FR4 epoxy glass 1.6mm substrate
Abstract: CPA0612 FR4 substrate 1.6mm
Text: CP02M581.04 Rev I - Page 1 of 4 Product Family: Current Sensing Power Resistor Part Number Series: CPA0612 Series Construction: Features: • High purity alumina substrate Nickel alloy thin-film resistive element
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CP02M581
CPA0612
Sn100,
FR4 epoxy glass 1.6mm substrate
FR4 substrate 1.6mm
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FR4 epoxy glass 1.6mm substrate
Abstract: CPA0612 CPA0612QR005FS epoxy resin marking code b6 R005 FR4 substrate 1.6mm
Text: CP02M581.04 Rev F - Page 1 of 4 Product Family: Current Sensing Power Resistor Part Number Series: CPA0612 Series Construction: Features: • High purity alumina substrate Nickel alloy thin-film resistive element
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CP02M581
CPA0612
Sn100,
FR4 epoxy glass 1.6mm substrate
CPA0612QR005FS
epoxy resin
marking code b6
R005
FR4 substrate 1.6mm
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CPA0612-FS
Abstract: FR4 epoxy glass 1.6mm substrate FR4 substrate 1.6mm
Text: CP02M581.04 Rev J - Page 1 of 4 Product Family: Current Sensing Power Resistor Part Number Series: CPA0612 Series Construction: Features: • High purity alumina substrate Nickel alloy thin-film resistive element
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CP02M581
CPA0612
Sn100,
CPA0612-FS
FR4 epoxy glass 1.6mm substrate
FR4 substrate 1.6mm
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Untitled
Abstract: No abstract text available
Text: Surface-mount Power Transistor Array SPF0001 Tj Tstg Electrical Characteristics Ta=25ºC Unit V V V A A W ºC ºC Symbol Test Conditions ICBO IEBO VCEO hFE VCE (sat) VFEC Es/b VCB = 105V VEB = 6V IC = 50mA VCE = 1V, IC = 1A IC = 1.2A, IB = 12mA I FEC = 6A
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SPF0001
20pin
100mmâ
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FR4 epoxy glass 1.6mm substrate
Abstract: FR4 substrate 1.6mm
Text: Approval sheet WW08C, WW06C, WW04C ±5%, ±1%, ±0.5% Low ohm chip resistors power Size 0805, 0603, 0402 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxC_V02 Feb.2011 Approval sheet FEATURE 1. High power rating and low range
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WW08C,
WW06C,
WW04C
WW04C
WW08C
WW06C
FR4 epoxy glass 1.6mm substrate
FR4 substrate 1.6mm
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FR4 epoxy glass 1.6mm substrate
Abstract: FR4 substrate 1.6mm
Text: WW08C, WW06C, WW04C ±5%, ±1%, ±0.5% Low ohm chip resistors power Size 0805, 0603, 0402 Page 1 of 8 WWxxC_V02 Feb.2011 FEATURE 1. High power rating and low range 2. High reliability and stability 3. Suitable for current sensing of small mobile devices
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WW08C,
WW06C,
WW04C
WW04C
WW08C
WW06C
FR4 epoxy glass 1.6mm substrate
FR4 substrate 1.6mm
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SPF0001
Abstract: smd TRANSISTOR F2 SPF0001 SMD power transistor array 7502 transistor SMD TRANSISTOR 12a SPF00 SMD-16A
Text: Surface-mount Power Transistor Array SPF0001 Tj Tstg Electrical Characteristics Symbol Test Conditions ICBO IEBO VCEO hFE VCE sat VFEC Es/b VCB=105V VEB=6V IC=50mA VCE=1V, IC=1A IC=1.2A, IB=12mA I FEC=6A L=10mH (Ta=25ºC) min 105 400 45 Ratings typ 115 800
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SPF0001
SMD-16A
100mm
SPF0001
smd TRANSISTOR F2
SPF0001 SMD
power transistor array
7502 transistor
SMD TRANSISTOR 12a
SPF00
SMD-16A
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PDF
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enamelled copper wire swg table
Abstract: RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2
Text: 987 Technical portal and online community for Design Engineers - www.element-14.com PCB Prototyping Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bread Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAD Software Systems . . . . . . . . . . . . . . . . . . . . .
