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    GA01PNS150-CAU SPICE

    Abstract: high-temperature-sic-bare-die
    Text: Die Datasheet GA01PNS150-CAU SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GA01PNS150-CAU device. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.1 $ * $Date: 30-APR-2015


    Original     		GA01PNS150-CAU GA01PNS150-CAU 30-APR-2015 GA01PNS150 71E-12 28E-11 00E-03 GA01PNS150-CAU SPICE high-temperature-sic-bare-die PDF

    Untitled

    Abstract: No abstract text available
    Text: Die Datasheet GA01PNS150-CAU Silicon Carbide PiN Diode Chip VRRM o IF @ 25 C = = 15000 V 1A Features •     15 kV blocking 250 °C operating temperature Fast turn off characteristics Soft reverse recovery characteristics Ultra-Fast high temperature switching


    Original     		GA01PNS150-CAU GA01PNS150-CAU GA01PNS150 71E-12 28E-11 00E-03 PDF