l 0427
Abstract: HD6433664BP 80247
Text: IC dependence of osc i11 at inq character ist ics HD6433664BP FCR8.0MC5 - S Room Temp. Udd [U] 5 item a~e HD6433664BP - 08 Udd= 5 [U] 7 a. U1H/U1L - - [U] 4.6 UIH — 4.6 — 4.7 Unrst. 4.9 FCR8.0MC5 (Fig.a~e) 4.9 - - 4 .3 UIL . i 1 b. U2H/U2L HU]
|
OCR Scan
|
HD6433664BP
l 0427
80247
|
PDF
|
FCR16
Abstract: HD6433664FP HD64F3664FP
Text: IC dependence of osc i11 at inq character ist ics HD6433664FP Room Temp. FCRI6.0M2G - S Udd [U] 5 item a~e CLI/CL2 CpF] 5 / 5 HD6433664FP - 08 FCR16.0M2G Udd= 5 [U] (Fig.a~d) Ta= 20 Edeg] o 7 a. U1H/U1L - 4 3 UIH V - - - _ s T u p ¡cal EU] V V V - 11«I V? -0-J
|
OCR Scan
|
HD6433664FP
FCR16
HD64F3664FP
|
PDF
|
HD6433664BP
Abstract: No abstract text available
Text: Vdd 5,14 10,11 HD6433664BP OSC1 13 1 OSC2 12 FCR4.0MC5 V1H/V1L 3 V2H/V2L CL1 CL2 2 *BUILT-IN LOADING CAPACITOR CL1/CL2=30/30pF +/-20% Oscillating circuit for evaluation
|
Original
|
HD6433664BP
30/30pF
HD6433664BP
|
PDF
|
398825
Abstract: CSTCR4M00G53-R0 HD6433664BP TC4069UBP
Text: Technical Data of Ceramic Resonator MURATA Part No.: CSTCR4M00G53-R0 Applied to HD6433664 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package Ho=18mm -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm) -B0 : Bulk TOYAMA MURATA MANUFACTURING CO., LTD.
|
Original
|
CSTCR4M00G53-R0
HD6433664
180mm)
TCD-00-1409
HD6433664BP
TC4069UBP
398825
CSTCR4M00G53-R0
HD6433664BP
TC4069UBP
|
PDF
|
f 8231
Abstract: m 9625 FCR16 HD6433664BP HD64F3664BP CD 8227
Text: IC dependence of osc i11 at inq character ist ics HD6433664BP FCRI6.0M2G - S Room Temp. Udd [U] 5 item a~e HD6433664BP - 08 FCR16.0M2G Udd= 5 EU] (Fig.a~d) Ta= 20 Edeg] 0- 0 Typical a, U1H/U1L i i i i i b. U2H/U2L _ EU] 4 4 UIH V — V _ V - 0s
|
OCR Scan
|
HD6433664BP
FCR16
HD64F3664BP
f 8231
m 9625
CD 8227
|
PDF
|
ic 993
Abstract: 9931 Y HD6433664FP 48 06 ng ic cd 4015
Text: IC dependence of osc i11 at inq character ist ics HD6433664FP Room Temp. FCR4.0MC5 - S Udd [U] 5 itema~e HD6433664FP - 08 FCR4.0MC5 Ta= 20 [deg] g a. U1H/U1L EU1 UIH J 0 Typical *-» Uorst b- UIL I_ I_ I_ I_ l_
|
OCR Scan
|
HD6433664FP
ic 993
9931 Y
48 06 ng
ic cd 4015
|
PDF
|
HD6433664FP
Abstract: No abstract text available
Text: Vdd 3,12 7,8,9 HD6433664FP OSC1 11 1 OSC2 10 FCR8.0MC5 V1H/V1L 3 V2H/V2L CL1 CL2 2 *BUILT-IN LOADING CAPACITOR CL1/CL2=20/20pF +/-20% Oscillating circuit for evaluation
|
Original
|
HD6433664FP
20/20pF
HD6433664FP
|
PDF
|
HD6433664BP
Abstract: No abstract text available
Text: Vdd 5,14 10,11 HD6433664BP OSC1 13 1 OSC2 12 FCR8.0MC5 V1H/V1L 3 V2H/V2L CL1 CL2 2 *BUILT-IN LOADING CAPACITOR CL1/CL2=20/20pF +/-20% Oscillating circuit for evaluation
|
Original
|
HD6433664BP
20/20pF
HD6433664BP
|
PDF
|
4014 4021
Abstract: data sheet ic 4017 4017 data sheet ic 4017 ic 4017 K 4017 4014 bp 4166 IC 4015 IC 4017 DATASHEET ic 4017 date IC 4022
Text: Technical Data of Ceramic Resonator MURATA New Part No. * CSTLS4M00G53-B0 : MURATA Current Part No. CSTS0400MG03 : Applied to HD6433664 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)
|
Original
|
CSTLS4M00G53-B0
CSTS0400MG03
HD6433664
180mm)
TCD-00-1408
HD6433664BP
TC4069UBP
4014 4021
data sheet ic 4017
4017 data sheet ic 4017 ic 4017