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element-14
127mm
210x297mm)
420x297mm)
33MTR
enamelled copper wire swg table
RS-274-D
for all smd components
F585-34
BS4520
BS4584 PART 3
MELF 3514 dimensions
jigs and fixtures mini project
BS4584 102.5
cuzn40pb2
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PDF
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ASC_WWxxC
Abstract: WW12C
Text: Approval sheet WW12C, WW08C, WW06C, WW04C, WW02C ±5%, ±1% Low ohm chip resistors power Size 1206, 0805, 0603, 0402, 0201 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxC_V07 Jan 2014 Approval sheet FEATURE 1. High power rating and low range
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WW12C,
WW08C,
WW06C,
WW04C,
WW02C
metal50Â
WW08C
WW12C
WW04C
ASC_WWxxC
WW12C
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FR4 epoxy glass 1.6mm substrate
Abstract: FR4 substrate 1.6mm WW12C
Text: Approval sheet WW12C, WW08C, WW06C, WW04C, WW02C ±5%, ±1%, ±0.5% Low ohm chip resistors power Size 1206, 0805, 0603, 0402, 0201 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxC_V05 Mar.-2012 Approval sheet FEATURE
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WW12C,
WW08C,
WW06C,
WW04C,
WW02C
WW02C
WW04C
WW06C
WW08C
WW12C
FR4 epoxy glass 1.6mm substrate
FR4 substrate 1.6mm
WW12C
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FR4 epoxy glass 1.6mm substrate
Abstract: 32101-801 specification CECC 32100 Capacitor 32101-801 60068-2-21 CECC - Detail Specifications Syfer Capacitors syfer x7r capacitors syfer x7r 1206 CECC Capacitor
Text: Syfer Technology Limited, Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom Tel: +44 0 1603 723300. Tel. (Sales): 01603 723310 Fax: +44 (0) 1603 723301 Email: [email protected] Web: www.syfer.com Bend Testing Introduction 2 International Requirements/ Specifications
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AN0002
FR4 epoxy glass 1.6mm substrate
32101-801
specification CECC 32100
Capacitor 32101-801
60068-2-21
CECC - Detail Specifications
Syfer Capacitors
syfer x7r capacitors
syfer x7r 1206
CECC Capacitor
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PDF
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FR4 epoxy glass 1.5mm substrate
Abstract: sheet metal press bending machine
Text: MOUNTING INSTRUCTIONS page Axial-leaded devices 562 SOT54 T092 563 SOT82 564 SOT78 (T0220AB); SOT186A 567 SOT223; SOT428; SOT4Q4 572 Philips Semiconductors Mounting instructions Axial-ieaded devices GENERAL DATA AND INSTRUCTIONS General rules Excessive forces or temperature applied to a diode may
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OCR Scan
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T0220AB)
OT186A
OT223;
OT428;
FR4 epoxy glass 1.5mm substrate
sheet metal press bending machine
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PDF
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MLCC CRACK
Abstract: syfer x7r capacitors 1206 SAC CHIP capacitor cross reference AN0010 syfer 1206 TYPES OF CAPACITORS testing
Text: Syfer Technology Limited, Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom Tel: +44 0 1603 723300. Tel. (Sales): 01603 723310 Fax: +44 (0) 1603 723301 Email: [email protected] Web: www.syfer.com The Effect of Lead Free Soldering on
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AN0010
MLCC CRACK
syfer x7r capacitors
1206 SAC
CHIP capacitor cross reference
AN0010
syfer 1206
TYPES OF CAPACITORS testing
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FR4 epoxy glass 1.6mm substrate
Abstract: FR4 1.6mm substrate on 5295 transistor AN-996 SMD10 IRG4Z the calculation of the power dissipation for the IGBT IGBT heatsink cleaning FR4 substrate 1.6mm
Text: AN-996 v.Int Guidelines for the Assembly of SMD10 Devices Introduction This application note gives details of thermal characteristics and mounting considerations for the SMD10 surface mount package from International Rectifier. With a proven track record for mounting on IMS board in International Rectifiers’
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AN-996
SMD10
FR4 epoxy glass 1.6mm substrate
FR4 1.6mm substrate
on 5295 transistor
AN-996
IRG4Z
the calculation of the power dissipation for the IGBT
IGBT heatsink cleaning
FR4 substrate 1.6mm
