AN1007
Abstract: DSP56652 GSI cross GS71024 GS73024 DSP56300 DSP56600 DSP56690 ADSP-2100 ADSP2106
Text: AN1007 APPLICATION NOTE Pushing Your DSP to the Limit with GSI Technology SRAMs A broad range of digital signal processor applications in the telecommunications infrastructure feature large signal-processing tasks and require the very highest computational performance. New server
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AN1007
2000MIPS
AN1007
DSP56652
GSI cross
GS71024
GS73024
DSP56300
DSP56600
DSP56690
ADSP-2100
ADSP2106
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K6X0808C1D-BF55
Abstract: HY6264P AS6C1008-55SIN samsung p28 K6R4016V1D-UC10 as6c4008-55sin HYNIX IS61LV25616AL-10KLI GS71116AGP-10 uPD431000ACZ-70L
Text: cross_reference Density Organization Alliance Alliance Part Number Alliance Package Alliance Speed Samsung Samsung Part Number Cypress Cypress Part Number Cypress Package Cypress Package Code Cypress Speed IDT Part Number IDT Package IDT Package Code IDT Speed ISSI
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CY7C128A-15VC
CY7C128A-15SC
CY7C167A-15PC
CY7C168A-15PC
24PIN
20PIN
300MIL
K6X0808C1D-BF55
HY6264P
AS6C1008-55SIN
samsung p28
K6R4016V1D-UC10
as6c4008-55sin
HYNIX
IS61LV25616AL-10KLI
GS71116AGP-10
uPD431000ACZ-70L
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um61256
Abstract: PM25LV040 SST25LF040B Pm25LV016 PM25LV010A PM25LV080 SST25LF512A HY514264 M5M418 hynix hy57v281620
Text: Cross Reference Your Memory Supplier part number brand AMIC part number Description µPD4218165 µPD4218165 µPD424260 µPD431000A µPD43256B µPD441000L-B µPD442000L-B µPD442012L-XB µPD444012L-B A29F002 AM29DL162C/D AM29DL163C/D AM29DL164C/D AM29F002B
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PD4218165
PD424260
PD431000A
PD43256B
PD441000L-B
PD442000L-B
PD442012L-XB
PD444012L-B
A29F002
um61256
PM25LV040
SST25LF040B
Pm25LV016
PM25LV010A
PM25LV080
SST25LF512A
HY514264
M5M418
hynix hy57v281620
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1H08S
Abstract: PI6C2405A-1HW ASM706CUA SOIC-6 microchip ADM809RAR ADM705AN MAX809SEUR T ASM5P2309-1H-16-S K7N163601B MAX810JEUR
Text: Supervisors Cross Reference Guide Alliance Maxim/Dallas IMP ASM1232LP DS1232LPS-2 IMP1232LP ASM1232LPCMA DS1232LP IMP1232LPCMA ASM1232LPEMA DS1232LP IMP1232LPEMA ASM1232LPN DS1232LP IMP1232LPN Analog Devices Micrel Microchip MIC1232N TC1232CPA - - - - - -
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ASM1232LP
DS1232LPS-2
IMP1232LP
ASM1232LPCMA
DS1232LP
IMP1232LPCMA
ASM1232LPEMA
IMP1232LPEMA
ASM1232LPN
1H08S
PI6C2405A-1HW
ASM706CUA
SOIC-6 microchip
ADM809RAR
ADM705AN
MAX809SEUR T
ASM5P2309-1H-16-S
K7N163601B
MAX810JEUR
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Untitled
Abstract: No abstract text available
Text: Product Preview GS815018/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 2.5 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode
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GS815018/36AB-357/333/300/250
119-Bump
GS815018/36A
8150xxA
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Untitled
Abstract: No abstract text available
Text: Product Preview GS8150V18/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode
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GS8150V18/36AB-357/333/300/250
119-Bump
GS8150V18/36A/25
8150VxxA
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Untitled
Abstract: No abstract text available
Text: Product Preview GS815018/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM Features 250 MHz – 357 MHz 2.5 V VDD 1.5 V or 1.8 V HSTL I/O GS815018/36A support pipelined reads utilizing a rising-edgetriggered output register. They also utilize a Dual Cycle
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GS815018/36AB-357/333/300/250
119-Bump
GS815018/36A
GS815036AB-300T.
8150xxA
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Untitled
Abstract: No abstract text available
Text: Product Preview GS8150V18/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM Features 250 MHz – 357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O GS8150V18/36A support pipelined reads utilizing a risingedge-triggered output register. They also utilize a Dual Cycle
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GS8150V18/36AB-357/333/300/250
119-Bump
GS8150V18/36A
GS8150V36AB-300T.
