: 7I439-I764
Text: 13 12 10 CIRCUIT SIZE 30 50 60 70 TOP OF HO U S IN G TO S E A T IN G P L A N E 84 90 I00 I20 I8.90 .744 23.90 14.00 .55 I 17.40 .685 22.40 17.22 .678 2 2 .2 2 28.90 1.138 33.90 1.335 35.90 I.4I3 38.90 1.53 I 24.00 .945 29.00 1.142 31.00 34.00 1.339 27.40 1.079
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SDA-71439-1*
AAAB OP
7I439-I764
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PDF
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sda 5222
Abstract: PK-70873-013 PK-70873-063 PK-70873-014 209007 4390 PK-70873-06
Text: 13 12 10 CIRCUIT SIZE 5CT 6.60 .260 r m U_L r SEE NOTE 5 0 • r 1.20 5.30 .I8 /- 0 .I3 .209+.007/-.005 -r TOP OF HOUSING t TO SEATING PLANE 0.8Q + Q.26X-Q.3 I .03 I +.010/-.012 B [ä h NOTES: 0.04 ' .002 DIM. R DIM. C DIM. D □.90 9.00 12.40 12.22 .547 I8.90
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26/-C
SDA-71439-0*
sda 5222
PK-70873-013
PK-70873-063
PK-70873-014
209007
4390
PK-70873-06
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PDF
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i8490
Abstract: No abstract text available
Text: 10 13 A :iR c u n SIZE 3 DIM.B DIM. C DIM. D I3.90 .547 I8.90 .744 23.90 .941 28.90 1.138 33.90 1.335 35.90 1.413 38.90 1.531 43.90 1.728 45.90 1.807 48.90 1.925 53.90 2.122 58.90 2.319 63.90 2.516 9.00 .354 14.00 .551 19.00 .748 24.00 .945 29.00 1.142 31.00
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sj 2258
Abstract: No abstract text available
Text: 10 13 4 :iRcun SIZE D IM . A D IM I3.90 .547 I8.90 .744 23.90 .941 28.90 1.138 33.90 1.335 35.90 1.413 38.90 1.531 43.90 1.728 45.90 1.807 48.90 1.925 53.90 2.122 58.90 2.319 63.90 2.516 ou jU TOP OF HOUSING TO SEATING PLANE SEE NOTE 2 3 .B D IM 9.00 .354
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SDA-71436-1«
sj 2258
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PDF
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Untitled
Abstract: No abstract text available
Text: 13 12 10 CIRCUIT SIZE 5CT 6.60 .260 r m r U_ L 5.30 .I8 /- 0 .I3 .209+.007/-.005 -r TOP OF HOUSING t TO SEATING PLANE r SEE NOTE 5 0 • 1.20 0.8Q + Q.26X-Q.3 I .03 I +.010/-.012 B [ä h NOTES: 0.04 ' .002 DIM. R DIM. C DIM. D □.90 9.00 12.40 12.22 .547
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90ACES
SDA-71439-0*
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PDF
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71439-0164
Abstract: 71439-1164 717412001
Text: 1.00mm .039” Pitch Mezzanine Connectors • Meets IEEE 1386 standard (64 circuit) ■ Dual row, SMT, vertical stacking ■ Leaf-style design protects pins ■ Low insertion force ■ For use in combinations of 1 to 4 mated pairs ■ Current: 1.0A ■ Housing: Glass-filled LCP, UL 94V-0
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1-800-78MOLEX
USA-085
USA/5K/JI/JI/2006
71439-0164
71439-1164
717412001
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PDF
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Untitled
Abstract: No abstract text available
Text: 13 II 12 IS 9 8 7 6 1 71436 ;i r c u i t S IZ E 4 3 DIM, A DIM. B DIM. C DIM. D 13.90 9.00 '.58 :.40 .547 .354 .495 18.90 14.00 17.58 17.40 .744 .55 I .692 .685 23,90 19.00 .94 I .748 8,90 24.00 . 138 .945 20 30 40 50 33,90 60 !.58 70 84 1.079 29.00 32.58
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