GOLD EMBRITTLEMENT PALLADIUM Search Results

GOLD EMBRITTLEMENT PALLADIUM Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
CN-AC3MMDZBAU		Amphenol Cables on Demand	3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts)	Datasheet
CN-ACPRREDAA0		Amphenol Cables on Demand	RCA Male Plug Cable Connector (Red) - Amphenol ACPR-RED - Gold Plated Diecast Shell	Datasheet
AV-3.5MINYRCA-015		Amphenol Cables on Demand	Amphenol AV-3.5MINYRCA-015 Stereo Y Adapter Cable - Premium Gold Stereo 3.5mm (Headphone Plug) to Dual RCA Y Adapter Cable - 3.5mm Mini-Stereo Male to Dual RCA Male 15ft	Datasheet
ND9BS2700		Amphenol Communications Solutions	ix Industrial, Input output connectors, Receptacle, Type B Vertical, SMT, Palladium-Nickel Gold
ND9AS2700		Amphenol Communications Solutions	ix Industrial, Input output connectors, Receptacle, Type A Vertical, SMT, Palladium-Nickel Gold

GOLD EMBRITTLEMENT PALLADIUM Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
SZZA031 Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste Text: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)	Original	PDF	SZZA031 Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
CU-106A Abstract: entek plus cu 106a anova general cross references TI Cross Reference Search HC373 Au Sn eutectic gold embrittlement Text: Pb-Free Solder Joint Evaluation Contact Us Buy About TI TI Worldwide my.TI Advanced Search Keyword Part Number >> Semiconductor Home > Products > Digital Logic > Digital Logic Overview > Texas Instruments Palladium Lead Finish Pb-Free Solder Joint Evaluation	Original	PDF	28September CU-106A entek plus cu 106a anova general cross references TI Cross Reference Search HC373 Au Sn eutectic gold embrittlement
waveguide selective switch Abstract: quartz optical properties MSI nichrome resistor A1203 Thin Film Capacitors AI and Au wirebonding NICHROME wire 0.005 mm2 microwave circulators ATT Wireless Services coupler ATT coupler conductor Text: MIC Technology Vishay Electro-Films An Introduction To Substrate PIMICTM Passive Intergrated Micro-Electron Interconnect Circuitry Technology Thin film microwave integrated circuits have been evolving from a simple substrate medium which carries microwave/	Original	PDF	02-Dec-04 waveguide selective switch quartz optical properties MSI nichrome resistor A1203 Thin Film Capacitors AI and Au wirebonding NICHROME wire 0.005 mm2 microwave circulators ATT Wireless Services coupler ATT coupler conductor
NICHROME wire 0.005 mm2 Abstract: gold embrittlement MSI nichrome resistor nicr-ni temperature waveguide selective switch microwave circulators AT*T Wireless Services coupler Text: VISHAY ELECTRO-FILMS Vishay Film Resistors Tech Note An Introduction to Substrate PIMIC Passive Integrated Microelectronic Interconnect Circuitry Technology Introduction Document Number: 61082 Revision: 27-Mar-07 Simple Interconnect Advanced Interconnect	Original	PDF	27-Mar-07 NICHROME wire 0.005 mm2 gold embrittlement MSI nichrome resistor nicr-ni temperature waveguide selective switch microwave circulators AT*T Wireless Services coupler
9214-KT Abstract: powerflex mil Constantan bond wire R-PDSO-G14 footprint tesec manual D(R-PDSO-G14) Package powerflex 70 A113 IPC-SM-782 SLIT115A Text: PowerFLEX  Surface-Mount Power Packaging SLIT115A September 1996 – Revised February 1999 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information	Original	PDF	SLIT115A 15-Lead 15-Lead 9214-KT powerflex mil Constantan bond wire R-PDSO-G14 footprint tesec manual D(R-PDSO-G14) Package powerflex 70 A113 IPC-SM-782 SLIT115A
R-PDSO-G14 footprint Abstract: NKT 275 transistor powerflex 9214-KT D(R-PDSO-G14) Package transistor ktc 1270 hot wire anemometer block diagram mil Constantan bond wire powerflex 70 100C Text: Printed in U.S.A. 08–96 * SLIT115 PowerFLEX  Surface Mount Power Packaging SLIT115 September 1996 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor	Original	PDF	SLIT115 R-PDSO-G14 footprint NKT 275 transistor powerflex 9214-KT D(R-PDSO-G14) Package transistor ktc 1270 hot wire anemometer block diagram mil Constantan bond wire powerflex 70 100C
R-PDSO-G14 footprint Abstract: gold embrittlement 100C A113 IPC-SM-782 anemometer tesec manual 9214-KT Text: Printed in U.S.A. 08–96 * SLIT115 PowerFLEX  Surface Mount Power Packaging SLIT115 September 1996 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor	Original	PDF	SLIT115 R-PDSO-G14 footprint gold embrittlement 100C A113 IPC-SM-782 anemometer tesec manual 9214-KT
smd transistor mark E13 Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue	Original	PDF	SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4