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    FOOTPRINT VFBGA Search Results

    FOOTPRINT VFBGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    U91D101100130 Amphenol Communications Solutions CXP, High Speed Input Output Connector, ENHANCED FOOTPRINT Visit Amphenol Communications Solutions
    U91D1L1100130 Amphenol Communications Solutions CXP, High Speed Input Output Connector, ENHANCED FOOTPRINT Visit Amphenol Communications Solutions
    U91D1A01D0A31 Amphenol Communications Solutions CXP, High Speed Input Output Connector, ENHANCED FOOTPRINT Visit Amphenol Communications Solutions
    U91D111100131 Amphenol Communications Solutions CXP, High Speed Input Output Connector, ENHANCED FOOTPRINT Visit Amphenol Communications Solutions
    U91D121100A31 Amphenol Communications Solutions CXP, High Speed Input Output Connector, ENHANCED FOOTPRINT Visit Amphenol Communications Solutions

    FOOTPRINT VFBGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA48 package SOT1063-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    VFBGA48 OT1063-1 OT1063-1 PDF

    VFBGA144

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA144 package SOT1078-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    VFBGA144 OT1078-1 OT1078-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA100 package SOT1087-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    VFBGA100 OT1087-1 OT1087-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VFBGA56 package SOT702-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    VFBGA56 OT702-1 OT702-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA81 package SOT1071-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    VFBGA81 OT1071-1 OT1071-1 PDF

    CSR BC212

    Abstract: MDR741F CSR BLUECORE VIRTUAL MACHINE CSR BlueCore 4 Application Program Interface BlueCore 3 csr bluetooth csr BC02 BlueCore 2 External casira casira csr crystal trim kit BC212015ADN-E4
    Text: Product Data Sheet Device Features BlueCore 2-External Low power 1.8V operation TM Small footprint in 96-Ball VFBGA Package 6x6mm Single Chip Bluetooth System Fully qualified Bluetooth component Full speed class 2 Bluetooth operation with full 7 slave piconet support


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    96-Ball -40T105 BC212015-ds-001b CSR BC212 MDR741F CSR BLUECORE VIRTUAL MACHINE CSR BlueCore 4 Application Program Interface BlueCore 3 csr bluetooth csr BC02 BlueCore 2 External casira casira csr crystal trim kit BC212015ADN-E4 PDF

    Untitled

    Abstract: No abstract text available
    Text: CYWB0124AB West Bridge : Antioch™ USB/Mass Storage Peripheral Controller 1.0 Features • • • • DMA slave support Ultra low power, 1.8V core operation Low power modes Small footprint, 6x6mm VFBGA and less than 4x4mm WLCSP • Selectable clock input frequencies


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    CYWB0124AB CYWB0124AB-FDXI CYWB0124ABX-FDXI PDF

    CRC-16

    Abstract: USB3290 USB3290-FH
    Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ Datasheet Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification


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    USB3290 60MHz, 480Mbps 12Mbps 24MHz 150mA VDD33 VDDA18 CRC-16 USB3290 USB3290-FH PDF

    CSR BLUECORE VIRTUAL MACHINE

    Abstract: CSR BC212 BC212015BD CSR BLUECORE at command CSR BLUECORE 6 BCCMD Protocol MDR741F BlueCore BCCMD Commands BlueCore 3 csr CSR USB SPI converter csr BC212015
    Text: _äìÉ`çêÉ OJbñíÉêå~ä= qj Device Features Single Chip Bluetooth System „ Low power 1.8V operation „ Small footprint in 96-ball VFBGA and LGA packages 6x6mm 8x8mm and 10x10mm „ Fully qualified Bluetooth component „ 0.18µm CMOS technology „


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    96-ball 10x10mm) BC212013 BC212015 10x10 BC212015-ds-001f CSR BLUECORE VIRTUAL MACHINE CSR BC212 BC212015BD CSR BLUECORE at command CSR BLUECORE 6 BCCMD Protocol MDR741F BlueCore BCCMD Commands BlueCore 3 csr CSR USB SPI converter csr BC212015 PDF

    CRC-16

    Abstract: USB3290 USB3290-FH
    Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ Datasheet Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification


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    USB3290 60MHz, 480Mbps 12Mbps 24MHz 150mA CRC-16 USB3290 USB3290-FH PDF

    BlueCore 3 csr

    Abstract: btm 110 bluetooth csr BlueCore 4 RFCOMM Stack CSR BLUECORE spp CSR BlueCore 4 API CSR BLUECORE SPI CSR BLUECORE spp protocol BLUECORE serial BlueCore 4 csr BC215
    Text: Product Data Sheet Device Features Low power 1.8V operation 0.18µm CMOS technology Small footprint in 6 x 6 mm package BlueCore 2-ROM TM Single Chip Bluetooth System Advance Information Data Sheet Fully qualified Bluetooth component April 2002 Scatternet support


