ASL3C
Abstract: ALVCH16245 151x24
Text: TEXAS INSTRUMENTS Initial Notification for the ASL3C Process with Retrograde Well to the Freising, Germany Wafer Fabrication Site November 19, 1998 Abstract Texas Instrument’s Friesing, Germany Wafer Fabrication Facility is qualifying the ALS3C process with retrograde well. This process change will affect all products in the ALVCH product family.
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100ical
PCN5349
ASL3C
ALVCH16245
151x24
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68LC060
Abstract: F98S Motorola Mil Std. 883 xpc860 A113 J24A XPC850
Text: Reliability Report for Networking Communication Microprocessors XPC850 Rev 0.3 XPC860 XPC860T 0.42m Single Poly Wafer Fabrication Process Revision: 5/99 1.0 Purpose and Description This report summarizes the reliability data for Motorola communication microprocessors fabricated on the 0.42m single polysilicon process in our wafer
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XPC850
XPC860
XPC860T
68LC060
F98S
Motorola Mil Std. 883
xpc860
A113
J24A
XPC850
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Untitled
Abstract: No abstract text available
Text: TM September 2013 • What are Semiconductor Devices? • How Semiconductors are Made − Front-End Process − Back-End Process • Fabrication Facility and Equipment Issues • Business Aspects of Supplying Semiconductors TM 2 TM 4 A conductor carries electricity like a pipe
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F98S
Abstract: xpc860 68LC060 A113 J24A XPC850 Motorola, HBM, 1kv
Text: Freescale Semiconductor, Inc. Reliability Report for Freescale Semiconductor, Inc. Networking Communication Microprocessors XPC850 Rev 0.3 XPC860 XPC860T 0.42m Single Poly Wafer Fabrication Process Revision: 5/99 For More Information On This Product, Go to: www.freescale.com
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XPC850
XPC860
XPC860T
F98S
xpc860
68LC060
A113
J24A
XPC850
Motorola, HBM, 1kv
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ed28 smd diode
Abstract: hv 102 mos fet transistor diagram of high frequency pvc welding machine schematic diagram of electric cookers Ultrasonic Cleaner schematic engel injection machines TEG 2423 40khz ULTRASOUND CLEANER ultrasonic generator 40khz for cleaning schematic of trigger 555 n-mosfet
Text: FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES III. FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES 1. INTRODUCTION 2. FAILURE MECHANISMS AND SCREENING 3. FAILURE MECHANISMS ATTRIBUTED TO WAFER FABRICATION PROCESS 3.1 HOT CARRIER 3.3.1.1 INTRODUCTION 3.3.1.2 HOT CARRIER MECHANISM
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ED-4701-1
C-113:
ed28 smd diode
hv 102 mos fet transistor
diagram of high frequency pvc welding machine
schematic diagram of electric cookers
Ultrasonic Cleaner schematic
engel injection machines
TEG 2423
40khz ULTRASOUND CLEANER
ultrasonic generator 40khz for cleaning
schematic of trigger 555 n-mosfet
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Untitled
Abstract: No abstract text available
Text: APEX 20KC Programmable Logic Device April 2002 ver. 2.1 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices
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4001000CF33C8
EP20K1000CF33C9
EP20K1000C
EP20K1000CF672C7
EP20K1000CF672C8
EP20K1000CF672C9
EP20K1000CF33I8
EP20K1000C
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Untitled
Abstract: No abstract text available
Text: APEX 20KC Programmable Logic Device March 2002 ver. 2.0 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices
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40033C8
EP20K1000CF33C9
EP20K1000C
EP20K1000CF672C7
EP20K1000CF672C8
EP20K1000CF672C9
EP20K1000CF33I8
EP20K1000C
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verilog prbs generator
Abstract: prbs pattern generator using vhdl AOI gate d flip flop
Text: ASIC Design Guidelines Introduction The Atmel ASIC Design Guidelines constitute a general set of recommendations intended for use by designers when preparing circuits for fabrication by Atmel. The guidelines are independent of any particular CAD tool or silicon process. They are
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12/99/xM
verilog prbs generator
prbs pattern generator using vhdl
AOI gate d flip flop
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EP20K1000EFI672-2X
Abstract: EP20K100ETC144 EP20K100EFC324-3 EP20K100FC324-3V EP20K400EFC672-3
Text: APEX 20KC Programmable Logic Device April 2002 ver. 2.1 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices
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EP20K*
EP20K400GC655-1
EP20K400GC655-2
EP20K400GC655-3
EP20K1000EFI672-2X
EP20K100ETC144
EP20K100EFC324-3
EP20K100FC324-3V
EP20K400EFC672-3
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EP20K1000C
Abstract: EP20K200C EP20K400C EP20K600C EPC16 FA12 APEX 20ke development board sram
Text: APEX 20KC Programmable Logic Device February 2004 ver. 2.2 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices
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EP20K1000C
Abstract: EP20K200C EP20K400C EP20K600C EPC16 FA12 ep20k apex board
Text: APEX 20KC Programmable Logic Device February 2002 ver. 2.0 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices
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EP20K1000C
Abstract: EP20K1500C EP20K200C EP20K400C EP20K600C EPC16
Text: APEX 20KC Programmable Logic Device October 2001, ver. 1.2 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices
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Untitled
Abstract: No abstract text available
Text: APEX 20KC Programmable Logic Device February 2004 ver. 2.2 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices
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1000CB652C8
EP20K1000CB652C9
EP20K1000CF33C7
EP20K1000CF33C8
EP20K1000CF33C9
EP20K1000C
EP20K1000CF672C7
EP20K1000CF672C8
EP20K1000CF672C9
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EP20K1000C
Abstract: EP20K200C EP20K400C EP20K600C EPC16 FA12
Text: APEX 20KC Programmable Logic Device March 2002 ver. 2.0 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices
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digital clock using logic gates
Abstract: EP20K1000C EP20K100C EP20K1500C EP20K200C EP20K400C EP20K600C EPC16 epc1 configuration device
Text: APEX 20KC Programmable Logic Device April 2001, ver. 1.1 Data Sheet • Features. Preliminary Information ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices
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EP20K1000C
Abstract: EP20K1500C EP20K200C EP20K400C EP20K600C EPC16
Text: APEX 20KC Programmable Logic Device October 2001, ver. 1.2 Features. Data Sheet • Preliminary Information ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices
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ep20k160ebc
Abstract: ep20k400ef EP20K100F EP20K160EQ EP20K100EFC324-3 EP20K100FC324-3V EP20K200RC ep20k400CF672 EP20K100QI208-2
Text: APEX 20KC Programmable Logic Device March 2001, ver. 1.0 Data Sheet • Features. Preliminary Information ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices
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Strain gage report
Abstract: with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG
Text: Application Report SPRAA55 - August 2004 Use and Handling of Semiconductor Packages with ENIG Pad Finishes Eddie Moltz DSP Packaging ABSTRACT Electroless Nickel/Immersion Gold plating, or ENIG, is a versatile process and enables fabrication of high-density flip chip BGA substrates needed for high-performance IC chips.
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SPRAA55
Strain gage report
with or without underfill
flip SMT Texas
"Strain Gage"
ENIG
strain rate
texas instruments automotive flip chip
underfill Texas
alternative ENIG
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Untitled
Abstract: No abstract text available
Text: 5410 series VCXO Module ICs with Built-in Varicap OVERVIEW The 5410 series are VCXO module ICs supported 20MHz to 62MHz fundamental oscillation. They employ a recently developed varicap diode fabrication process at fixation communication usage that provides a low phase noise characteristic and a wide frequency pulling
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20MHz
62MHz
150ppm
40MHz
140ppm
44MHz
ND12007-E-02
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Untitled
Abstract: No abstract text available
Text: 5077 series VCXO Module ICs with Built-in Varicap OVERVIEW The 5077 series are LV-PECL output VCXO ICs that provide a wide frequency pulling range. They employ bipolar oscillator circuit and recently developed varicap diode fabrication process that provides a low phase noise characteristic and a wide frequency pulling range
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170MHz
ND12024-E-03
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Untitled
Abstract: No abstract text available
Text: 5420 series VCXO Module ICs with Built-in Varicap OVERVIEW The 5420 series are LV-PECL output VCXO ICs that provide a wide frequency pulling range. They employ bipolar oscillator circuit and recently developed varicap diode fabrication process that provides a low phase noise characteristic and a wide frequency pulling range
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250MHz
ND14003-E-00
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KOWA
Abstract: 2014n J0123 vitramon 10C
Text: STYLE V J 0 4 0 2 M onolithic C eram ic Chip C apacitors _ FEATURES Vttramon* proprietary "wet fabrication* process lor manufacturing ceramic chip capacitors results in maximum capacitance per unit area. A full range of dielectrics and voltage ratings is available in
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VJ0402
BP113
F-41102
MIL-C-5568'
KOWA
2014n
J0123
vitramon 10C
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itr 9009
Abstract: R/Vitramon J0603 marking code k4t KOWA specification CECC 3009 VJ0603Y104KXXMT
Text: _ STYLE V J 0 6 0 3 M onolithic C eram ic Chip C apacitors Igtl Ji FEATURES Vitramon* proprietary "wet fabrication' process or manufacturing ceramic crup capacitors results in maximum capacitance per unit area. A full range ot dielectrics and voltage ratings is available in industry
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VJ0603
J0603
11-4D-7191-8140
BP11S
F-41102
C-55661.
itr 9009
R/Vitramon
marking code k4t
KOWA
specification CECC 3009
VJ0603Y104KXXMT
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Vendome
Abstract: No abstract text available
Text: STYLE V J0 80 5 M onolithic C eram ic Chip C ap acitors FEATURES VHram on* proprietary "W et fabrication* process for m anufacturing ceram ic chip capacitors results in maximum capacitance per unit area. A fu ll range of dielectrics and voltage ratings is available in
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VJ0805
BP113
F-41102
3-5423-54i
011-33-IM80-2092
ILC-65681
Vendome
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