ADV9614
Abstract: Glass Seal PGA
Text: CUSTOMER ADVISORY GLASS SEAL PGA Overview In 1993 Altera converted its 68-, 84-, and 100-pin solder-seal Pin Grid Array PGA packages to a glass-sealed PGA package. However, since Altera acquired the Intel product line in 1994 the company has been supporting orders for the solder seal PGA package. Going forward, Altera
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100-pin
MIL-STD-883,
9626C)
ADV9614
ADV9614
Glass Seal PGA
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Alumina ceramic AI203
Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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gold metal detectors
Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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solid solubility
Abstract: chemical control process block diagram
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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100 series machine screw SOCKET
Abstract: No abstract text available
Text: 3M PGA Socket Screw Machine 200 Series • Accepts various PGA packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Optional seal tape for closed-body configuration • Custom patterns available for quantities above
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TS-2116-03
100 series machine screw SOCKET
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gold metal detectors
Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Text: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of
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CH03WIP
gold metal detectors
soft solder die bonding
schematic diagram intel atom
INCOMING RAW MATERIAL INSPECTION
lead side brazed hermetic
X-RAY INSPECTION
ausi die attach
electrical three phase schematic riser DIAGRAM
epoxy adhesive paste cte table
intel 24008
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Untitled
Abstract: No abstract text available
Text: 3M PGA Socket Screw Machine 200 Series ED • Accepts various PGA packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Optional seal tape for closed-body configuration • Custom patterns available for quantities above
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Ultrasonic Cleaning Transducer
Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
Text: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family
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SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY
Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
Text: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .
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94vo fr4
Abstract: No abstract text available
Text: Low Insertion Force PGA Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email [email protected] • Internet http://www.advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets .100
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94vo fr4
Abstract: C17200 pga socket 64 3m
Text: cat15 5/22/01 9:40 AM Page 32 Low Insertion Force PGA Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email [email protected] • Internet http://www.advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets
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cat15
C36000)
94vo fr4
C17200
pga socket 64 3m
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823B
Abstract: DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook
Text: MOTOROLA SEMICONDUCTOR GENERAL INFORMATION Packaging & Case Information 84-Pin PLCC CASE 780A-01 ISSUE A FN SUFFIX 181-Pin PGA CASE 795A–02 ISSUE A HI SUFFIX 128-Pin QFP CASE 862A-02 ISSUE B DD SUFFIX 208-Pin QFP CASE 872A-01 ISSUE TBD DK SUFFIX 160-Pin QFP
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84-Pin
80A-01
181-Pin
128-Pin
62A-02
208-Pin
72A-01
160-Pin
64A-03
224-Pin
823B
DL201
motorola handbook
84 pin plcc ic base
Reliability and quality handbook
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CONDUCTIVE INK
Abstract: tic 719 Glob COB CHIP ON BOARD marking ic 2008 dam and fill
Text: Comprehensive radiation effects test and support Quick-Turn Prototype IC Assembly Aeroflex RAD offers the following services: Quick-Turn Prototype IC Assembly in ceramic, etched out plastic, COB and flip chip. Quick-Turn Prototype IC Assembly Capabilities
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50-500X)
MIL-PRF-38535
MIL-PRF-19500
AS9100
CONDUCTIVE INK
tic 719
Glob
COB CHIP ON BOARD
marking ic 2008
dam and fill
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Datasheet of IC 7432
Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
Text: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type
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AS400
