Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA48 package SOT1063-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
VFBGA48
OT1063-1
OT1063-1
|
PDF
|
VFBGA144
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA144 package SOT1078-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
VFBGA144
OT1078-1
OT1078-1
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA100 package SOT1087-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
VFBGA100
OT1087-1
OT1087-1
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VFBGA56 package SOT702-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
VFBGA56
OT702-1
OT702-1
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA81 package SOT1071-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
VFBGA81
OT1071-1
OT1071-1
|
PDF
|
CSR BC212
Abstract: MDR741F CSR BLUECORE VIRTUAL MACHINE CSR BlueCore 4 Application Program Interface BlueCore 3 csr bluetooth csr BC02 BlueCore 2 External casira casira csr crystal trim kit BC212015ADN-E4
Text: Product Data Sheet Device Features BlueCore 2-External Low power 1.8V operation TM Small footprint in 96-Ball VFBGA Package 6x6mm Single Chip Bluetooth System Fully qualified Bluetooth component Full speed class 2 Bluetooth operation with full 7 slave piconet support
|
Original
|
96-Ball
-40T105
BC212015-ds-001b
CSR BC212
MDR741F
CSR BLUECORE VIRTUAL MACHINE
CSR BlueCore 4 Application Program Interface
BlueCore 3 csr
bluetooth csr BC02
BlueCore 2 External
casira
casira csr crystal trim kit
BC212015ADN-E4
|
PDF
|
Untitled
Abstract: No abstract text available
Text: CYWB0124AB West Bridge : Antioch™ USB/Mass Storage Peripheral Controller 1.0 Features • • • • DMA slave support Ultra low power, 1.8V core operation Low power modes Small footprint, 6x6mm VFBGA and less than 4x4mm WLCSP • Selectable clock input frequencies
|
Original
|
CYWB0124AB
CYWB0124AB-FDXI
CYWB0124ABX-FDXI
|
PDF
|
CRC-16
Abstract: USB3290 USB3290-FH
Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES Datasheet Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification
|
Original
|
USB3290
60MHz,
480Mbps
12Mbps
24MHz
150mA
VDD33
VDDA18
CRC-16
USB3290
USB3290-FH
|
PDF
|
CSR BLUECORE VIRTUAL MACHINE
Abstract: CSR BC212 BC212015BD CSR BLUECORE at command CSR BLUECORE 6 BCCMD Protocol MDR741F BlueCore BCCMD Commands BlueCore 3 csr CSR USB SPI converter csr BC212015
Text: _äìÉ`çêÉ OJbñíÉêå~ä= qj Device Features Single Chip Bluetooth System Low power 1.8V operation Small footprint in 96-ball VFBGA and LGA packages 6x6mm 8x8mm and 10x10mm Fully qualified Bluetooth component 0.18µm CMOS technology
|
Original
|
96-ball
10x10mm)
BC212013
BC212015
10x10
BC212015-ds-001f
CSR BLUECORE VIRTUAL MACHINE
CSR BC212
BC212015BD
CSR BLUECORE at command
CSR BLUECORE 6 BCCMD Protocol
MDR741F
BlueCore BCCMD Commands
BlueCore 3 csr
CSR USB SPI converter
csr BC212015
|
PDF
|
CRC-16
Abstract: USB3290 USB3290-FH
Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES Datasheet Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification
|
Original
|
USB3290
60MHz,
480Mbps
12Mbps
24MHz
150mA
CRC-16
USB3290
USB3290-FH
|
PDF
|
BlueCore 3 csr
Abstract: btm 110 bluetooth csr BlueCore 4 RFCOMM Stack CSR BLUECORE spp CSR BlueCore 4 API CSR BLUECORE SPI CSR BLUECORE spp protocol BLUECORE serial BlueCore 4 csr BC215
Text: Product Data Sheet Device Features Low power 1.8V operation 0.18µm CMOS technology Small footprint in 6 x 6 mm package BlueCore 2-ROM TM Single Chip Bluetooth System Advance Information Data Sheet Fully qualified Bluetooth component April 2002 Scatternet support
|
Original
|
CT105
BC213015A-ds-001c
BlueCore 3 csr
btm 110 bluetooth
csr BlueCore 4 RFCOMM Stack
CSR BLUECORE spp
CSR BlueCore 4 API
CSR BLUECORE SPI
CSR BLUECORE spp protocol
BLUECORE serial
BlueCore 4 csr
BC215
|
PDF
|
Untitled
Abstract: No abstract text available
Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES Data Brief Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification
|
Original
|
USB3290
60MHz,
480Mbps
12Mbps
24MHz
150mA
USB3290
USB3290-FH
|
PDF
|
nrzi
Abstract: USB3290 USB3290-FH nrzi encoding in usb footprint vfbga
Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES Data Brief Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification
|
Original
|
USB3290
60MHz,
480Mbps
12Mbps
24MHz
150mA
USB3290
USB3290-FH
nrzi
nrzi encoding in usb
footprint vfbga
|
PDF
|
BlueCore 3 csr
Abstract: BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application
Text: Product Data Sheet Device Features BlueCore 01b TM Compliant to Bluetooth specification V1.1 TM Small footprint in 8mm x 8mm 81-ball BGA Single Chip Bluetooth Device Product Data Sheet For: USB V1.1 compliant BC01b-URT UART only version (BGA Packaging) Qualified Bluetooth firmware included
|
Original
|
81-ball
BC01b-URT
BC01bv-URT
BlueCore01b
bco1b-ds-003d
bc01b-ds-003a
bc01b-ds-003b
bc01b-ds-003c
bc01b-ds-003d
bc01bv
BlueCore 3 csr
BSC COMPUTER SCIENCE digital logic design Notes
CSR BLUECORE SPI
CSR BLUECORE application note
BlueCore 4
BlueCore 5
BlueCore 01b
CSR BLUECORE SPI APPLICATION
BC01B-USB-TR
CSR BLUECORE application
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: ARM-based Embedded MPU SAM9G25 DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for
|
Original
|
SAM9G25
ARM926EJ-Sâ
SAM9G25
12-bit
|
PDF
|
Untitled
Abstract: No abstract text available
Text: AT91SAM ARM-based Embbedded MPU SAM9G25 DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for
|
Original
|
AT91SAM
SAM9G25
ARM926EJ-Sâ
SAM9G25
12-bit
|
PDF
|
Untitled
Abstract: No abstract text available
Text: AT91SAM ARM-based Embedded MPU SAM9G25 SUMMARY DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for
|
Original
|
AT91SAM
SAM9G25
ARM926EJ-Sâ
SAM9G25
12-bit
|
PDF
|
vFBGA* 96 bALL
Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are
|
Original
|
|
PDF
|
LV 1084 73
Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
Text: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA
|
Original
|
SZZA028A
20-Ball,
65-mm
20-ball
LV 1084 73
LV 373A
BGA PACKAGE thermal profile
LV 1084
land pattern for tvSOP
90 ball VFBGA
micro pitch BGA
VA244
VFBGA
LVTH2245
|
PDF
|
48 ball VFBGA
Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
Text: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated
|
Original
|
SZZA029B
16-Bit
56-Ball,
65-mm
56-ball
MO-225,
48-pin
56-pin
48 ball VFBGA
90 ball VFBGA
LVTH162
micro pitch BGA
tSSOP 56 socket
TSSOP YAMAICHI SOCKET
ALVCH16373
LVCH16244A
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Competitive Package Cross-Reference: NXP Logic Products Package Image width x length x height mm Pitch (mm) NXP 0.5 GX 0.3 GN TI Fairchild ON Toshiba CMX fsV MicroPak 0.8 x 0.8 x 0.35 MicroPak 1.0 x 0.9 x 0.35 MicroPak GF FHX 0.35 1.0 x 1.0 x 0.5 GF 1.0 x 1.0 x 0.35 GS
|
Original
|
OT902
OT833
OT891
OT1089
OT1202/3
OT1115/6
OT1226
OT353
OT363
OT753
|
PDF
|
S71VS
Abstract: S71VS128RC0AHK4L S71VS128RB0 SWM064D108M1R swm032d108m1r pSRAM_39 SWM128D108M1R Chamfer Designation s71vs064rb0 S29VS064R
Text: S71VS/XS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-Only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 256/128/64 Mb 16/8/4 Mb x 16-bit Flash, 128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM S71VS/XS-R Memory Subsystem Solutions Cover Sheet
|
Original
|
S71VS/XS-R
16-bit)
S71VS
S71VS128RC0AHK4L
S71VS128RB0
SWM064D108M1R
swm032d108m1r
pSRAM_39
SWM128D108M1R
Chamfer Designation
s71vs064rb0
S29VS064R
|
PDF
|
NXP PN544 user manual
Abstract: PN544 user manual NXP PN544 PN544 PN544 NFC controller data sheet nfc PN544 NXP PN544 Antenna Design Guide PN544 NFC controller nxp pn544 antenna design PN544 hardware design guide
Text: Application guide Portable devices and mobile handsets Introduction Your partner for portable devices and mobile handsets NXP Semiconductors is a recognized leader in portable and mobile applications. We offer a comprehensive portfolio of best-in-class solutions
|
Original
|
|
PDF
|
S71VS256RD0AHK3M
Abstract: No abstract text available
Text: S71VS/XS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-Only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 256/128/64 Mb 16/8/4 Mb x 16-bit Flash, 128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM S71VS/XS-R Memory Subsystem Solutions Cover Sheet
|
Original
|
S71VS/XS-R
16-bit)
S71VS256RD0AHK3M
|
PDF
|