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    FLIP CHIP Search Results

    FLIP CHIP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
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    FLIP CHIP Price and Stock

    Littelfuse Inc SP4337-01WTG

    ESD Protection Diodes / TVS Diodes 5V 7A 0.18PF 15KV BI-DIR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI SP4337-01WTG Reel 20,000 10,000
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    • 10000 $0.106
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    Littelfuse Inc SP1005-01WTG

    ESD Protection Diodes / TVS Diodes 30pF30kV Bi 0201 Flip Chip
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI SP1005-01WTG Reel 20,000 10,000
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    • 10000 $0.067
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    Littelfuse Inc SP1312-01WTG

    ESD Protection Diodes / TVS Diodes 11pF 24kV 01005 BI-DIR DIS TVS DIODE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI SP1312-01WTG Reel 15,000
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    Littelfuse Inc SP3118-01WTG

    ESD Protection Diodes / TVS Diodes .3pF 10KV 18V 0201 Flipchip
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI SP3118-01WTG Reel 10,000
    • 1 -
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    • 10000 $0.094
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    Littelfuse Inc SP3130-01WTG

    ESD Protection Diodes / TVS Diodes .3pF 10KV 28V 0201 Flipchip
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI SP3130-01WTG Reel 10,000
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    • 10000 $0.097
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    FLIP CHIP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    capture and electronic packaging

    Abstract: Flip Chip Substrate tolerance thermal conductivity of substrate chip pads layout dram layout structure Pb210
    Text: Designing for Cost Effective Flip Chip Technology Jack Bogdanski White Electronic Designs Corp. Designing for Cost Effective Flip Chip Technology Designing For Cost Effective Flip Chip Technology Bump and flip approaches to semiconductor packaging have gained acceptance


    Original     		PDF

    radioactivity detector

    Abstract: 25-micron Alpha Industries alpha particle Delco
    Text: Alpha Partical Considerations In Flip Chip Technology Alpha Partical Considerations In Flip Chip Technology Alpha Partical Considerations In Flip Chip Technology 1 What are alpha particles? High energy particles are emitted during radioactive decay of heavier elements


    Original     		PDF

    AN2348

    Abstract: EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12
    Text: AN2348 Application note IPAD 400 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235.


    Original     		PDF AN2348 AN1235. AN2348 EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12

    motorola darlington power transistor

    Abstract: LIN 2.0 alternator motorola automotive power transistor Alternator regulator MCCF33095 MCCF33096 20PS20
    Text: Order this data sheet by MCCF33096/D MOTOROLA SEMICONDUCTOR~ MCCF33096 TECHNICAL OATA Advance Information Darlington Drive Flip-Chip The MCCF33096 is a Darlington Flip-Chip designed for use with the MCCF33095 Flip-Chip as a lamp driver in automotive charging


    Original     		PDF MCCF33096/D MCCF33096 MCCF33096 MCCF33095 MCCF33095 MCCF33096, MKI45BP, motorola darlington power transistor LIN 2.0 alternator motorola automotive power transistor Alternator regulator 20PS20

    EIA standards 783

    Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
    Text: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.


    Original     		PDF AN1235 AN2348. EIA standards 783 smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code

    BGA 64 PACKAGE thermal resistance

    Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect


    Original     		PDF 63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45

    106E

    Abstract: No abstract text available
    Text: THICKFILM LOW RESISTANCE KELVIN FLIP CHIP ISO-9001 Registered LRK SERIES • Precision Low Resistance Applications • Flip Chip Design With Kelvin Layout • Low Temperature Coefficient • Resistance to 0.003 ohms The IRC LRK Low Range Flip Chip Resistor Series


    Original     		PDF ISO-9001 150oC MIL-STD-202 MIL-PRF-55342 LRK2512 LRK2512 106E

    Pb210

    Abstract: flip chip substrate tolerance
    Text: Designing for Cost Effective Flip Chip Technology Application Note DESIGNING FOR COST EFFECTIVE FLIP CHIP TECHNOLOGY Bump and flip approaches to semiconductor packaging have gained acceptance in the industry. For the designer to take full advantage of this technology, attention to bump


    Original     		PDF AN0039 Pb210 flip chip substrate tolerance

    E700G

    Abstract: No abstract text available
    Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF DS577G E700G

    Untitled

    Abstract: No abstract text available
    Text: SFC05-5 TVS PENTA FLIP CHIP ARRAY DESCRIPTION The SFCO5-5 flip chip is designed to protect sensitive components at the board level. The size makes this flip chip unique and well suited for applications which have limited board real estate yet requires ESD protection.


    Original     		PDF SFC05-5

    HL832N

    Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    cu pillar

    Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: R Flip-Chip Packages Flip-Chip Packages As silicon devices become more integrated with smaller feature sizes as well as increased functionality and performance, packaging technology is also evolving to take advantage of these silicon advancements. Flip-chip packaging is the latest packaging option introduced


    Original     		PDF UG012

    Untitled

    Abstract: No abstract text available
    Text: R Flip-Chip Packages Flip-Chip Packages As silicon devices become more integrated with smaller feature sizes as well as increased functionality and performance, packaging technology is also evolving to take advantage of these silicon advancements. Flip-chip packaging is the latest packaging option introduced


