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    FOOTPRINT DIP Search Results

    FOOTPRINT DIP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MM54HCT192J Rochester Electronics LLC 54HCT192 - SYNCHRONOUS DECADE UP/DOWN COUNTER, CERAMIC, DIP-16 Visit Rochester Electronics LLC Buy
    G17DC15023313HR Amphenol Communications Solutions Dsub Slim R/A Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15u\\ Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free Visit Amphenol Communications Solutions
    G17DD1504231GHR Amphenol Communications Solutions Dsub Slim RighAngle Dip, High Density 15 Position Receptacle VGA, Sunk 3.8mm, 10u\\ Au, Footprint 1.2mm, 2 Rows, Pitch 1.5mm, Post distance 3.2mm, PCB hole distance 2.4mm, Tail 3.0mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free Visit Amphenol Communications Solutions
    G17DD1504231RHR Amphenol Communications Solutions Dsub Slim RighAngle Dip, High Density 15 Position Receptacle VGA, Sunk 3.8mm, 10u\\ Au, Footprint 1.2mm, 2 Rows, Pitch 1.5mm, Post distance 3.2mm, PCB hole distance 2.4mm, Tail 2.65mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free Visit Amphenol Communications Solutions
    G17DD1504231SHR Amphenol Communications Solutions Dsub Slim RighAngle Dip, High Density 15 Position Receptacle VGA, Sunk 3.8mm, 10u\\ Au, Footprint 1.2mm, 2 Rows, Pitch 1.5mm, Post distance 3.2mm, PCB hole distance 2.4mm, Tail 2.0mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free Visit Amphenol Communications Solutions

    FOOTPRINT DIP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    footprint dip 16

    Abstract: footprint plcc 32 40 pin zif connector 40 pin zif socket zif 40 pin socket 14 pin plcc socket IC51-0444-400 PDZ 44 plcc socket 44 PLCC socket Yamaichi
    Text: PA44-40-01-PD Z Data Sheet 44 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters connect a PLCC package to a 40 pin DIP footprint. They allow programming of some 44 PLCC devices in their 40 DIP footprint.


    Original     		PA44-40-01-PD socket/40 Z86C21/ E61dapter PA44-40-01-PD PA44-40-01-PDZ 444001PD footprint dip 16 footprint plcc 32 40 pin zif connector 40 pin zif socket zif 40 pin socket 14 pin plcc socket IC51-0444-400 PDZ 44 plcc socket 44 PLCC socket Yamaichi PDF

    Untitled

    Abstract: No abstract text available
    Text: T ARCONN C O N N E C T O R S Compact High Densi D-Subm iniature .200" Footprint Features ▲ Compact .200" PCB Footprint ▲ Right Angle DIP Solder Terminations A Metal Shells and Boardlocks A Popular Sizes for Computer Applications Specifications M aterials


    OCR Scan     		DHR-15CS PDF

    footprint dip 16

    Abstract: footprint plcc 32 40 pin zif connector PLCC-44 footprint 40 pin zif socket footprint dip PDZ 44 zif 40 pin socket 44 pin plcc socket 4033
    Text: PA44-40-33-PD Z Data Sheet 44 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters connect a PLCC package to a 40 pin DIP footprint. They allow programming of some 44 PLCC devices in their 40 DIP footprint.


    Original     		PA44-40-33-PD socket/40 Z86E30/ PA44-40-33-PD PA44-40-33-PDZ 444033PD footprint dip 16 footprint plcc 32 40 pin zif connector PLCC-44 footprint 40 pin zif socket footprint dip PDZ 44 zif 40 pin socket 44 pin plcc socket 4033 PDF

    Untitled

    Abstract: No abstract text available
    Text: PA51-QD -03, -14C or -16 Data Sheet 44 pin PQFP or TQFP socket/40 pin DIP 0.6” plug Supported Device/Footprints These adapters allows programming of many QFP devices in their DIP footprint. The following is a partial list. The following devices are supported using the indicated footprint.


