5271SC
Abstract: military mcm 1553 military mcm cpu R4400 RM5271
Text: Standard Products ACT5271SC Multichip Module Microprocessor with 2MB Secondary Cache www.aeroflex.com/Avionics May 5, 2005 FEATURES ❑ Footprint Compatible with Aeroflex-Plainview original ACT4431SC 1MB Secondary Cache MCM in a 280 lead Ceramic Quad Flat Pack CQFP
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ACT5271SC
ACT4431SC
RM5271
25MHz,
75MHz,
150MHz
R4400
R4400
64-bit
SCD5271SC
5271SC
military mcm 1553
military mcm cpu
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PDF
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acs150
Abstract: No abstract text available
Text: WE128K32-XG2TXE HI-RELIABILITY PRODUCT 128Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Times of 150, 200, 250, 300ns ■ Packaging: • 68 lead, Hermetic CQFP G2T , 22.4mm (0.880") square, 4.57mm (0.180") high (Package 509). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 1)
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WE128K32-XG2TXE
128Kx32
300ns
128Kx32;
256Kx16
512Kx8
WE128K32-XG2TXE
128K32
acs150
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PDF
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DSP96000
Abstract: DSP56000 DSP56100 DSP56166 DSP56166ROM DSP96002 brand tai hen FE60 marking ha02 Nippon capacitors
Text: Freescale Semiconductor, Inc. Order this document by DSP56166/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56166 Advance Information 16-bit General Purpose Digital Signal Processor Ceramic Quad Flat Pack CQFP Available in a 112 pin, small footprint, surface mount package.
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DSP56166/D
DSP56166
16-bit
DSP56166
DSP56100
DSP96000
DSP56000
DSP56166ROM
DSP96002
brand tai hen
FE60
marking ha02
Nippon capacitors
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PDF
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Untitled
Abstract: No abstract text available
Text: WE256K32-XG2TXE HI-RELIABILITY PRODUCT 256Kx32 EEPROM MODULE PRELIMINARY* FEATURES • Access Times of 150, 200, 250, 300ns ■ Packaging: • 68 lead, Hermetic CQFP G2T , 22.4mm (0.880") square, 4.57mm (0.180") high (Package 509). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 1)
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WE256K32-XG2TXE
256Kx32
300ns
256Kx32.
WE256K32-XG2TXE
256K32
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PDF
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emcp 162
Abstract: DL10 DL12 emcp TEA 2111 WT111 eMCP qualification dh29 code
Text: WC64P603EV-XQ3X RISC 603e MODULE, SECONDARY L2 CACHE ADVANCED * MAIN FEATURES • Based on RISC 603e 3.3V Microprocessor ■ Processor Clock Frequencies: 66.6, 80, 100 MHz ■ Footprint compatible with 603e µp CQFP package ■ Bus Clock Frequencies: Up to 66.6 MHz
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WC64P603EV-XQ3X
32-bit
Bus/64-bit
16KByte
512KByte
64Kx72)
Packaging240
P603E
240-Pin
emcp 162
DL10
DL12
emcp
TEA 2111
WT111
eMCP qualification
dh29 code
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PDF
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cpu aeroflex
Abstract: CQFP 240 Aeroflex R4400 RM5271 military mcm cpu
Text: ACT-5271SC Multichip Module Microprocessor with 2MB Secondary Cache Features • ■ ■ ■ ■ ■ ■ ■ ■ Footprint Compatible with Aeroflex’s original ACT-4431SC 1MB Secondary Cache MCM in the 280 lead Ceramic Quad Flat Pack CQFP QED RM5271 Dual Issue superscalar microprocessor - can issue one integer and one
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ACT-5271SC
ACT-4431SC
RM5271
25MHz,
75MHz,
150MHz
R4400
R4400
64-bit
ACT5271SC
cpu aeroflex
CQFP 240 Aeroflex
military mcm cpu
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PDF
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t101a
Abstract: resistor, BCR 5 WATT FST 172 ITO5 T102A DSP56000 DSP56100 DSP56156 DSP56156ROM DSP96002
Text: »«MOTOROLA m i SEMICONDUCTOR DSP56156 TECHNICAL DATA Advance Information 16-bit General Purpose Digital Signal Processor Ceramic Quad Flat Pack CQFP Available in a 112 pin, small footprint, surface mount package. The DSP56156 is the first member of Motorola's DSP56100 family of HCMOS, low power, 16-bit general purpose Digital Signal Pro
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OCR Scan
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DSP56156
16-bit
DSP56156
DSP56100
t101a
resistor, BCR 5 WATT
FST 172
ITO5
T102A
DSP56000
DSP56156ROM
DSP96002
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PDF
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Nippon capacitors
Abstract: MGS1000
Text: Order this document by DSP56166/D MOTOROLA - SEMICONDUCTOR TECHNICAL DATA DSP56166 Advance Information 16-bit General Purpose Digital Signal Processor Ceramic Quad Flat Pack CQFP Available in a 112 pin, small footprint, surface mount package. The DSP56166 is the second member of Motorola’s DSP56100 family of HCMOS, low power, 16-bit general purpose Digital Signal
