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    FR4 1.6MM THICKNESS Search Results

    FR4 1.6MM THICKNESS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10135739-004LF Amphenol Communications Solutions OCTIS™ - SPLIT RUBBER GLAND 6MM Visit Amphenol Communications Solutions
    923-2M1C-70H Amphenol Communications Solutions XCede HD, Backplane Connectors, Vertical Header, 2-pair, 6-column, Right End Wall, Thick Sidewall. Visit Amphenol Communications Solutions
    923-211G-70H Amphenol Communications Solutions XCede HD, Backplane Connectors, Vertical Header, 2-pair, 10-column, Double End Wall, Thick Sidewall. Visit Amphenol Communications Solutions
    923-311J-70H Amphenol Communications Solutions XCede HD, Backplane Connectors, Vertical Header, 3-pair, 4-column, Double End Wall, Thick Sidewall. Visit Amphenol Communications Solutions
    923-3Y1C-70H Amphenol Communications Solutions XCede HD, Backplane Connectors, Vertical Header, 3-pair, 6-column, Right Polarized Guide, Thick Sidewall. Visit Amphenol Communications Solutions

    FR4 1.6MM THICKNESS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SF-BGA144F-B-11

    Abstract: SN63 PB37 SN63 FR4 substrate 1.6mm FR4 1.6mm substrate
    Text: Patent # 6,351,392 12mm [0.472"] 12mm [0.472"] 0.8mm typ. [0.031"] Top View 0.8mm typ. [0.031"] 0.3mm [0.012"] 2 6.78mm [0.267"] 1.6mm [0.063"] 1 Side View 3 0.8mm typ. [0.031"] 0.33mm [0.013"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2


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    PDF FR4/G10 13x13x4 SF-BGA144F-B-11 SN63 PB37 SN63 FR4 substrate 1.6mm FR4 1.6mm substrate

    SF-BGA64F-B-11

    Abstract: FR4 1.6mm substrate FR4 substrate 1.6mm SN63
    Text: 8mm [0.315"] 1.2mm [0.047"] 0.8mm typ. 1.2mm [0.047"] 8mm [0.315"] Top View 0.3mm dia. [0.012"] 0.8mm typ. 2 1.6mm [0.063"] 6.78mm [0.267"] 1 Side View 3 0.8mm typ. 0.33mm [0.013"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2


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    PDF FR4/G10 SF-BGA64F-B-11 2004IRONWOOD FR4 1.6mm substrate FR4 substrate 1.6mm SN63

    FR4 1.6mm substrate

    Abstract: Thermagon t-lam CLD-AP25 Fabrication process steps mcpcb FR-4 substrate 1.6mm NEMA FR-4 led mcpcb large copper trace thermal Thermagon pcb fabrication process kapton
    Text: Optimizing PCB Thermal Performance for Cree XLamp® LEDs Table of Contents 1. Introduction. 2 2. Thermal Management Principles. 2


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    PDF CLD-AP37 FR4 1.6mm substrate Thermagon t-lam CLD-AP25 Fabrication process steps mcpcb FR-4 substrate 1.6mm NEMA FR-4 led mcpcb large copper trace thermal Thermagon pcb fabrication process kapton

    FR4 thickness 1.6mm

    Abstract: 7101 11351 te 7101 SG-BGA-7101
    Text: GHz CSP Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


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    PDF 725mm 025mm SG-BGA-7101 11351Rupp 125mm. FR4 thickness 1.6mm 7101 11351 te 7101

    TBA310

    Abstract: CG-BGA-5000 FR4 thickness 1.6mm
    Text: Top View Features Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required 30.23mm [1.190"] Compression plate distributes forces evenly Clamshell lid Materials: A 13 25.48mm [1.003"] Side View (Section AA) 4 1 Clam Shell Lid: Black anodized Aluminum.


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    PDF CG-BGA-5000 CG-BGA-5000 125mm. TBA310 FR4 thickness 1.6mm

    Untitled

    Abstract: No abstract text available
    Text: Ordering information AC-DC Power Supplies DIN Rail type KHEA series KHE 1 A 2 240 3 F 4 Recommended EMI/EMC Filter KHEA120F NAC-04-472 KHEA240F NAC-06-472 -24 5 -O 6 1Series name 2Single output 3Output wattage 4Universal input 5Output voltage 6Option C : with Coating


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    PDF KHEA120F NAC-04-472 KHEA240F NAC-06-472 KHEA120F-24 KHEA240F-24 KHEA480F-24

    Jack cat5e

    Abstract: modular plug amp RJ45 cat5e keystone jack PBT 20 GF PBT20 AMP modular plug RJ45 PBT-20GF
    Text: 2 3 5 4 6 7 A 14.50MM 14.50MM A 16.20MM 1 35.4MM B B 16.20MM 19.20MM C 21.20MM 8.13MM 3.80MM 7.1MM Material: • Housing: PC UL94V-0 • Insert Material: PBT+20%GF UL94V-0 • PCB Material: FR-4 Thickness 1.6MM • Contact Material: Phosphor Bronze Stamp Pin T=0.50MM