K 4017
4014 bp
4166
IC 4015
IC 4017 DATASHEET
ic 4017 date
IC 4022
|
PDF
|
smd 3258
Abstract: smd 10010 CSTS1000MG03 Murata CSTS1000MG03 CSTLS10M0G53-B0 HD6433664BP TC4069UBP
Text: Technical Data of Ceramic Resonator MURATA New Part No. * CSTLS10M0G53-B0 : MURATA Current Part No. CSTS1000MG03 : Applied to HD6433664 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)
|
Original
|
CSTLS10M0G53-B0
CSTS1000MG03
HD6433664
180mm)
TCD-00-1412
HD6433664BP
TC4069UBP
smd 3258
smd 10010
CSTS1000MG03
Murata CSTS1000MG03
CSTLS10M0G53-B0
HD6433664BP
TC4069UBP
|
PDF
|
HD6433664BP
Abstract: TC74HCU04
Text: Technical Data of Ceramic Resonator MURATA Part No.: CSTLS2M00G56-B0 Applied to HD6433664 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package Ho=18mm -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm) -B0 : Bulk TOYAMA MURATA MANUFACTURING CO., LTD.
|
Original
|
CSTLS2M00G56-B0
HD6433664
180mm)
TCD-00-1406
HD6433664BP
TC74HCU04
HD6433664BP
TC74HCU04
|
PDF
|
ic 8039
Abstract: 8038 ic pdf datasheet of ic 8038 CSTLS8M00G53-B0 HD6433664BP TC4069UBP 803967
Text: Technical Data of Ceramic Resonator MURATA New Part No. * CSTLS8M00G53-B0 : MURATA Current Part No. CSTS0800MG03 : Applied to HD6433664 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)
|
Original
|
CSTLS8M00G53-B0
CSTS0800MG03
HD6433664
180mm)
TCD-00-1410
HD6433664BP
TC4069UBP
ic 8039
8038 ic
pdf datasheet of ic 8038
CSTLS8M00G53-B0
HD6433664BP
TC4069UBP
803967
|
PDF
|
C 2371
Abstract: HD6433664FP
Text: IC dependence of osc i11 at inq character ist ics HD6433664FP FCR8.0MC5 - S Room Temp. Udd [U] 5 itema~e HD6433664FP - 08 FCR8.0MC5 (Fig.a~e) Udd= 5 [U] G- 0 Typical a, U1H/U1L b. U2H/U2L 5.3 J - - 4 - - -e— r I U2L i J I I I - J aL - U2H C, FQ5C
|
OCR Scan
|
HD6433664FP
C 2371
|
PDF
|
HD6433664FP
Abstract: No abstract text available
Text: Vdd 3,12 7,8,9 HD6433664FP OSC1 11 1 OSC2 10 FCR4.0MC5 V1H/V1L 3 V2H/V2L CL1 CL2 2 *BUILT-IN LOADING CAPACITOR CL1/CL2=30/30pF +/-20% Oscillating circuit for evaluation
|
Original
|
HD6433664FP
30/30pF
HD6433664FP
|
PDF
|
|
|
sg 81
Abstract: CSACV16 HD6433664BP TC74HCU04 CSACV16M0X55J-R0 csacv16m
Text: Technical Data of Ceramic Resonator MURATA New Part No. * CSACV16M0X55J-R0 : MURATA Current Part No. CSACV16.00MXJ040 : Applied to HD6433664 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)
|
Original
|
CSACV16M0X55J-R0
CSACV16
00MXJ040
HD6433664
180mm)
TCD-00-1416
HD6433664BP
TC74HCU04
sg 81
HD6433664BP
TC74HCU04
CSACV16M0X55J-R0
csacv16m
|
PDF
|
12085
Abstract: CD4069UBE CSTLA12M0T55-B0 HD6433664BP
Text: Technical Data of Ceramic Resonator MURATA New Part No. * CSTLA12M0T55-B0 : MURATA Current Part No. CST12.0MTW : Applied to HD6433664 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)
|
Original
|
CSTLA12M0T55-B0
CST12
HD6433664
180mm)
TCD-00-1414
HD6433664BP
CD4069UBE
12085
CD4069UBE
CSTLA12M0T55-B0
HD6433664BP
|
PDF
|
HD6433664BP
Abstract: TC74HCU04
Text: Technical Data of Ceramic Resonator MURATA Part No.: CSALS16M0X55-B0 Applied to HD6433664 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package Ho=18mm -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm) -B0 : Bulk TOYAMA MURATA MANUFACTURING CO., LTD.