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OCR Scan
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DSP56166/D
DSP56166
16-bit
DSP56166
DSP56100
1ATX31996-0
OSP56166/D
Nippon capacitors
MGS1000
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PDF
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1200 uf 400 volt nippon
Abstract: DSP96000 DSP56000 DSP56100 DSP56166 DSP56166ROM DSP96002 marking ha02 Nippon capacitors 2KX16
Text: Order this document by DSP56166/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56166 Advance Information 16-bit General Purpose Digital Signal Processor Ceramic Quad Flat Pack CQFP Available in a 112 pin, small footprint, surface mount package. The DSP56166 is the second member of Motorola’s DSP56100 family of HCMOS, low power, 16-bit general purpose Digital Signal
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DSP56166/D
DSP56166
16-bit
DSP56166
DSP56100
1200 uf 400 volt nippon
DSP96000
DSP56000
DSP56166ROM
DSP96002
marking ha02
Nippon capacitors
2KX16
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PDF
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HC SR01
Abstract: QN08 t101a FST 172 T102A DSP56000 DSP56100 DSP56156 DSP56156ROM DSP96002
Text: »«MOTOROLA •SEMICONDUCTOR DSP56156 TECHNICAL DATA Advance Information 16 -b it G e n e ra l P u rp o s e p_a a a A a _ _ 1 Digital Signal Processor CeramicQuadFlat Pack CQFP Available in a 112 pin, small footprint, sunac« mount package The DSP56156 is the first member of Motorola's DSP56100 family of HCMOS, low power, 16-bit general purpose Digital Signal Pro
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OCR Scan
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DSP56156
16-bit
0SP56156
DSP56100
DSP56156
HC SR01
QN08
t101a
FST 172
T102A
DSP56000
DSP56156ROM
DSP96002
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PDF
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Untitled
Abstract: No abstract text available
Text: M128S32 128K x 32 Fast SRAM Issue 2.1 December 2007 General Description Features The M128S32 is a high reliability 4Mbit fast static ram housed in high temperature co-fired ceramic. Access times are 20, 25 or 35ns, with 15 & 17ns in development. The high reliability 68 CQFP package
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M128S32
M128S32
128Kx32
256Kx16
512Kx8.
15/17ns
M128S32GAMB-xxx
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PDF
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WF4M32-XXX5
Abstract: No abstract text available
Text: WF4M32-XXX5 White Electronic Designs PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package
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WF4M32-XXX5
4Mx32
150ns
990CQFJ
64KBytes
4Mx32
2x4Mx16
WF4M32-XXX5
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PDF
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WF4M32-XXX5
Abstract: No abstract text available
Text: White Electronic Designs WF4M32-XXX5 PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package 502), 3.5mm (0.140") height.
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WF4M32-XXX5
4Mx32
150ns
990CQFJ
64KBytes
4Mx32
2x4Mx16
WF4M32-XXX5
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PDF
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smd A018
Abstract: top mark smd A12 CQFP top mark smd A9 smd A018 3 pin A13 smd Mark A12 SMD smd a7 transistor smd transistor a4 smd transistor A8
Text: WS512K32-XXX 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25, 35, 45, 55nS ■ Packaging • 66 pin, PGA Type, 1.385 inch square, Hermetic Ceramic HIP Package 402 , SMD Number 5962-94611 • 68 lead, 40mm Hermetic Low Capacitance CQFP, 5.1mm
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WS512K32-XXX
512Kx32
512Kx32,
1Mx16
09HMX
10HMX
05HNX
06HNX
07HNX
08HNX
smd A018
top mark smd A12
CQFP
top mark smd A9
smd A018 3 pin
A13 smd
Mark A12 SMD
smd a7 transistor
smd transistor a4
smd transistor A8
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O28 Package
Abstract: No abstract text available
Text: WS128K32-15XX 128Kx32 SRAM MODULE ADVANCED* FEATURES • Access Times of 15nS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP Package 400 • 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502), Package to be developed
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WS128K32-15XX
128Kx32
66-pin,
128Kx32;
256Kx16
512Kx8
WS128K32-XG2X
WS128K32-XHX
128Kx32
O28 Package
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PDF
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5962-94611
Abstract: footprint cqfp 68 94611 WS512K32-XXX 5962-9461109HTX 5962-9461109HMX CQFJ 5962-9461108HTX
Text: WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES n Access Times of 15*, 17, 20, 25, 35, 45, 55ns n 5 Volt Power Supply n Packaging n Low Power CMOS • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 . n Built-in Decoupling Caps and Multiple Ground Pins for Low
