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    HDSP-2450 Search Results

    HDSP-2450 Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    54112-812102450LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    10132450-1821GLF Amphenol Communications Solutions Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing. Visit Amphenol Communications Solutions
    10132450-1411GLF Amphenol Communications Solutions Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing. Visit Amphenol Communications Solutions
    10132450-0221GLF Amphenol Communications Solutions Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing. Visit Amphenol Communications Solutions

    HDSP-2450 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    HDSP2450 Unknown Historical semiconductor price guide (US$ - 1998). From our catalog scanning project. Historical PDF
    HDSP2450TXV Unknown Historical semiconductor price guide (US$ - 1998). From our catalog scanning project. Historical PDF
    HDSP2450TXVB Unknown Historical semiconductor price guide (US$ - 1998). From our catalog scanning project. Historical PDF