8150VxxA
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B180
Abstract: No abstract text available
Text: GS84018/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply
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GS84018/32/36AT/B-180/166/150/100
100-lead
119-bump
84018A
840xxA
B180
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B180
Abstract: No abstract text available
Text: GS84018/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply
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GS84018/32/36AT/B-180/166/150/100
84018A
840xxA
B180
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GS832236E-150I
Abstract: GS832218 GS832218B-200 GS832218B-225 GS832218B-250 GS832272
Text: GS832218 B/E /GS832236(B/E)/GS832272(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs Features 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O either linear or interleave order with the Linear Burst Order (LBO)
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GS832218
/GS832236
/GS832272
209-Pin
GS832236E-150I
GS832218B-200
GS832218B-225
GS832218B-250
GS832272
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GS816218B
Abstract: GS816218BB-150 GS816218BB-200 GS816218BB-250 GS816236B GS816236BB-200 GS816236BB-250 GS816236bD-150I
Text: GS816218/36B B/D 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs 119- & 165-Bump BGA Commercial Temp Industrial Temp Features 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation
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GS816218/36B
18MbS/DCD
165-Bump
x18/x36
GS816218B
GS816218BB-150
GS816218BB-200
GS816218BB-250
GS816236B
GS816236BB-200
GS816236BB-250
GS816236bD-150I
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GS864436E-250
Abstract: 3602 GS864418E-133 GS864418E-150 GS864418E-166 GS864418E-200 GS864418E-225 GS864418E-250 GS864436E-150 GS864436E-166
Text: Preliminary GS864418/36E-xxxV 165-Bump BGA Commercial Temp Industrial Temp 4M x 18, 2M x 36 72Mb S/DCD Sync Burst SRAMs Features 250 MHz–133MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O Data Output Register. Holding FT high places the RAM in Pipeline mode, activating the rising-edge-triggered Data Output
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GS864418/36E-xxxV
165-Bump
133MHz
x18/x36
8644Vxx
8644xx
GS864436E-250
3602
GS864418E-133
GS864418E-150
GS864418E-166
GS864418E-200
GS864418E-225
GS864418E-250
GS864436E-150
GS864436E-166
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GS832132AGD-150I
Abstract: No abstract text available
Text: Preliminary GS832118/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline
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GS832118/32/36AD-400/375/333/250/200/150
165-Bump
8321xxA
GS832132AGD-150I
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GS8160V18B
Abstract: GS8160V32B GS8160V36B
Text: Preliminary GS8160V18/32/36BT-250/200/150 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation
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GS8160V18/32/36BT-250/200/150
100-Pin
100-lead
GS8160V18B
GS8160V32B
GS8160V36B
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GS816032BT-150
Abstract: No abstract text available
Text: GS816018/32/36BT-250/200/150 100-Pin TQFP Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation
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GS816018/32/36BT-250/200/150
100-Pin
100-lead
GS816032BT-150
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GS88118B
Abstract: GS88118BT-250 GS88118BT-300 GS88118BT-333 GS88132B GS88136B
Text: GS88118B T/D /GS88132B(T/D)/GS88136B(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan
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GS88118B
/GS88132B
/GS88136B
100-pin
165-bump
100-lead
GS88118BT-250
GS88118BT-300
GS88118BT-333
GS88132B
GS88136B
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B180
Abstract: No abstract text available
Text: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply
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GS840H18/32/36AT/B-180/166/150/100
100-lead
119-Bump
GS84018/32/36
1999E
GS84018/32/3610-11/
B180
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Untitled
Abstract: No abstract text available
Text: Preliminary GS816218/36D B/D -xxxV 1M x 18, 512K x 36 18Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the
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GS816218/36D
x18/x36
165-bump
8162xxD
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Untitled
Abstract: No abstract text available
Text: GS881E18 T/D /GS881E32A(D)/GS881E36A(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb Synchronous Burst SRAMs Features • Dual Dycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply
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GS881E18
/GS881E32A
/GS881E36A
100-Pin
165-Bump
881E18A
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GS88237BB-200
Abstract: GS88237B GS88237BB-250 GS88237BB-300 GS88237BB-333 GS88237BB-333I GS88237BB-250I
Text: GS88237BB/D-333/300/250/200 119- & 165-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O SCD and DCD Pipelined Reads The GS88237BB/D is a SCD Single Cycle Deselect and
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GS88237BB/D-333/300/250/200
165-Bump
GS88237BB/D
GS88237BB-200
GS88237B
GS88237BB-250
GS88237BB-300
GS88237BB-333
GS88237BB-333I
GS88237BB-250I
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150-IV
Abstract: No abstract text available
Text: GS880E18/32/36CT-xxxV 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • 1.8 V or 2.5 V +10%/–10% core power supply • 1.8 V or 2.5 V I/O supply • LBO pin for Linear or Interleaved Burst mode
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GS880E18/32/36CT-xxxV
100-Pin
100-lead
184-bit
880ExxC
150-IV
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1N007
Abstract: fri07 1N007 rectifier MDA 2500 1Ns408 MDA 2506 by164 philips wiom BY225-200 ITT 1N4005
Text: FAGQR ELECTRONICS 57E D WÊ 3 ^ 3 2 5 Q000LS3 T31 « F G R S CROSS REFERENCE COMPETITIVE SERIES COMPETITOR FAGOR SERIES 1 5SKE 8 2 - 1 5KE 300 1 SKE 8 2 A -1 5KE 300 A THOM/CS1/MOT/GI THOM/GSI/MOT/GI 1 SKE 8 2 C -1 5KE 300 C 1 5SE 12 - 1 SSE 300 1 5SE 12 A • 1 5SE 300 A
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OCR Scan
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0G0Gb53
15SKE
15KE82
5KE300C
1KAB10-1KAB1C0
W005F-W10F
100JB
FB1001
FB1006
1N007
fri07
1N007 rectifier
MDA 2500
1Ns408
MDA 2506
by164 philips
wiom
BY225-200
ITT 1N4005
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AN15853
Abstract: td501 ANI5853A
Text: A P P f'O Y F n X T Fi-'?.' /• ID ocN o.|sD SC-PSE-tff0tSfr3,rt Prepared Product Specifications Checked A N 15853A Approved Type Total Page 21 Page No. 1 /J 1 S C ' S \ i oam i V gSiä n y Silicon M onolithic Bipolar IC Package Application 36-U SO Pin Plastic Package U SO N F-36D )
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AN15853A
36-USO
USONF-36D)
61x10s
ANI5853A
20j-N-k
H-SYNC-41
psDA-002-01
AN15853
td501
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