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WS512K32-XXX
512Kx32
WS512K32-XH1X
WS512K32-XG2TX1
08HMX
09HMX
10HMX
05H9X
06H9X
07H9X
5962-94611
footprint cqfp 68
94611
WS512K32-XXX
5962-9461109HTX
5962-9461109HMX
CQFJ
5962-9461108HTX
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FAH 37
Abstract: CQFJ FAH 37 datasheet WS512K32-XXX 512k 8 sram 3v power supply
Text: WS512K32-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES n Access Times of 15*, 17, 20, 25, 35, 45, 55ns n Commercial, Industrial and Military Temperature Ranges n Packaging n TTL Compatible Inputs and Outputs 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
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WS512K32-XXX
512Kx32
foo11
08HMX
09HMX
10HMX
05H9X
06H9X
07H9X
08H9X
FAH 37
CQFJ
FAH 37 datasheet
WS512K32-XXX
512k 8 sram 3v power supply
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PDF
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Teradyne J971 Digital Test system
Abstract: teradyne J971 CQFP68 J973 5341B teradyne a585 CI 7447 ATMEL ARINC PC603R CQFP132
Text: HIGH REL MICROPROCESSORS POWERPC PROCESSORS 68K PROCESSORS ARINC CONTROLLER A S S E M B LY & T E S T SERVICES Atmel your partner With over 25 years of experience and in close partnership with FreescaleTM Semiconductor, Atmel offers a wide range of microprocessor
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5341B-HIREL-01/05
Teradyne J971 Digital Test system
teradyne J971
CQFP68
J973
5341B
teradyne a585
CI 7447
ATMEL ARINC
PC603R
CQFP132
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PDF
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smd code F18
Abstract: act-s512k32n 5962-9461110HTC ACT-S512K32N-017P7Q 5962-9461110 CQFP 80 footprint cqfp 280
Text: ACT–S512K32 High Speed 16 Megabit SRAM Multichip Module Features • 4 Low Power CMOS 512K x 8 SRAMs in one MCM ■ Factory configured as 512K x 32; User configurable as 1M x 16 or 2M x 8 ■ Input and Output TTL & CMOS Compatible Design ■ Fast 17,20,25,35,45,55ns Access Times
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S512K32
MIL-PRF-38534
MIL-STD-883
SCD1660
smd code F18
act-s512k32n
5962-9461110HTC
ACT-S512K32N-017P7Q
5962-9461110
CQFP 80
footprint cqfp 280
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PDF
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Untitled
Abstract: No abstract text available
Text: WS512K32-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 15*, 17, 20, 25, 35, 45, 55ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging ■ TTL Compatible Inputs and Outputs • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
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WS512K32-XXX
512Kx32
08HYX
09HYX
10HYX
05HMX
06HMX
07HMX
08HMX
09HMX
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PDF
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Untitled
Abstract: No abstract text available
Text: WS512K32-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 15*, 17, 20, 25, 35, 45, 55ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging ■ TTL Compatible Inputs and Outputs • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
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WS512K32-XXX
512Kx32
08HYX
09HYX
10HYX
05HMX
06HMX
07HMX
08HMX
09HMX
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PDF
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S128K32
Abstract: ACT-S128K32 ACT-S128K32V 5962-9559509HMX 5962-9318710H4X
Text: ACT-S128K32 High Speed 4 Megabit SRAM Multichip Module Features • 4 Low Power CMOS 128K x 8 SRAMs in one MCM ■ Overall configuration as 128K x 32 ■ Input and Output TTL Compatible ■ 17, 20, 25, 35, 45 & 55ns Access Times, 15ns Available by Special Order
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ACT-S128K32
MIL-STD-883
ACT-S128K32
SCD1659
S128K32
ACT-S128K32V
5962-9559509HMX
5962-9318710H4X
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PDF
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Untitled
Abstract: No abstract text available
Text: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square
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WF2M32-XXX5
2Mx32
150ns
64KBytes
WF2M32U-XG2UX
64KByte
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PDF
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Untitled
Abstract: No abstract text available
Text: WS512K32-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 15*, 17, 20, 25, 35, 45, 55ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging ■ TTL Compatible Inputs and Outputs • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
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WS512K32-XXX
512Kx32
512Kx32,
1Mx16
05HTX
06HTX
07HTX
08HTX
09HTX
10HTX
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PDF
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