radioactivity detector
Abstract: 25-micron Alpha Industries alpha particle Delco
Text: Alpha Partical Considerations In Flip Chip Technology Alpha Partical Considerations In Flip Chip Technology Alpha Partical Considerations In Flip Chip Technology 1 What are alpha particles? High energy particles are emitted during radioactive decay of heavier elements
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motorola darlington power transistor
Abstract: LIN 2.0 alternator motorola automotive power transistor Alternator regulator MCCF33095 MCCF33096 20PS20
Text: Order this data sheet by MCCF33096/D MOTOROLA SEMICONDUCTOR~ MCCF33096 TECHNICAL OATA Advance Information Darlington Drive Flip-Chip The MCCF33096 is a Darlington Flip-Chip designed for use with the MCCF33095 Flip-Chip as a lamp driver in automotive charging
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MCCF33096/D
MCCF33096
MCCF33096
MCCF33095
MCCF33095
MCCF33096,
MKI45BP,
motorola darlington power transistor
LIN 2.0 alternator
motorola automotive power transistor
Alternator regulator
20PS20
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BGA 64 PACKAGE thermal resistance
Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect
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63Sn/37Pb)
BGA 64 PACKAGE thermal resistance
FCCSP
CABGA 6x6
amkor flip
fcBGA PACKAGE thermal resistance
bga 9x9 Shipping Trays
CABGA 8X8
BGA 256 PACKAGE power dissipation
BGA 256 PACKAGE thermal resistance
BGA45
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E700G
Abstract: No abstract text available
Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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DS577G
E700G
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HL832N
Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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cu pillar
Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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LSI Logic
Abstract: Flip Chip Substrate led flip-chip heatsink Signal Path Designer
Text: Flip Chip Ball Grid Array FPBGA Package Family Overview LSI Logic's FPBGA packages offer flip chip die interconnect, and support leadcounts in excess of 1700 to target high performance, high pin count applications. LSI Logic is the first company to qualify a flip chip package using
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B20022
LSI Logic
Flip Chip Substrate
led flip-chip heatsink
Signal Path Designer
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RCA03-4D
Abstract: SMD resistors codes FCR05 FCR06 FCR 06 smd jumper marking code G RCN06-10R smd code marking resistor RCA03 eia0603
Text: TOKEN FCR, RCA, RCN Chip Resistors Surface Mount Chip Resistors Token has introduced precision surface-mount resistor networks, chip array, and flip-chips. Preview Token has introduced precision surface-mount resistor networks, chip array, and flip-chips. Those no-lead packages are optimized
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APP3599
Abstract: DS2760 DS2761 AN3599
Text: Maxim > App Notes > 1-Wire DEVICES GENERAL ENGINEERING TOPICS Keywords: DS2760, flip chip, DS2761, DS2761 flip-chip, RoHS, lead, Pb, lead free, Pb free, battery management, fuel gauge Sep 16, 2005 APPLICATION NOTE 3599 Assembling High-Lead Pb DS2761 Flip-Chips in a Pb-Free Assembly
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DS2760,
DS2761,
DS2761
com/an3599
DS2760:
DS2761:
AN3599,
APP3599,
APP3599
DS2760
AN3599
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Untitled
Abstract: No abstract text available
Text: LUXEON Flip Chip Chip Scale Package LED Introduction Philips Lumileds LUXEON Flip Chip LED Technology enables the next generation of lighting applications. Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die level
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DS116
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Pb95Sn5
Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377
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DS2411:
DS2415:
DS2417:
DS2432:
DS2433:
DS2502:
DS2760:
DS2761:
DS2762:
DS9503:
Pb95Sn5
pcb warpage in ipc standard
ROSIN FLUX TYPE ROL0
EIA-746
IPC-6012A
MAXIM Assembly Locations OF CODE
underfill dispense needle
FR4 substrate height and thickness
DS2761X
J-STD-004 sn63pb37
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MARKING CODE SMD IC
Abstract: MO-211 SFC2282-50 very low leakage tvs
Text: SFC2282-50 ChipClampΤΜ Flip Chip TVS Diode with T-Filter PRELIMINARY PROTECTION PRODUCTS Description Features Flip Chip bidirectional EMI/RFI filter with integrated ESD protection ESD protection to The SFC2282-50 is a low pass T-filter with integrated
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SFC2282-50
SFC2282-50
5/50ns)
100MHz
MARKING CODE SMD IC
MO-211
very low leakage tvs
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Gps circuit diagram
Abstract: POWER DIVIDER 3GHz
Text: SFC2282-50 ChipClampΤΜ Flip Chip TVS Diode with T-Filter PRELIMINARY PROTECTION PRODUCTS Description Features Flip Chip bidirectional EMI/RFI filter with integrated ESD protection ESD protection to The SFC2282-50 is a low pass T-filter with integrated
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SFC2282-50
10MHz)
100MHz
SFC2282-50
Gps circuit diagram
POWER DIVIDER 3GHz
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MF0 IC U1X
Abstract: philips 22c Specification FCP2 Flip Chip Package SOT732CA2 12NC ordering code philips MF0ICU10
Text: INTEGRATED CIRCUITS ADDENDUM MF0 FCP2 U1 Flip Chip Package Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.0 October 2004 Flip Chip Package Specification MF0 FCP2 U1
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SCA74
MF0 IC U1X
philips 22c
Specification FCP2 Flip Chip Package
SOT732CA2
12NC ordering code philips
MF0ICU10
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Philips MF1 IC S50
Abstract: Philips Mifare 1 S50 mf1 s50 Mifare MF1 S50 Specification FCP2 Flip Chip Package FCP2 Philips Mifare 1 S50 specifications MF1 IC S50 mifare s50 mifare s50 MIFARE
Text: INTEGRATED CIRCUITS ADDENDUM MF1 FCP2 S50 Flip Chip Package Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.1 October 2004 Flip Chip Package Specification MF1 FCP2 S50
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SCA74
Philips MF1 IC S50
Philips Mifare 1 S50
mf1 s50
Mifare MF1 S50
Specification FCP2 Flip Chip Package
FCP2
Philips Mifare 1 S50 specifications
MF1 IC S50
mifare s50
mifare s50 MIFARE
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Untitled
Abstract: No abstract text available
Text: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for
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VESD05C-FC1
11-Mar-11
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VESD05C-FC1
Abstract: No abstract text available
Text: VESD05C-FC1 VISHAY Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for
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VESD05C-FC1
D-74025
14-Jul-04
VESD05C-FC1
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VESD05C-FC1
Abstract: No abstract text available
Text: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for
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VESD05C-FC1
08-Apr-05
VESD05C-FC1
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Untitled
Abstract: No abstract text available
Text: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for
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VESD05C-FC1
D-74025
02-May-05
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Untitled
Abstract: No abstract text available
Text: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for
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VESD05C-FC1
D-74025
15-Sep-05
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Untitled
Abstract: No abstract text available
Text: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for
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VESD05C-FC1
D-74025
18-May-05
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VESD05C-FC1
Abstract: No abstract text available
Text: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for
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VESD05C-FC1
18-Jul-08
VESD05C-FC1
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smd diode marking A3
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping
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SFC05-5
SFC05-5
SFC05--5
smd diode marking A3
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tvs smd marking 20a
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping
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SFC05-5
SFC05-5
tvs smd marking 20a
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