    Original     		PA51-QD socket/40 8751H, 87C51, 87C52, 87C51-FA, 87C51FB, 87C51-FC, 87C528, 87C652, PDF

    Untitled

    Abstract: No abstract text available
    Text: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000


    Original     		PGA207PA LH0084CD C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. PDF

    ASTM 240

    Abstract: ASTM-B16-85 LH0084CD PGA207PA NATIONAL SEMI 16 pin dip
    Text: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is black FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000


    Original     		PGA207PA LH0084CD C36000 ASTM-B16-85. MIL-P-81728 QQ-N290. ASTM 240 ASTM-B16-85 NATIONAL SEMI 16 pin dip PDF

    Untitled

    Abstract: No abstract text available
    Text: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000


    Original     		PGA207PA LH0084CD C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. PDF

    Untitled

    Abstract: No abstract text available
    Text: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is black FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000


    Original     		PGA207PA LH0084CD C36000 ASTM-B16-85. MIL-P-81728 QQ-N290. PDF

    TEMAC

    Abstract: verilog code for mdio protocol application TEMAC XAPP807 ML403 binary to lcd verilog code virtex-4 fx12 ppc405 ug071 JTGC405TCK
    Text: Application Note: Virtex-4 FX Family R XAPP807 v1.3 January 17, 2007 Summary Minimal Footprint Tri-Mode Ethernet MAC Processing Engine Author: Jue Sun, Harn Hua Ng, and Peter Ryser The Tri-Mode Ethernet MAC (TEMAC) UltraController-II module is a minimal footprint,


    Original     		XAPP807 PPC405) xapp807 XAPP719. TEMAC verilog code for mdio protocol application TEMAC ML403 binary to lcd verilog code virtex-4 fx12 ppc405 ug071 JTGC405TCK PDF

    CRM1076DJ

    Abstract: CRM-1076DJ-G crm1076 SUMITOMO g600f LQFP-100 footprint ABLEBONd 84-1 Holt 3717p 100LQFP CRM*1076
    Text: 44-Lead Quad Flat Pack QFP Footprint & Package Change Product Change Notice PCN1102 (v1.0) December 01, 2011 Overview This notice describes the footprint and package changes to the 44 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC family of devices.


    Original     		44-Lead PCN1102 QR-1003 100-Lead QR-1131 CRM1076DJ CRM-1076DJ-G crm1076 SUMITOMO g600f LQFP-100 footprint ABLEBONd 84-1 Holt 3717p 100LQFP CRM*1076 PDF

    OZ 9966

    Abstract: ci573 C4493 c5588 JS-05(N)K 16 soic pcb footprint MIL-T-10727 soic footprint 8 soic pcb footprint IT43
    Text: 300 RRIES Electronics Europe Tel: + 4 4 1 9 0 8 2 6 0 0 0 7 Unit 3, Furtho Court Towcesler Road, Old Stratford Milton Keynes MK19 6AQ F a x : + 441908 2 6 0 0 0 8 SOIC to DIP Adapters Converts SOIC footprint to DIL footprint ^ 8 to 28 pins 'S 8 to 24 pin version is Universal,


    OCR Scan     		XX-350000-10 00r2S OZ 9966 ci573 C4493 c5588 JS-05(N)K 16 soic pcb footprint MIL-T-10727 soic footprint 8 soic pcb footprint IT43 PDF

    Virtex-4

    Abstract: virtex-4 fx12 DS-KIT-FX12MM1 networking SOCKET CONNECTION DIAGRAM xilinx vhdl rs232 code virtex memec lcd module verilog DS-KIT-FX12MM1-BASE LCD module in VHDL xilinx USB cable
    Text:  Virtex-4 FX12 Mini-Module The Memec Virtex-4 FX12 Mini-Module Development Kit provides a low cost, small footprint, fully integrated “system-on-a-module” ideal for high performance embedded applications. Features Mini-Module Small Footprint 30 mm x 65.5 mm