|
Original
|
CSALS16M0X55-B0
HD6433664
180mm)
TCD-00-1417
HD6433664BP
TC74HCU04
HD6433664BP
TC74HCU04
|
PDF
|
"Ceramic Resonator"
Abstract: HD6433664BP
Text: Renesas Technology Corp. REPORT NO. Q2001Y-268 OPERATION TEST REPORT ON TDK CERAMIC RESONATOR SINGLE-CHIP 16BIT MICROCOMPUTER HD6433664BP (FCR8.0MC5) SEP,14,2001 ELECTRONIC DEVICE BUSINESS GROUP, TDK CORPORATION 1.Contents (1) Oscillating circuit for evaluation
|
Original
|
Q2001Y-268
16BIT
HD6433664BP)
HD6433664BP
20/20pF
"Ceramic Resonator"
HD6433664BP
|
PDF
|
HD6433664FP
Abstract: No abstract text available
Text: Renesas Technology Corp. REPORT NO. Q2001Y-301 OPERATION TEST REPORT ON TDK CERAMIC RESONATOR SINGLE-CHIP 16BIT MICROCOMPUTER HD6433664FP (FCR4.0MC5) SEP,22,2001 ELECTRONIC DEVICE BUSINESS GROUP, TDK CORPORATION 1.Contents (1) Oscillating circuit for evaluation
|
Original
|
Q2001Y-301
16BIT
HD6433664FP)
HD6433664FP
30/30pF
HD6433664FP
|
PDF
|
HD6433664BP
Abstract: No abstract text available
Text: Renesas Technology Corp. REPORT NO. Q2001Y-267 OPERATION TEST REPORT ON TDK CERAMIC RESONATOR SINGLE-CHIP 16BIT MICROCOMPUTER HD6433664BP (FCR4.0MC5) SEP,14,2001 ELECTRONIC DEVICE BUSINESS GROUP, TDK CORPORATION 1.Contents (1) Oscillating circuit for evaluation
|
Original
|
Q2001Y-267
16BIT
HD6433664BP)
HD6433664BP
30/30pF
HD6433664BP
|
PDF
|
HD643366
Abstract: HD6433664FP
Text: Renesas Technology Corp. REPORT NO. Q2001Y-302 OPERATION TEST REPORT ON TDK CERAMIC RESONATOR SINGLE-CHIP 16BIT MICROCOMPUTER HD6433664FP (FCR8.0MC5) SEP,22,2001 ELECTRONIC DEVICE BUSINESS GROUP, TDK CORPORATION 1.Contents (1) Oscillating circuit for evaluation
|
Original
|
Q2001Y-302
16BIT
HD6433664FP)
HD6433664FP
20/20pF
HD643366
HD6433664FP
|
PDF
|
HD643366
Abstract: TMA 900 Hitachi DSA00276 capacitor 226 25K
Text: Hitachi Single-Chip Microcomputer H8/3664 Series H8/3664 HD6433664 H8/3663 HD6433663 H8/3662 HD6433662 H8/3661 HD6433661 H8/3660 HD6433660 H8/3664F-ZTAT HD64F3664 Hardware Manual ADE-602-202 Rev. 1.0 3/19/00 Hitachi, Ltd. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
|
Original
|
H8/3664
H8/3664
HD6433664
H8/3663
HD6433663
H8/3662
HD6433662
H8/3661
HD6433661
H8/3660
HD643366
TMA 900
Hitachi DSA00276
capacitor 226 25K
|
PDF
|
CSTCV12M0T54J-R0
Abstract: TC40H004P HD6433664BP BPSG TC40H004
Text: Technical Data of Ceramic Resonator MURATA New Part No. * CSTCV12M0T54J-R0 : MURATA Current Part No. CSTCV12.0MTJ0C4 : Applied to HD6433664 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)
|
Original
|
CSTCV12M0T54J-R0
CSTCV12
HD6433664
180mm)
TCD-00-1415
HD6433664BP
TC40H004P
CSTCV12M0T54J-R0
TC40H004P
HD6433664BP
BPSG
TC40H004
|
PDF
|
CSTCC2M00G56-R0
Abstract: HD6433664BP TC74HCU04
Text: Technical Data of Ceramic Resonator MURATA New Part No. * CSTCC2M00G56-R0 : MURATA Current Part No. CSTCC2.00MG0H6 : Applied to HD6433664 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)
|
Original
|
CSTCC2M00G56-R0
00MG0H6
HD6433664
180mm)
TCD-00-1407
ContHD6433664BP
TC74HCU04
CSTCC2M00G56-R0
HD6433664BP
TC74HCU04
|
PDF
|