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    PDF UL94V-0 -TA3534-R rev00 Jack cat5e modular plug amp RJ45 cat5e keystone jack PBT 20 GF PBT20 AMP modular plug RJ45 PBT-20GF

    PBT 20 GF

    Abstract: AMP modular plug RJ45 RJ45 JACK PCB CAT6
    Text: 2 3 5 4 6 7 A 14.50MM 14.50MM A 16.20MM 1 35.4MM B B 16.20MM 19.20MM C 21.20MM 8.13MM 3.80MM 7.1MM Material: • Housing: PC UL94V-0 • Insert Material: PBT+20%GF UL94V-0 • PCB Material: FR-4 Thickness 1.6MM • Contact Material: Phosphor Bronze Stamp Pin T=0.50MM


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    PDF UL94V-0 -TA3535-R rev00 PBT 20 GF AMP modular plug RJ45 RJ45 JACK PCB CAT6

    AMP modular plug RJ45

    Abstract: FR4 thickness 1.6mm PBT 20 GF modular plug amp RJ45 PBT-20GF Jack cat5e cat5e keystone jack Assmann
    Text: 14.50MM 14.50MM 16.20MM 35.4MM 16.20MM 7.1MM 8.13MM = Assmann logo RoHS Compliant ITEM NO. 3.80MM 19.20MM 21.20MM 8.13MM A-TA3534-R Material: • Housing: PC UL94V-0 • Insert Material: PBT+20%GF UL94V-0 • PCB Material: FR-4 Thickness 1.6MM • Contact Material: Phosphor Bronze Stamp Pin T=0.50MM


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    PDF UL94V-0 -TA3534-R AMP modular plug RJ45 FR4 thickness 1.6mm PBT 20 GF modular plug amp RJ45 PBT-20GF Jack cat5e cat5e keystone jack Assmann

    HAF2015RJ

    Abstract: DSA003645 Hitachi DSA003645
    Text: HAF2015RJ Silicon N Channel MOS FET Series Power Switching ADE-208-933 Z 1st. Edition Dec. 2000 This FET has the over temperature shut–down capability sensing to the junction temperature. This FET has the built–in over temperature shut–down circuit in the gate area. And this circuit operation to shut–down the gate


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    PDF HAF2015RJ ADE-208-933 HAF2015RJ DSA003645 Hitachi DSA003645

    Hitachi DSA002731

    Abstract: No abstract text available
    Text: HAF2015RJ Silicon N Channel MOS FET Series Power Switching ADE-208-933 Z 1st. Edition Dec. 2000 This FET has the over temperature shut–down capability sensing to the junction temperature. This FET has the built–in over temperature shut–down circuit in the gate area. And this circuit operation to shut–down the gate


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    PDF HAF2015RJ ADE-208-933 D-85622 Hitachi DSA002731

    Untitled

    Abstract: No abstract text available
    Text: Inverted Thru Board Card Edge: BTB INTERCONNECT 00-9159 AVX has developed the 1-Piece bottom entry card edge connector to allow a perpendicular PCB to be mated to a top mounted main FR4 or metal core PCB from the bottom side. The most popular application on


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    PDF E90723.

    7075-T6 aluminum

    Abstract: 7075-T6 high current pogo pin aluminium 7075 180C SBT-BGA-7000 high current high temperature pogo pin
    Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features 10 14 9 7 8 6 • • • • • • 5 13 12 4 15 3 1 2 11 Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches from true position


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    PDF 7075-T6 SBT-BGA-7000 7075-T6 aluminum high current pogo pin aluminium 7075 180C high current high temperature pogo pin

    SSM3J326T

    Abstract: ssm3j326
    Text: SSM3J326T TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type U-MOS SSM3J326T Power Management Switch Applications • • Unit: mm 1.8-V drive Low ON-resistance: RDS(ON) = 115 mΩ (max) (@VGS = -1.8 V) RDS(ON) = 62.5 mΩ (max) (@VGS = -2.5 V) RDS(ON) = 45.7 mΩ (max) (@VGS = -4.5 V)


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    PDF SSM3J326T SSM3J326T ssm3j326

    SSM3J326T

    Abstract: No abstract text available
    Text: SSM3J326T TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type U-MOSⅥ SSM3J326T ○ Power Management Switch Applications Unit: mm 1.8-V drive Low ON-resistance: RDS(ON) = 115 mΩ (max) (@VGS = -1.8 V) RDS(ON) = 62.5 mΩ (max) (@VGS = -2.5 V) RDS(ON) = 45.7 mΩ (max) (@VGS = -4.5 V)


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    PDF SSM3J326T SSM3J326T

    Untitled

    Abstract: No abstract text available
    Text: SSM3J326T TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type U-MOSⅥ SSM3J326T ○ Power Management Switch Applications ○ High-Speed Switching Applications +0.2 2.8-0.3 1.8-V drive Low ON-resistance: RDS(ON) = 115 mΩ (max) (@VGS = -1.8 V) RDS(ON) = 62.5 mΩ (max) (@VGS = -2.5 V)


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    PDF SSM3J326T

    HAF2015RJ

    Abstract: No abstract text available
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    Cat5e Color Codes