Abstract: S390 ES9000 S390-G5 CMOS-6S S390G ibm semi
Text: THIN FILM PGA ON S390-G5 MAINFRAME HIGH DENSITY MCMS A. K. Malhotra*, D. C. McHerron, R. Shields, B. Ghosal, G. Martin, D. Scheider, J. R. Pennacchia IBM Microelectronics Division, Rt. 52, Hopewell Junction, New York 12533 * Tel.: 914 894-3326; Email: [email protected]
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S390-G5
S-390
127mm
127mm
AS400
S390
ES9000
CMOS-6S
S390G
ibm semi
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smd transistor M7A
Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages
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PD41265L-12-E1
PD41256L
PD23C32000AGX-$
PD23C32000A
smd transistor M7A
ED-7304-1
smd m7a
uPD4011BG
ED730
EIA and EIAJ tape standards
ED-7417
EIA and EIAJ standards
ED-7409
IEC-Publication-747
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JM7000
Abstract: ltx credence tester ltx ts80 teradyne flex tester credence tester sic wafer j937 optocoupler NAND SiC-JFET ceramic pin grid array package wire bond
Text: Custom Product Capabilities Micross Components formerly Austin Semiconductor has loyally served the Military & Hi-Rel custom assembly and test marketplace for over 22 years. Custom support has been the company foundation since its inception, with the philosophy that if it can be defined by the customer, Micross will support the
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800Mhz
JM7000
ltx credence tester
ltx ts80
teradyne flex tester
credence tester
sic wafer
j937
optocoupler NAND
SiC-JFET
ceramic pin grid array package wire bond
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fr4 94v0
Abstract: No abstract text available
Text: ADVANCED Low Insertion Force PGA Sockets INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850 / 401-823-5200 •Fax 401-823-8723 ■Email [email protected] • Internet http://www.advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets
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94v0 fr4
Abstract: fr4 94v0
Text: Low Insertion Force PGA Sockets ADVANCED » INTERCONNECTIONS» 5 Energy Way, P.O. Box 1019, West W arwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@ advlntcorp.com • Internet http://w ww .advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets
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Type-150
94v0 fr4
fr4 94v0
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Untitled
Abstract: No abstract text available
Text: XICOR SHE INC D * m i? 4 3 aaaam? b A D V A N C E D IN FO R M A TIO N Commercial Industrial 64K X28C64 X28C64I 8K x 8 Bit Electrically Erasable PROM T~y¿-/3~Z7 DESCRIPTION FEATURES • LOW Power CMOS —60 mA Active Current Max. —200 /aA Standby Current Max.
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X28C64
X28C64I
64-Byte
X28C64,
32-PAD
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x2864a
Abstract: X2864B
Text: i m C/1kr 64K Commercial X2864B moo v a Rit Industrial_ X2864BI_ 8 19 2x 8B lt Electrically Erasable PROM _ DESCRIPTION TYPICAL FEATURES • 120 ns Access Time • High Perform ance Scaled NMOS Technology • Fast W rite Cycle Times
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X2864B
X2864BI_
32-Byte
X2864B
X2864B,
X2864BI
32-PAD
x2864a
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*26C64
Abstract: X2864B X28C64G x28c64 X23c64 INS250 X2864A x2864a ordering X2HC64 x26c
Text: ADVANCED INFORMATION Commercial X28C64 m* Industrial_X28C64I_ 8K x 8 Blt RA1£ 64K Electrically Erasable PROM FEATURES • LOW Power CMOS — 60 mA Active Current Max. —200 jliA Standby Current Max. • Fast Write Cycle Times
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X28C64
X28C64I_
--64-Byte
X2-113
X28C64,
X28C64I
32-PAD
*26C64
X2864B
X28C64G
X23c64
INS250
X2864A
x2864a ordering
X2HC64
x26c
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X2864BP
Abstract: x2864 x2864bd X2864B x2864bd-15 x2864BDI X2864BD-18 X2864BJ X2864BJI-18 Xicor
Text: ü a r Commercial X2864B m oovftB i* Industrial_ X2864BI_ 8192x8 Bit 64K Electrically Erasable PROM TYPICAL FEATURES • 120 ns Access Time • High Performance Scaled NMOS Technology • Fast Write Cycle Times —32-Byte Page Write Operation
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X2864B
X2864BI_
8192x8
--32-Byte
32-PAD
X2864BP
x2864
x2864bd
x2864bd-15
x2864BDI
X2864BD-18
X2864BJ
X2864BJI-18
Xicor
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Untitled
Abstract: No abstract text available
Text: 256K Military X28C256M 32Kx8Bit _ Electrically Erasable PROM_ FEATURES • LOW Power CMOS — 60 mA Active Current Max. —200 juA Standby Current Max. • Fast Write Cycle Times
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X28C256M
32Kx8Bit
64-Byte
X2864A
JEDE51
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