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BD6231F
Abstract: BD6232 BD6222 BD6231 BD6232FP BD6237 BD6226FP FR4 substrate 1.6mm
Text: TECHNICAL NOTE For brush motors H-bridge drivers 36V max. BD6230, BD6231, BD6232, BD6235, BD6236, BD6237 zOverview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow
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BD6230,
BD6231,
BD6232,
BD6235,
BD6236,
BD6237
20kHz
BD6231F
BD6232
BD6222
BD6231
BD6232FP
BD6237
BD6226FP
FR4 substrate 1.6mm
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FR4 substrate 1.6mm
Abstract: No abstract text available
Text: TECHNICAL NOTE For brush motors H-bridge drivers 18V max. BD6220, BD6221, BD6222, BD6225, BD6226, BD6227 zOverview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow
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BD6220,
BD6221,
BD6222,
BD6225,
BD6226,
BD6227
20kHz
100kHent
FR4 substrate 1.6mm
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IIH30
Abstract: SSOP-B24 BD6215 BD6221F BD6222 BD6232 electromagnetic brake power circuit diagram FR4 1.6mm substrate PWM USING IC 556 TIMER BD6221
Text: TECHNICAL NOTE For brush motors H-bridge drivers 18V max. BD6220, BD6221, BD6222, BD6225, BD6226, BD6227 zOverview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow
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BD6220,
BD6221,
BD6222,
BD6225,
BD6226,
BD6227
20kHz
IIH30
SSOP-B24
BD6215
BD6221F
BD6222
BD6232
electromagnetic brake power circuit diagram
FR4 1.6mm substrate
PWM USING IC 556 TIMER
BD6221
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PDF
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Untitled
Abstract: No abstract text available
Text: TECHNICAL NOTE For brush motors H-bridge drivers 7V max. BD6210, BD6211, BD6212, BD6215, BD6216, BD6217 zOverview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow
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BD6210,
BD6211,
BD6212,
BD6215,
BD6216,
BD6217
20kHz
100kHzent
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PDF
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FR4 substrate 1.6mm
Abstract: No abstract text available
Text: TECHNICAL NOTE For brush motors H-bridge drivers 36V max. BD6230, BD6231, BD6232, BD6235, BD6236, BD6237 zOverview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow
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BD6230,
BD6231,
BD6232,
BD6235,
BD6236,
BD6237
20kHz
100kHent
FR4 substrate 1.6mm
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PDF
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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Untitled
Abstract: No abstract text available
Text: Datasheet DC Brushless Fan Motor Drivers Multifunction Single-phase Full-wave Fan Motor Driver BD6973FV-LB General Description Package SSOP-B16 This is the product guarantees long time support in Industrial market. BD6973FV-LB is a pre-driver that controls the motor
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BD6973FV-LB
SSOP-B16
BD6973FV-LB
BD6974FV-LB
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PDF
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Untitled
Abstract: No abstract text available
Text: Datasheet DC Brushless Fan Motor Drivers Multifunction Single-phase Full-wave Fan Motor Driver BD6974FV-LB General Description Package SSOP-B16 This is the product guarantees long time support in Industrial market. BD6974FV-LB is a pre-driver that controls the motor
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BD6974FV-LB
SSOP-B16
BD6974FV-LB
BD6973FV-LB
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PDF
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Untitled
Abstract: No abstract text available
Text: Datasheet DC Brushless Fan Motor Drivers Multifunction Single-phase Full-wave Fan Motor Driver BD6973FV-LB General Description Package SSOP-B16 This is the product guarantees long time support in Industrial market. BD6973FV-LB is a pre-driver that controls the motor
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BD6973FV-LB
SSOP-B16
BD6973FV-LB
BD6974FV-LB
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PDF
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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