    Abstract: EIA-310 CAT5e EIA-310D C2680-H 22-26AWG 568B patch panel
    Text: CAT5E 96 PORT PATCH PANEL 19” RACKMOUNT SKU: 041-375/96 Panel DESCRIPTION CAT5E 96 Port 110-IDC Patch Panel, 4 Unit 19”(W)x7”(H)x1-3/4”(D) FEATURES • High Impact Patch Panel • Tough Black Painted Finish • Number Labeled for Easy Identification


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    PDF 110-IDC 568-B EIA-310D C2680-H UL94V 22-26AWG UL94V-0 Cat5e Color Codes EIA-310 CAT5e EIA-310D C2680-H 568B patch panel

    94v0

    Abstract: fr4 1.6mm fr4 94v0 C2680-H ul 94v0 UL-94V0 UL for SECC
    Text: CAT6 12 PORT MINI PANEL WITH MOUNTING BRACKET SKU: 042-2134 Panel DESCRIPTION CAT6 12 Port-Mini 110-IDC Patch Panel, 1U, 2-1/4” W x10”(H)x1-3/4”(D) FEATURES • High Impact Patch Panel • Tough Black Painted Finish • Number Labeled for Easy Identification


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    PDF 110-IDC 568-B C2680-H UL-94V0 22-26AWG 94v0 fr4 1.6mm fr4 94v0 C2680-H ul 94v0 UL-94V0 UL for SECC

    marking 2U diode

    Abstract: EIA-310 CAT6 C2680-H 110 IDC EIA-310D 568B patch panel PATCH PANEL
    Text: CAT6 48 PORT PATCH PANEL 19” RACKMOUNT SKU: 042-378/48 Panel DESCRIPTION CAT6 48 Port 110-IDC Patch Panel, 2 Unit 19”(W)x3-1/2”(H)x1-3/4”(D) FEATURES • High Impact Patch Panel • Tough Black Painted Finish • Number Labeled for Easy Identification


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    PDF 110-IDC 568-B EIA-310D C2680-H UL94V 22-26AWG UL94V-0 marking 2U diode EIA-310 CAT6 C2680-H 110 IDC EIA-310D 568B patch panel PATCH PANEL

    EIA-310D

    Abstract: 568b 568B patch panel C2680-H cat6 jack
    Text: CAT6 12 PORT PATCH PANEL 19” RACKMOUNT SKU: 042-376/12 Panel DESCRIPTION CAT6 12 Port 110-IDC Patch Panel, 1 Unit 19”(W)x1-3/4”(H)x1-3/4”(D) FEATURES • High Impact Patch Panel • Tough Black Painted Finish • Number Labeled for Easy Identification


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    PDF 110-IDC 568-B EIA-310D C2680-H UL94V 22-26AWG UL94V-0 EIA-310D 568b 568B patch panel C2680-H cat6 jack

    EIA-310D

    Abstract: C2680-H fr4 1.6mm FR4 0.8mm thickness 568B patch panel cat6 96 port patch panel EIA-310-D 310-D 310D EIA310-D
    Text: CAT6 96 PORT PATCH PANEL 19” RACKMOUNT SKU: 042-379/96 Panel DESCRIPTION CAT6 96 Port 110-IDC Patch Panel, 4 Unit 19”(W)x7”(H)x1-3/4”(D) FEATURES • High Impact Patch Panel • Tough Black Painted Finish • Number Labeled for Easy Identification


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    PDF 110-IDC 568-B EIA-310D C2680-H UL94V 22-26AWG UL94V-0 EIA-310D C2680-H fr4 1.6mm FR4 0.8mm thickness 568B patch panel cat6 96 port patch panel EIA-310-D 310-D 310D EIA310-D

    Cat5e Color Codes

    Abstract: SECC material PATCH PANEL C2680-H FR4 0.8mm thickness
    Text: CAT5E 12 PORT PATCH PANEL 19” RACKMOUNT SKU: 041-371/12 Panel DESCRIPTION CAT5E 12 Port 110-IDC Patch Panel, 1 Unit 19”(W)x1-3/4”(H)x1-3/4”(D) FEATURES • High Impact Patch Panel • Tough Black Painted Finish • Number Labeled for Easy Identification


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    PDF 110-IDC 568-B EIA-310D C2680-H UL94V 22-26AWG UL94V-0 Cat5e Color Codes SECC material PATCH PANEL C2680-H FR4 0.8mm thickness

    TA-1115

    Abstract: No abstract text available
    Text: PRODUCT NO. REVISIONS BUTTON COLOR BLACK 73831-05RRA 88.05 REV DESCRIPTION A RELEASED ECN BY J90113 M.K DATE 4/2/'99 102.7 17.3 M2 TYP.(4) PC CARD SLOT A SLOT B 0.6mm PITCH RECEPTACLE (144P0S.) P/N : 73213-xxx NOTE: 1. | -A -1 : CARD EDGE POSITION 2. H H : CENTER OF PWB THICKNESS


    OCR Scan
    PDF 73831-05RRA J90113 144P0S. 73213-xxx TA-1115) TA-1115