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    CT105 BC213015A-ds-001c BlueCore 3 csr btm 110 bluetooth csr BlueCore 4 RFCOMM Stack CSR BLUECORE spp CSR BlueCore 4 API CSR BLUECORE SPI CSR BLUECORE spp protocol BLUECORE serial BlueCore 4 csr BC215 PDF

    Untitled

    Abstract: No abstract text available
    Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ Data Brief Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification


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    USB3290 60MHz, 480Mbps 12Mbps 24MHz 150mA USB3290 USB3290-FH PDF

    nrzi

    Abstract: USB3290 USB3290-FH nrzi encoding in usb footprint vfbga
    Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ Data Brief Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification


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    USB3290 60MHz, 480Mbps 12Mbps 24MHz 150mA USB3290 USB3290-FH nrzi nrzi encoding in usb footprint vfbga PDF

    BlueCore 3 csr

    Abstract: BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application
    Text: Product Data Sheet Device Features BlueCore 01b TM Compliant to Bluetooth specification V1.1 TM Small footprint in 8mm x 8mm 81-ball BGA Single Chip Bluetooth Device Product Data Sheet For: USB V1.1 compliant BC01b-URT UART only version (BGA Packaging) Qualified Bluetooth firmware included


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    81-ball BC01b-URT BC01bv-URT BlueCore01b bco1b-ds-003d bc01b-ds-003a bc01b-ds-003b bc01b-ds-003c bc01b-ds-003d bc01bv BlueCore 3 csr BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application PDF

    Untitled

    Abstract: No abstract text available
    Text: ARM-based Embedded MPU SAM9G25 DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for


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    SAM9G25 ARM926EJ-Sâ SAM9G25 12-bit PDF

    Untitled

    Abstract: No abstract text available
    Text: AT91SAM ARM-based Embbedded MPU SAM9G25 DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for


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    AT91SAM SAM9G25 ARM926EJ-Sâ SAM9G25 12-bit PDF

    Untitled

    Abstract: No abstract text available
    Text: AT91SAM ARM-based Embedded MPU SAM9G25 SUMMARY DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for


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    AT91SAM SAM9G25 ARM926EJ-Sâ SAM9G25 12-bit PDF

    vFBGA* 96 bALL

    Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
    Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are


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    PDF

    LV 1084 73

    Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
    Text: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA


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    SZZA028A 20-Ball, 65-mm 20-ball LV 1084 73 LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245 PDF

    48 ball VFBGA

    Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
    Text: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated


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    SZZA029B 16-Bit 56-Ball, 65-mm 56-ball MO-225, 48-pin 56-pin 48 ball VFBGA 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET ALVCH16373 LVCH16244A PDF

    Untitled

    Abstract: No abstract text available
    Text: Competitive Package Cross-Reference: NXP Logic Products Package Image width x length x height mm Pitch (mm) NXP 0.5 GX 0.3 GN TI Fairchild ON Toshiba CMX fsV MicroPak 0.8 x 0.8 x 0.35 MicroPak 1.0 x 0.9 x 0.35 MicroPak GF FHX 0.35 1.0 x 1.0 x 0.5 GF 1.0 x 1.0 x 0.35 GS


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    OT902 OT833 OT891 OT1089 OT1202/3 OT1115/6 OT1226 OT353 OT363 OT753 PDF

    S71VS

    Abstract: S71VS128RC0AHK4L S71VS128RB0 SWM064D108M1R swm032d108m1r pSRAM_39 SWM128D108M1R Chamfer Designation s71vs064rb0 S29VS064R
    Text: S71VS/XS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-Only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 256/128/64 Mb 16/8/4 Mb x 16-bit Flash, 128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM S71VS/XS-R Memory Subsystem Solutions Cover Sheet


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    S71VS/XS-R 16-bit) S71VS S71VS128RC0AHK4L S71VS128RB0 SWM064D108M1R swm032d108m1r pSRAM_39 SWM128D108M1R Chamfer Designation s71vs064rb0 S29VS064R PDF

    NXP PN544 user manual

    Abstract: PN544 user manual NXP PN544 PN544 PN544 NFC controller data sheet nfc PN544 NXP PN544 Antenna Design Guide PN544 NFC controller nxp pn544 antenna design PN544 hardware design guide
    Text: Application guide Portable devices and mobile handsets Introduction Your partner for portable devices and mobile handsets NXP Semiconductors is a recognized leader in portable and mobile applications. We offer a comprehensive portfolio of best-in-class solutions


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    PDF

    S71VS256RD0AHK3M

    Abstract: No abstract text available
    Text: S71VS/XS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-Only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 256/128/64 Mb 16/8/4 Mb x 16-bit Flash, 128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM S71VS/XS-R Memory Subsystem Solutions Cover Sheet


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    S71VS/XS-R 16-bit) S71VS256RD0AHK3M PDF