    Original     		PDF UG012

    LRF1206

    Abstract: 106E LRF2512 LRF2010
    Text: THICKFILM LOW RESISTANCE FLIP CHIP LRF SERIES ISO-9001 Registered • Precision Low Resistance Applications • Low Cost Flip Chip Design • Low Temperature Coefficient • Resistance to 0.003 Ohms The IRC LRF Low Range Flip Chip Resistor Series offers very low resistance for applications


    Original     		PDF ISO-9001 LRF1206 150oC LRF2010 LRF2512 MIL-STD-202 MIL-PRF-55342 LRF1206 106E

    APP3599

    Abstract: DS2760 DS2761 AN3599
    Text: Maxim > App Notes > 1-Wire DEVICES GENERAL ENGINEERING TOPICS Keywords: DS2760, flip chip, DS2761, DS2761 flip-chip, RoHS, lead, Pb, lead free, Pb free, battery management, fuel gauge Sep 16, 2005 APPLICATION NOTE 3599 Assembling High-Lead Pb DS2761 Flip-Chips in a Pb-Free Assembly


    Original     		PDF DS2760, DS2761, DS2761 com/an3599 DS2760: DS2761: AN3599, APP3599, APP3599 DS2760 AN3599

    LSI Logic

    Abstract: Flip Chip Substrate led flip-chip heatsink Signal Path Designer
    Text: Flip Chip Ball Grid Array FPBGA Package Family Overview LSI Logic's FPBGA packages offer flip chip die interconnect, and support leadcounts in excess of 1700 to target high performance, high pin count applications. LSI Logic is the first company to qualify a flip chip package using


    Original     		PDF B20022 LSI Logic Flip Chip Substrate led flip-chip heatsink Signal Path Designer

    Untitled

    Abstract: No abstract text available
    Text: 54ACT534 54ACT534 Octal D Flip-Flop with TRI-STATE Outputs Literature Number: SNOS108 54ACT534 Octal D Flip-Flop with TRI-STATE Outputs General Description The ’ACT534 is a high-speed, low-power octal D-type flip-flop featuring separate D-type inputs for each flip-flop


    Original     		PDF 54ACT534 54ACT534 SNOS108 ACT534 ACT374

    54LS174

    Abstract: 54LS174DMQB 54LS174FMQB 54LS174LMQB 54LS175 LS174 LS175 DM74LS174
    Text: DM74LS174/DM74LS175 Hex/Quad D Flip-Flops with Clear General Description Features These positive-edge-triggered flip-flops utilize TTL circuitry to implement D-type flip-flop logic. All have a direct clear input, and the quad 175 versions feature complementary outputs from each flip-flop.


    Original     		PDF DM74LS174/DM74LS175 LS174 54LS174 54LS174DMQB 54LS174FMQB 54LS174LMQB 54LS175 LS175 DM74LS174

    54AC175

    Abstract: No abstract text available
    Text: 54AC175,54ACT175 54AC175, 54ACT175 Quad D Flip-Flop Literature Number: SNOS094A July 29, 2011 54AC175 • 54ACT175 Quad D Flip-Flop General Description Features The 'AC/'ACT175 is a high-speed quad D flip-flop. The device is useful for general flip-flop requirements where clock and


    Original     		PDF 54AC175 54ACT175 54AC175, 54ACT175 SNOS094A 54AC175 ACT175

    T74LS74

    Abstract: T54LS74AD2
    Text: DUAL D-TYPE POSITIVE EDGETRIGGERED FLIP-FLOP DESCRIPTION The T54LS/T74LS74A dual edge-triggered flip-flop utilizes Schottky TTL circuitry to produce high speed D-type flip-flops. Each flip-flop has individual clear_and set inputs, and also complementary Q


    OCR Scan     		PDF T54LS/T74LS74A T74LS74 T54LS74AD2

    T74LS74AB1

    Abstract: T74LS74a T54LS74AD2 T74LS74
    Text: DUAL D-TYPE POSITIVE EDGETRIGGERED FLIP-FLOP DESCRIPTION The T54LS/T74LS74A dual edge-triggered flip-flop utilizes Schottky TTL circuitry to produce high speed D-type flip-flops. Each flip-flop has individual clear_and set inputs, and also complementary Q


    OCR Scan     		PDF T54LS/T74LS74A T74LS74AB1 T74LS74a T54LS74AD2 T74LS74

    Alternator regulator

    Abstract: transistor marking ld3 Alternator Voltage Regulator Darlington motorola darlington power transistor
    Text: MOTOROLA MCCF33096 SEMICONDUCTOR TECHNICAL DATA Advance Information Darlington Drive Flip-Chip The MCCF33096 is a Darlington Flip-Chip designed for use with the MCCF33095 Flip-Chip as a lamp driver in automotive charging systems. The MCCF33095 and MCCF33096, when used with an appropriate Motorola Power


    OCR Scan     		PDF MCCF33096 MCCF33096 MCCF33095 MCCF33096, Alternator regulator transistor marking ld3 Alternator Voltage Regulator Darlington motorola darlington power transistor

    RCA-CD4027A

    Abstract: No abstract text available
    Text: C04027A Types oy l CMOS Dual J-K Master-Slave Flip-Flop The RCA-CD4027A is a single monolithic chip Integrated circuit containing tw o Iden­ tical complementary-symmetry J-K masterslave flip-flops. Each flip-flop has provisions for individual J, K, Set, Reset, and Clock in­


    OCR Scan     		PDF C04027A RCA-CD4027A RCA-CD4013A CD4027A 13--Dynamic