    Original     		RS232 ThIT-FX12MM1-EDK DS-KIT-FX12MM1-EDK-EURO DS-KIT-FX12MM1-BASE DS-KIT-FX12MM1-BASE-EURO DS-KIT-FX12MM1 DS-KIT-FX12MM1-EURO MG028-05) Virtex-4 virtex-4 fx12 DS-KIT-FX12MM1 networking SOCKET CONNECTION DIAGRAM xilinx vhdl rs232 code virtex memec lcd module verilog DS-KIT-FX12MM1-BASE LCD module in VHDL xilinx USB cable PDF

    Untitled

    Abstract: No abstract text available
    Text: LUXEON 4014 Compact footprint delivering high-efficacy and just the right amount of light Introduction The LUXEON 4014 low-power package is the first of its kind from Philips Lumileds. Initial offering in 4000K/80 CRI in a compact 4.0x1.4x0.7mm footprint, it delivers quality of light needed


    Original     		4000K/80 DS205 PDF

    resistor metal GLAZE 120 ohm 2 1W IRC

    Abstract: IRC MAR MRC 058 datasheet 1R00 51R0 R250 EFB810-3/4-3/mrc 736
    Text:  HIGH POWER DENSITY METAL GLAZE SURFACE MOUNT POWER RESISTOR ISO-9001 Registered MRC SERIES Metal GlazeTM thick film element fired at 1000°C to solid ceramic substrate 1/2 watt in 1/8 watt package 1206 footprint 1 watt in 1/2 watt package (2010 footprint)


    Original     		ISO-9001 EIA-481: resistor metal GLAZE 120 ohm 2 1W IRC IRC MAR MRC 058 datasheet 1R00 51R0 R250 EFB810-3/4-3/mrc 736 PDF

    18013

    Abstract: No abstract text available
    Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to


    Original     		C36000, B16/B16M B579-73 SAE-AMS-QQ-N-290 18013 PDF

    1109814

    Abstract: No abstract text available
    Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to


    Original     		C36000, B16/B16M B579-73 SAE-AMS-QQ-N-290 1109814 PDF

    Untitled

    Abstract: No abstract text available
    Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.


    Original     		C36000 ASTM-B16-85. MIL-T10727 MIL-P-81728 QQ-N-290. PDF

    1109814

    Abstract: No abstract text available
    Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.


    Original     		C36000 ASTM-B16-85. MIL-T10727 MIL-P-81728 QQ-N-290. 1109814 PDF

    Untitled

    Abstract: No abstract text available
    Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.


    Original     		C36000 ASTM-B16-00. SAE-AMS-QQ-N-290. PDF

    18012

    Abstract: No abstract text available
    Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.


    Original     		C36000 ASTM-B16-85. MIL-T10727 MIL-P-81728 QQ-N-290. 18012 PDF

    1109814

    Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
    Text: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.


    Original     		C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. 1109814 8 soic pcb footprint 18012 ASTM-B16-85 PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 1109814/1109902 SOIC TO to Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.


    Original     		C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. 003roducts PDF

    Untitled

    Abstract: No abstract text available
    Text: Model 533 Miniature TCXO CTS Reeves FREQUENCY PR O D U C TS Features: • • • • Frequency Range 5 to 30 MHz Stabilities as low as ±1.0 ppm Small Footprint - Only 1.02" x .62 Mechanical Frequency Adjust The CTS Reeves Model 533 is a high stability TCXO with a 14 pin DIL compatible footprint.


    OCR Scan     		Aging2000 PDF

    IPC 4101A

    Abstract: IS410 4101A
    Text: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to


    Original     		IS410 101A/26 C36000, B16/B16M MIL-G-45204 AMS-QQ-N-290 1109814-RC 18013RC IPC 4101A 4101A PDF