EP3SL340F1517
Abstract: altera cyclone 3 handbook texas instruments HC335FF1152 HC325Ff DDR3 jedec diode handbook fbga Substrate design guidelines hc335 texas instruments handbook
Text: HardCopy III Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 www.altera.com HC3_H5V1-3.2 Copyright 2010 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other
|
Original
|
|
PDF
|
EP4CE6 package
Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
|
Original
|
DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
|
PDF
|
HC335f
Abstract: 1517 data sheet flip chip
Text: 12. HardCopy III Device and Packaging Information HIII51012-3.0 Introduction This chapter provides package information for HardCopy III devices. Device and Package Information HardCopy III device and package reference information is listed in Table 12–1.
|
Original
|
HIII51012-3
HC315W
HC325W
HC325F
HC335L
HC335F
HC335f
1517 data sheet
flip chip
|
PDF
|
HC335FF1152
Abstract: HC325FF780 HC335 EP3SE110F1152 EP3SE110F
Text: Section I. Device Core This section provides a complete overview of all features relating to the HardCopy III device family. HardCopy III devices are Altera’s latest generation of low-cost, high-performance, low power ASICs with pin-outs, densities, and
|
Original
|
|
PDF
|
EIA-644
Abstract: SSTL-15 SSTL-18 HC325Ff78 HC335f HC325FF780 HC325Ff
Text: Section II. I/O Interfaces This section includes the following chapters: • Chapter 6, HardCopy III Device I/O Features ■ Chapter 7, External Memory Interfaces in HardCopy III Devices ■ Chapter 8, High-Speed Differential I/O Interfaces and DPA in HardCopy III
|
Original
|
|
PDF
|
1517P
Abstract: HC325 EP3SE110F HC335FF1152 verilog code for delta sigma adc m9ka hc335ff1152n 24BAN HC335LF1152
Text: HardCopy III Device Handbook Volume 1: Device Interfaces and Integration HardCopy III Device Handbook Volume 1: Device Interfaces and Integration 101 Innovation Drive San Jose, CA 95134 www.altera.com HC3_H5V1-3.3 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat.
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 7. External Memory Interfaces in HardCopy III Devices HIII51007-3.0 Introduction This chapter describes the hardware features that support high-speed memory interfacing for each double data rate DDR memory standard in HardCopy III devices. HardCopy III devices feature delay-locked loops (DLLs), phase-locked loops
|
Original
|
HIII51007-3
|
PDF
|
EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
|
Original
|
DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
|
PDF
|
1517 data sheet
Abstract: HC335f
Text: Section V. Packaging Information This section includes the following chapter: • Chapter 12, HardCopy III Device and Packaging Information Revision History Refer to each chapter for its own specific revision history. For information on when each chapter was updated, refer to the Chapter Revision Dates section, which appears
|
Original
|
HIII51012-3
1517 data sheet
HC335f
|
PDF
|
EP3SE110F1152
Abstract: altera cyclone 3
Text: HardCopy III Device Handbook, Volume 2 101 Innovation Drive San Jose, CA 95134 www.altera.com HC3_H5V2-3.1 Copyright 2010 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other
|
Original
|
|
PDF
|
EP3SE110F1152
Abstract: EP3SE110F HC325FF780 EP3SE110F780 EP3SE110-F1152 ep3sl200h780 H1152 HC325WF780 HC335 EP3SE110-F780
Text: 5. Clock Networks and PLLs in HardCopy III Devices HIII51005-3.0 Introduction This chapter provides a general description of clock networks and PLLs in HardCopy III devices. HardCopy III devices support a hierarchical clock structure and multiple PLLs with
|
Original
|
HIII51005-3
EP3SE110F1152
EP3SE110F
HC325FF780
EP3SE110F780
EP3SE110-F1152
ep3sl200h780
H1152
HC325WF780
HC335
EP3SE110-F780
|
PDF
|
JESD8-16A
Abstract: JESD8-15 ccpd 33 CB EP3SE110F780 JESD8-6 JESD86 SSTL-15 JESD815 JESD8 EIA-644
Text: 6. HardCopy III Device I/O Features HIII51006-3.0 Introduction This chapter documents I/O standards, features, termination schemes, and performance supported in HardCopy III devices. All HardCopy III devices have configurable high-performance I/O drivers and receivers supporting a wide range of
|
Original
|
HIII51006-3
EP3SE260--H780
EP3SL340--H1152
JESD8-16A
JESD8-15
ccpd 33 CB
EP3SE110F780
JESD8-6
JESD86
SSTL-15
JESD815
JESD8
EIA-644
|
PDF
|
FBGA 1760
Abstract: F1517 EP3SE110F stratix III fpga
Text: Section I. HardCopy III Design Flow and Prototyping with Stratix III Devices This section provides a description of the design flow and the implementation process used by the HardCopy Design Center. It also provides information about mapping Stratix III devices to HardCopy® III devices and associated power and configuration
|
Original
|
|
PDF
|
1517-pin
Abstract: DPA Series LVDS Buffer SSTL-15 SSTL-18 HC325F HC335f
Text: 8. High-Speed Differential I/O Interfaces and DPA in HardCopy III Devices HIII51008-3.1 The HardCopy III device family offers up to 1.25-Gbps differential I/O capabilities to support source-synchronous communication protocols such as Utopia, RapidIO®, XSBI, SGMII, SFI, and SPI. HardCopy III and Stratix ® III devices have identical
|
Original
|
HIII51008-3
25-Gbps
1517-pin
DPA Series
LVDS Buffer
SSTL-15
SSTL-18
HC325F
HC335f
|
PDF
|
|
|
hc335
Abstract: EP3SE110F1152 EP3SE110 EP3SL110F780 1517-pin HC325WF484N hc335ff1152n HC335FF1517N Altera Stratix II BGA 484 pinout HC325
Text: 3. Mapping Stratix III Device Resources to HardCopy III Devices HIII53003-3.1 This chapter discusses the available options for mapping from a Stratix III device to a HardCopy ® III device. The Quartus II software limits resources to those available to both the Stratix III FPGA
|
Original
|
HIII53003-3
avai10,
hc335
EP3SE110F1152
EP3SE110
EP3SL110F780
1517-pin
HC325WF484N
hc335ff1152n
HC335FF1517N
Altera Stratix II BGA 484 pinout
HC325
|
PDF
|